Patent Assignment
Reel/Frame 040322/0944
Assignment of Assignor's Interest
Recorded: 2016-10-12
Pages: 11
Assignor
CHAMP GREAT INTERNATIONAL CORPORATION
Executed: 2016-09-09
Assignee
CAM HOLDING CORPORATION
PALM GROVE HOUSE, P.O. BOX 438, ROAD TOWN, TORTOLA, VIRGIN ISLANDS, BRITISH
Covered Properties
(63)
Tandem Organic Photovoltaic Devices That Include a Metallic Nanostructure Recombination Layer
PCT:
PCT/US2014/014263 ↗
Improved Light Stability of Nanowire-Based Transparent Conductors
PCT:
PCT/US2015/021851 ↗
Methods of Controlling Nanowire Morphology
PCT:
PCT/US2015/025485 ↗
Short-Chain Fluorosurfactants with Iodide Additives for Forming Silver Nanowire-Based Transparent Conductive Films
PCT:
PCT/US2015/059240 ↗
Transparent Conductors Comprising Metal Nanowires
Systems, Devices, and Methods for Controlling Electrical and Optical Properties of Transparent Conductors
Functional Films Formed by Highly Oriented Deposition of Nanowires
Application:
11/871,721 →
Publication:
US 2009/0052029
Nanowire-Based Transparent Conductors and Applications Thereof
Nanowires-Based Transparent Conductors
Nanowires-Based Transparent Conductors
Systems and Methods for Filtering Nanowires
Application:
12/105,525 →
Publication:
US 2009/0321364
Composite Transparent Conductors and Methods of Forming the Same
High Contrast Transparent Conductors and Methods of Forming the Same
Application:
12/106,244 →
Publication:
US 2009/0321113
Methods and compositions for ink jet deposition of conductive features
Method and composition for screen printing of conductive features
Nanowire-Based Transparent Conductors and Applications Thereof
Reliable and Durable Conductive Films Comprising Metal Nanostructures
Application:
12/773,734 →
Publication:
US 2010/0307792
Contact Resistance Measurement for Resistance Linearity in Nanostructure Thin Films
Application:
12/862,548 →
Publication:
US 2011/0042126
Purification of Metal Nanostructures for Improved Haze in Transparent Conductors Made from the Same
Methods for Controlling Metal Nanostructures Morphology
Nanowire-Based Transparent Conductors and Applications Thereof
Reliable and Durable Conductive Films Comprising Metal Nanostructures
Application:
12/908,730 →
Publication:
US 2011/0024159
Systems, Devices, and Methods for Controlling Electrical and Optical Properties of Transparent Conductors
Nanostructure-Based Transparent Conductors Having Increased Haze and Devices Comprising the Same
Transparent Conductors Comprising Metal Nanowires
Low-Haze Transparent Conductors
Photosensitive Ink Compositions and Transparent Conductors and Method of Using the Same
Methods of Controlling Nanostructure Formations and Shapes
Etch Patterning of Nanostructure Transparent Conductors
Composite Transparent Conductors and Methods of Forming the Same
Nanowire-Based Transparent Conductors and Applications Thereof
Nanowire Ink Compositions and Printing of Same
Application:
13/278,733 →
Publication:
US 2012/0097059
Coating Compositions for Forming Nanocomposite Films
Application:
13/286,437 →
Publication:
US 2012/0104374
Grid and Nanostructure Transparent Conductor for Low Sheet Resistance Applications
Application:
13/287,881 →
Publication:
US 2012/0103660
Method of Tuning Work Function of Metal Nanostructure-Based Transparent Conductor
Anisotropy Reduction in Coating of Conductive Films
Reliable and Durable Conductive Films Comprising Metal Nanostructures
Application:
13/606,938 →
Publication:
US 2013/0001478
Opto-Electrical Devices Incorporating Metal Nanowires
System and Methods of Reducing Diffuse Reflection of an Optical Stack
Application:
13/667,556 →
Publication:
US 2013/0115371
Methods for Reducing Diffuse Reflection of Nanostructure-Based Transparent Conductive Films and Touch Panels Made of the Same
Conductive Films Having Low-Visibility Patterns and Methods of Producing the Same
Methods for Reducing Diffuse Reflection of Nanostructure-Based Transparent Conductive Films and Touch Panels Made of the Same
System and Methods of Reducing Diffuse Reflection of an Optical Stack
Application:
13/831,351 →
Publication:
US 2014/0272105
Electrical Contacts in Layered Structures
Methods to Incorporate Silver Nanowire-Based Transparent Conductors in Electronic Devices
Low-Haze Transparent Conductors
Methods for Controlling Metal Nanostructures Morphology
Application:
13/946,848 →
Publication:
US 2013/0298732
Purification of Metal Nanostructures for Improved Haze in Transparent Conductors Made from the Same
Application:
14/021,791 →
Publication:
US 2014/0001418
Opto-Electrical Devices Incorporating Metal Nanowires
Two-Sided Laser Patterning on Thin Film Substrates
Application:
14/161,310 →
Publication:
US 2014/0202742
Nanostructure Transparent Conductors Having High Thermal Stability for Esd Protection
Application:
14/161,319 →
Publication:
US 2014/0202738
Methods to Incorporate Silver Nanowire-Based Transparent Conductors in Electronic Devices
Hybrid Patterned Nanostructure Transparent Conductors
Application:
14/208,536 →
Publication:
US 2014/0262443
Methods of Controlling Nanostructure Formations and Shapes
Conductive Nanostructure-Based Films with Improved Esd Performance
Nanowire-Based Transparent Conductors and Applications Thereof
Silver Nanostructure-Based Optical Stacks and Touch Sensors with Uv Protection
Light Stability of Nanowire-Based Transparent Conductors
Methods of Controlling Nanowire Morphology
Grid and Nanostructure Transparent Conductor for Low Sheet Resistance Applications
Opto-Electrical Devices Incorporating Metal Nanowires
Electrical Contacts in Layered Structures
Transparent Conductors Comprising Metal Nanowires
Application:
90/013,509 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2006
From: ALDEN, JONATHAN S.; DAI, HAIXIA; KNAPP, MICHAEL R.; NA, SHUO
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 018575/0198 →
Assignment of Assignor's Interest
Feb 26, 2008
From: ALLEMAND, PIERRE-MARC; DAI, HAIXIA; NA, SHUO; PAKBAZ, HASH
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 020563/0332 →
Assignment of Assignor's Interest
Feb 26, 2008
From: DAI, HAIXIA; HEIDECKER, MANFRED; NG, BENNY CHUN HEI; PAKBAZ, HASH
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 020561/0034 →
Assignment of Assignor's Interest
May 1, 2008
From: WOLK, JEFFREY; DAI, HAIXIA; QUAN, XINA; SPAID, MICHAEL A.
