Grid and nanostructure transparent conductor for low sheet resistance applications
View Patent ↗Transparent conductors and methods of forming same are provided. A transparent conductor can include a nanostructure layer and a low sheet resistance grid disposed on a transfer film surface having an acceptable level of surface roughness. The presence of the low sheet resistance grid lowers the sheet resistance of the transparent conductor to an acceptable level. After release of the transparent conductor from the transfer film, the surface roughness of the transparent conductor will be at least comparable to the surface roughness of the transfer film.
1. A method, comprising:
providing a transfer film having a transfer film surface;
forming a low sheet resistance grid on the transfer film surface according to a grid pattern;
forming a nanostructure layer on the transfer film surface; and
forming at least one isolation structure on the transfer film surface according to an isolation pattern, the at least one isolation structure patterning the transparent conductor into a plurality of electrically isolated structures;
wherein the low sheet resistance grid and the nanostructure layer form at least one coplanar transparent conductor surface.
2. The method of claim 1 wherein forming the nanostructure layer on the transfer film surface comprises forming the nanostructure layer on the transfer film surface according to a nanostructure layer pattern.
3. The method of claim 2 wherein forming the nanostructure layer on the transfer film surface according to a nanostructure layer pattern comprises direct printing a nanostructure layer on the transfer film surface.
4. The method of claim 1 , further comprising:
exposing the coplanar transparent conductor surface formed by the low sheet resistance grid and the nanostructure layer by removing the transfer film.
5. The method of claim 1 wherein forming the low sheet resistance grid on the transfer film surface according to the grid pattern comprises an overall deposition of a conductive metal followed by a removal via post-patterning of at least a portion of the deposited metal.
6. The method of claim 1 wherein the nanostructure layer comprises a plurality of conductive metallic nanowires dispersed within a polymer matrix.
7. The method of claim 1 wherein the nanostructure layer comprises a plurality of light-scattering particles.
8. The method of claim 1 wherein the nanostructure layer comprises a plurality of light-directing structures.
9. The method of claim 1 wherein the low sheet resistance grid and the nanostructure layer have a sheet resistance of less than about 5 ohms/sq.
10. The method of claim 1 wherein the low sheet resistance grid and the nanostructure layer have a sheet resistance of less than about 0.1 ohm/sq.
11. The method of claim 1 , further comprising:
forming a layer proximate the nanostructure layer, the layer including at least one layer selected from the group consisting of: a smoothing layer, a hole transport layer, a hole injection layer, an electron transport layer, and an electron injection layer.
12. A method, comprising:
providing a transfer film having a transfer film surface;
forming a low sheet resistance grid on the transfer film surface according to a grid pattern; and
forming a nanostructure layer on the transfer film surface; wherein the low sheet resistance grid and the nanostructure layer form at least one coplanar transparent conductor surface, and wherein
the transfer film surface has a surface roughness of less than 50 nanometers peak-to-peak; and
the coplanar transparent conductor surface has a surface roughness of less than 50 nanometers peak-to-peak.
13. The method of claim 1 wherein
the transfer film surface has a surface roughness of less than 50 nanometers peak-to-peak; and
the coplanar transparent conductor surface and the at least one isolation structure forming a coplanar surface having a surface roughness of less than 50 nanometers peak-to-peak.
14. The method of claim 1 , further comprising:
forming an planarizing layer at least partially on the low sheet resistance grid and nanostructure layer opposite the transfer film surface.
15. The method of claim 14 wherein forming the planarizing layer comprises depositing the planarizing layer according to a planarizing layer pattern.
16. The method of claim 14 wherein the planarizing layer comprises an adhesive material.
17. The method of claim 14 wherein the planarizing layer comprises a material to smoothen a surface formed by the low sheet resistance grid and the nanostructure layer opposite the transfer film.
18. The method of claim 14 , further comprising affixing the transparent conductor to a substrate via the planarizing layer.
19. The method of claim 14 , further comprising:
removing a protective film layer disposed on the planarizing layer; and
affixing the transparent conductor to a substrate.