IP Library Granted Patent US 10,168,233
Granted Patent B2
US 10,168,233 · App. 14/707,951 · Granted Jan 1, 2019

Semiconductor device including sensor

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Quick Facts
Patent No.
US 10,168,233
App. No.
14/707,951
Granted
Jan 1, 2019
Kind
B2
Abstract

Disclosed here is an apparatus that includes a sensor including a plurality of sense nodes, a plurality of first latch circuits including a plurality of first input nodes and a plurality of first output nodes, respectively, the plurality of first input nodes coupled to the plurality of sense nodes, respectively, a plurality of second latch circuits including a plurality of second input nodes and a plurality of second output nodes, respectively, the plurality of second input nodes coupled to the plurality of first output nodes, respectively, and a selector including a plurality of third input nodes coupled respectively to the plurality of first output nodes, a plurality of fourth input nodes coupled respectively to the plurality of second output nodes and a plurality of third output nodes.

Claims (18)

1. An apparatus comprising:

a sensor including a plurality of sense nodes;

a plurality of first latch circuits including a plurality of first input nodes and a plurality of first output nodes, respectively, the plurality of first input nodes coupled to the plurality of sense nodes, respectively;

a plurality of second latch circuits including a plurality of second input nodes and a plurality of second output nodes, respectively, the plurality of second input nodes coupled to the plurality of first output nodes, respectively; and

a selector including a plurality of third input nodes coupled respectively to the plurality of first output nodes, a plurality of fourth input nodes coupled respectively to the plurality of second output nodes and a plurality of third output nodes.

2. The apparatus of claim 1 , further comprising a plurality of delay circuits between the plurality of first output nodes and the plurality of second input nodes, respectively.

3. The apparatus of claim 2 , further comprising a plurality of third latch circuits including a plurality of fifth input nodes coupled to the plurality of third output nodes, respectively and a plurality of fourth output nodes.

4. The apparatus of claim 3 , further comprising a plurality of external terminals and a plurality of data output buffers coupled between the fourth output nodes and the plurality of external terminals, respectively.

5. The apparatus of claim 3 , wherein the sensor further includes a monitoring node from which a monitoring signal which logic level is changed responsive to a state of the sensor, the apparatus further comprising a selector control circuit including a sixth input node coupled to the monitoring node, a seventh input node and a fifth output node coupled to the selector.

6. The apparatus of claim 5 , the apparatus further comprising a command decoder and a logic circuit including an eighth input node coupled to an output node of the command decoder and a sixth output node coupled to the seventh input node.

7. The apparatus of claim 6 , wherein the logic circuit further includes a seventh output node coupled in common to control gates of the third latch circuits.

8. The apparatus of claim 1 , further comprising an oscillator coupled to the sensor, the oscillator configured to provide an oscillation signal to activate the sensor intermittently in accordance with a cycle of the oscillation signal.

9. The apparatus of claim 7 , wherein the logic circuit is configured to provide a first control signal in common to the control gates of the third latch circuits after providing a second control signal to the seventh input node.

10. The apparatus of claim 9 , wherein the logic circuit is configured to provide the second control signal responsive to receiving a mode register read command at the eighth input node.

11. The apparatus of claim 1 , wherein the sensor is a temperature sensor configured to provide a temperature measurement to the plurality of sense nodes, and wherein the plurality of first latch circuits and the plurality of second latch circuits are configured to latch the temperature measurement.

12. The apparatus of claim 1 , further comprising a control circuit coupled to the selector and to the plurality of second latch circuits, the control circuit configured to provide a first control signal, and wherein the temperature sensor is configured to provide a second control signal and a monitoring signal.

13. The apparatus of claim 12 , wherein the plurality of first latch circuits is configured to latch a measurement provided on the plurality of sense nodes in response to the second control signal, the plurality of second latch circuits are configured to latch the measurement provided by the plurality of first latch circuits in response to the first command signal, and the selector is configured to output the measurement provided by the plurality of first latch circuits or the plurality of second latch circuits in response to the first control signal and the monitoring signal.

14. The apparatus of claim 12 , wherein the control circuit is command decoder of a memory, and the first control signal is a mode register read command.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: FURUTANI, KIYOHIRO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 035600/0816 →