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 020889/0032 →
Assignment of Assignor's Interest
Jul 7, 2008
From: JONES, DAVID; PSCHENITZKA, FLORIAN; QUAN, XINA; SPAID, MICHAEL A.
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 021201/0040 →
Assignment of Assignor's Interest
Aug 11, 2008
From: ALLEMAND, PIERRE-MARC; HEIDECKER, MANFRED; SPAID, MICHAEL A.; DAI, HAIXIA
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 021369/0366 →
Assignment of Assignor's Interest
Aug 28, 2008
From: SPAID, MICHAEL A.; HEIDECKER, MANFRED; ALLEMAND, PIERRE-MARC; WALLACE, FRANK
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 021457/0349 →
Security Agreement
Oct 3, 2008
From: CAMBRIOS TECHNOLOGIES CORPORATION
To: SILICON VALLEY BANK
Reel/Frame 021633/0172 →
Assignment of Assignor's Interest
May 12, 2009
From: WINOTO, ADRIAN
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 022691/0116 →
Assignment of Assignor's Interest
Jul 31, 2009
From: WINOTO, ADRIAN
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 023053/0510 →
Assignment of Assignor's Interest
Aug 18, 2010
From: ALLEMAND, PIERRE-MARC; PSCHENITZKA, FLORIAN; RAMOS, TERESA; SEPA, JELENA
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 024856/0578 →
Assignment of Assignor's Interest
Oct 26, 2010
From: SPAID, MICHAEL; PSCHENITZKA, FLORIAN
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 025198/0550 →
Assignment of Assignor's Interest
Nov 5, 2010
From: ALLEMAND, PIERRE-MARC
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 025327/0659 →
Assignment of Assignor's Interest
Nov 16, 2010
From: BHATIA, RIMPLE; SEPA, JELENA; WALLACE, FRANK
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 025373/0603 →
Assignment of Assignor's Interest
Mar 23, 2011
From: ALLEMAND, PIERRE-MARC; DAI, HAIXIA; NA, SHUO; PAKBAZ, HASH
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 026005/0603 →
Release
Jul 21, 2011
From: SILICON VALLEY BANK
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 026632/0532 →
Assignment of Assignor's Interest
Jan 17, 2014
From: ALDEN, JONATHAN S.; DAI, HAIXIA; KNAPP, MICHAEL R.; NA, SHUO
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 031998/0929 →
Assignment of Assignor's Interest
Jan 17, 2014
From: ALLEMAND, PIERRE-MARC; DAI, HAIXIA; NA, SHUO; PAKBAZ, HASH
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 031999/0434 →
Assignment of Assignor's Interest
Jan 17, 2014
From: ALDEN, JONATHAN S.; DAI, HAIXIA; KNAPP, MICHAEL R.; NA, SHUO
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 031999/0044 →
Lien
Feb 10, 2016
From: CAMBRIOS TECHNOLOGIES CORPORATION
To: SEED IP LAW GROUP PLLC
Reel/Frame 037760/0806 →
Release of Lien
Mar 17, 2016
From: SEED IP LAW GROUP PLLC
To: CAMBRIOS TECHNOLOGIES CORPORATION
Reel/Frame 038146/0630 →
Assignment of Assignor's Interest
Mar 29, 2016
From: CAMBRIOS TECHNOLOGIES CORPORATION
To: CHAMP GREAT INT'L CORPORATION
Reel/Frame 038295/0845 →
Change of Name
Sep 30, 2018
From: CAM HOLDING CORPORATION
To: CAMBRIOS FILM SOLUTIONS CORPORATION
Reel/Frame 048172/0510 →
Security Interest
Oct 24, 2018
From: CAMBRIOS FILM SOLUTIONS CORPORATION
To: INVENTIVE POWER LIMITED
Reel/Frame 047297/0351 →
Change of Name
Nov 13, 2018
From: CAM HOLDING CORPORATION
To: CAMBRIOS FILM SOLUTIONS CORPORATION
Reel/Frame 047508/0135 →