Thin film encapsulation for thin film batteries and other devices
View Patent ↗An electrochemical device is claimed and disclosed, including a method of manufacturing the same, comprising an environmentally sensitive material, such as, for example, a lithium anode; and a plurality of alternating thin metallic and ceramic, blocking sub-layers. The multiple metallic and ceramic, blocking sub-layers encapsulate the environmentally sensitive material. The device may include a stress modulating layer, such as for example, a Lipon layer between the environmentally sensitive material and the encapsulation layer.
1. An electrochemical device comprising:
an environmentally sensitive layer; and
an encapsulation layer deposited over the environmentally sensitive layer, wherein the encapsulation layer includes at least one electrically conductive area and at least one electrically insulating area, wherein the electrically conductive area of the encapsulation layer comprises a plurality of metallic sub-layers or a plurality of conductive ceramic sub-layers and serves as an electrical terminal of the electrochemical device, and wherein the electrically insulating area of the encapsulation layer comprises a plurality of non-conductive ceramic sub-layers and is electrically insulating.
2. The electrochemical device of claim 1 , wherein the metallic sub-layers comprise at least one element selected from the group consisting of:
scandium, yttrium, lanthanum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, zinc, boron, aluminum, carbon, silicon, germanium, beryllium, magnesium, calcium, strontium, barium, lithium, sodium, potassium, rubidium, and caesium.
3. The electrochemical device of claim 1 , wherein the non-conductive ceramic sub-layers comprise nitrides of at least one element selected from the group consisting of:
scandium, yttrium, lanthanum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, zinc, boron, aluminum, carbon, silicon, germanium, beryllium, magnesium, calcium, strontium, barium, lithium, sodium, potassium, rubidium, and caesium.
4. The electrochemical device of claim 1 , wherein the non-conductive ceramic sub-layers comprise oxides of at least one element selected from the group consisting of:
scandium, yttrium, lanthanum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, zinc, boron, aluminum, carbon, silicon, germanium, beryllium, magnesium, calcium, strontium, barium, lithium, sodium, potassium, rubidium, and caesium.
5. The electrochemical device of claim 1 , wherein the non-conductive ceramic sub-layers comprise carbides of at least one element selected from the group consisting of:
scandium, yttrium, lanthanum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, zinc, boron, aluminum, silicon, germanium, beryllium, magnesium, calcium, strontium, barium, lithium, sodium, potassium, rubidium, and caesium.
6. The electrochemical device of claim 1 , wherein the non-conductive ceramic sub-layers comprise silicides of at least one element selected from the group consisting of:
scandium, yttrium, lanthanum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, zinc, boron, aluminum, carbon, germanium, beryllium, magnesium, calcium, strontium, barium, lithium, sodium, potassium, rubidium, and caesium.
7. The electrochemical device of claim 1 , wherein the non-conductive ceramic sub-layers comprise borides of at least one element selected from the group consisting of:
scandium, yttrium, lanthanum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, zinc, aluminum, carbon, silicon, germanium, beryllium, magnesium, calcium, strontium, barium, lithium, sodium, potassium, rubidium, and caesium.
8. The electrochemical device of claim 1 , wherein the environmentally sensitive layer comprises at least one material selected from the group consisting of:
lithium alloy, lithium solid solution, metallic lithium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, zirconium, niobium, molybdenum, palladium, silver, hafnium, tantalum, tungsten, iridium, platinum, gold, beryllium, magnesium, calcium, strontium, barium, boron, aluminum, indium, carbon, silicon, germanium, tin, lead, phosphorus, arsenic, antimony, and bismuth.
9. The electrochemical device of claim 1 , wherein at least one sub-layer of the encapsulation layer is deposited using sputtering from a metallic target.
10. The electrochemical device of claim 1 , wherein at least one sub-layer of the encapsulation layer is deposited using a dual sputter cathode deposition method.
11. The electrochemical device of claim 1 , wherein the encapsulation layer is flexible.
12. The electrochemical device of claim 1 , wherein a total thickness of every metallic sub-layer and every conductive ceramic sub-layer in the electrically conductive area is less than about 5 μm.
13. An electrochemical device comprising:
a cathode;
an electrolyte deposited on the cathode;
an environmentally sensitive anode deposited on the electrolyte;
a modulating layer on the anode; and
an encapsulation layer on the modulating layer, wherein the encapsulation layer includes at least one electrically conductive area and at least one electrically insulating area, wherein the electrically conductive area of the encapsulation layer comprises a plurality of metallic sub-layers or a plurality of conductive ceramic sub-layers and serves as an electrical terminal of the electrochemical device, and wherein the electrically insulating area of the encapsulation layer comprises a plurality of non-conductive ceramic sub-layers and is electrically insulating.
14. The electrochemical device of claim 13 , wherein the total thickness of every metallic sub-layer and every conductive ceramic sub-layer in the electrically conductive area is less than about 5 μm.
15. An electrochemical device comprising:
a cathode greater than 0.5 μm and less than 200 μm thick;
an electrolyte less than 5 μm thick;
an anode greater than about 0.1 μm and less than 30 μm thick;
an encapsulation layer over the anode, wherein the encapsulation layer includes at least one electrically conductive area and at least one electrically insulating area, wherein the electrically conductive area of the encapsulation layer comprises a plurality of metallic sub-layers and a plurality of conductive ceramic sub-layers and serves as an electrical terminal of the electrochemical device, and wherein the electrically insulating area of the encapsulation layer comprises a plurality of non-conductive ceramic sub-layers and is electrically insulating.
16. The electrochemical device of claim 15 , wherein the electrically conductive area includes at least two metallic sub-layers and at least two conductive ceramic sub-layers.
17. The electrochemical device of claim 16 , wherein a total thickness of every metallic sub-layer and every conductive ceramic sub-layer in the electrically conductive area is less than about 5 μm.
18. The electrochemical device of claim 1 , wherein the encapsulation layer includes a selectively conductive pattern having the electrically conductive area lateral to the electrically insulating area.
19. The electrochemical device of claim 13 , wherein the encapsulation layer includes a selectively conductive pattern having the electrically conductive area lateral to the electrically insulating area.
20. The electrochemical device of claim 15 , wherein the encapsulation layer includes a selectively conductive pattern having the electrically conductive area lateral to the electrically insulating area.