Electrical contacts in layered structures
View Patent ↗Provided herein are layered structures and methods for forming the same, the layered structures including a conductive layer and an overcoat layer formed on a surface thereof, one or more electrical contacts formed on the surface of the conductive layers and via openings extending through the overcoat layer and reaching the electrical contacts.
1. A method of forming a layered structure, the method comprising:
providing a conductive layer on a substrate, the conductive layer having a surface opposite from the substrate and including a plurality of networking conductive nanostructures;
forming one or more electrical contacts on the surface of the conductive layer and including a plurality of conductive nanoparticles;
forming an overcoat layer over the one or more electrical contacts, the overcoat layer contacting the surface of the conductive layer uncovered by the one or more electrical contacts; and
providing one or more via holes in the overcoat layer, the one or more via holes extending through the overcoat layer and reaching at least some of the one or more electrical contacts.
2. The method of claim 1 wherein forming the overcoat layer comprises depositing and curing an overcoat material.
3. The method of claim 2 wherein the overcoat material is a reflowable polymer.
4. The method of claim 3 wherein the reflowable polymer includes at least one material selected from the group consisting of poly(methyl methacrylate), a dissolved powder coating resin, a copolymer of methyl methacrylate, a hydroxyl functional monomer, a carboxylate functional monomer, an amine monomer, and an epoxy monomer.
5. The method of claim 2 wherein forming the one or more via holes comprises laser ablating the overcoat layer at predetermined locations.
6. The method of claim 2 wherein forming the one or more via holes comprises dewetting the overcoat material at the one or more electrical contacts.
7. The method of claim 1 wherein forming the overcoat layer comprises overlaying a functional film on the surface of the conductive layer.
8. The method of claim 7 wherein forming the one or more via holes comprises pre-cutting the functional film at predetermined locations prior to overlaying the functional film on the surface of the conductive layer.
9. The method of claim 1 wherein forming the one or more electrical contacts comprises spot-depositing a formulation having the plurality of conductive nanoparticles on the surface of the conductive layer.
10. The method of claim 1 further comprising forming one or more electrical conduits through the one or more via holes, wherein the one or more electrical conduits contact the one or more electrical contacts.
11. The method of claim 10 wherein the one or more electrical conduits are conductive wires, conductive adhesive or solder.
12. The method of claim 1 wherein the plurality of networking conductive nanostructures includes silver nanowires, carbon nanotubes or a combination thereof.
13. A layered structure formed by the method of claim 1 .
14. A layered structure comprising:
a substrate;
a conductive layer formed on the substrate, the conductive layer including a plurality of networking conductive nanostructures, wherein the conductive layer has a surface opposite from the substrate;
one or more electrical contacts on the surface of the conductive layer and including a plurality of conductive nanoparticles;
an overcoat layer overlying the conductive layer, wherein the overcoat layer contacts the surface uncovered by the one or more electrical contacts; and
one or more via holes extending through the overcoat layer and reaching the one or more electrical contacts.
15. The layered structure of claim 14 wherein the plurality of networking conductive nanostructures includes silver nanowires, carbon nanotubes or a combination thereof.
16. The layered structure of claim 14 wherein the overcoat layer is a reflowable polymer or a functional film.
17. The layered structure of claim 16 wherein the reflowable polymer is a polymer or copolymer comprising acrylate monomers represented by the following formula:
wherein, R 1 is hydrogen or alkyl,
L is a direct bond, an alkylene chain or an alkylene oxide chain, and
R 2 is hydrogen, hydroxyl, amino (including mono-, di-substituted amino), glycidyl, substituted or unsubstituted alkyl, and substituted or unsubstituted aryl.
18. The layered structure of claim 14 further comprising one or more electrical conduits extending into the one or more via holes and contacting the one or more electrical contacts.