Light emitting device package
Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.
1. A light emitting device package comprising:
a package body having a top-opened cavity disposed in at least a portion thereof;
a first electrode layer electrically isolated from the package body with an insulating layer interposed between the first electrode layer and package body, and a second electrode layer electrically isolated from the package body with the insulating layer interposed between the second electrode layer and package body, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity;
a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity; and
a thermo sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device,
wherein a bottom surface of the thermo sensor includes a first area coming into contact with the package body, and a second area facing the bottom surface of the cavity,
wherein the thermo sensor is located on top of one of the electrode layers,
wherein the first electrode layer and the second electrode layer are disposed on a side surface of the cavity,
wherein the second area of the thermo sensor is separated from the side surface of the cavity, and
wherein an upper surface of the first electrode layer and an upper surface of the second electrode layer are exposed on the side surface of the cavity.
2. The package according to claim 1 , wherein the thermo sensor is configured to measure a temperature of the light emitting device.
3. The package according to claim 1 , wherein the thermo sensor includes a heat sensing portion and an electrode pad.
4. The package according to claim 3 , wherein the heat sensing portion and the electrode pad come into contact with each other with a heat transfer portion interposed therebetween.
5. The package according to claim 3 , wherein the heat transfer portion comprises titanium (Ti), and a thickness of the heat transfer portion is within a range of 25 nm to 100 nm.
6. The package according to claim 3 , wherein the heat sensing portion comprises nickel (Ni), and a thickness of the heat sensing portion is within a range of 100 nm to 500 nm.
7. The package according to claim 3 , wherein the electrode pad comprises aluminum (Al), and a thickness of the electrode pad is within a range of 100 nm to 500 nm.
8. The package according to claim 1 , wherein a size of the thermo sensor is within a range of 0.3 μm to 1 μm.
9. The package according to claim 1 , wherein the thermo sensor is fabricated by a growth process which integrates the thermo sensor with the package body.
10. The package according to claim 1 , wherein the cavity is at least a partial depressed portion of the package body, the package body includes a raised portion around the open region of the cavity, and the thermo sensor is placed on the raised portion.
11. The package according to claim 1 , wherein the cavity has one of a polygonal, circular, or oval cross section.
12. The package according to claim 1 , wherein the area of the top of the cavity is greater than the area of the bottom surface.
13. The package according to claim 1 , wherein the insulating layer includes at least one of silicon oxide (SiO 2 ), silicon nitride (Si 3 N 4 ), aluminum nitride (AlN), or silicon carbide (SiC).
14. A light emitting device package comprising:
a package body having a top-opened cavity disposed in at least a portion thereof;
a first electrode layer electrically isolated from the package body with an insulating layer interposed between the first electrode layer and package body, and a second electrode layer electrically isolated from the package body with the insulating layer interposed between the second electrode layer and package body, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity;
a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity; and
a thermo sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device,
wherein the cavity is at least a partial depressed portion of the package body, the package body includes a raised portion around the open region of the cavity, and the thermo sensor is placed on the raised portion,
wherein a bottom surface of the thermo sensor includes a first area coming into contact with the package body, and a second area facing the bottom surface of the cavity,
wherein the thermo sensor is located on top of one of the electrode layers,
wherein the first electrode layer and the second electrode layer are disposed on a side surface of the cavity,
wherein the second area of the thermo sensor is separated from the side surface of the cavity, and
wherein an upper surface of the first electrode layer and an upper surface of the second electrode layer are exposed on the side surface of the cavity.
15. The package according to claim 14 , wherein the thermo sensor includes a heat sensing portion and an electrode pad.
16. The package according to claim 15 , wherein the heat sensing portion and the electrode pad come into contact with each other with a heat transfer portion interposed therebetween.
17. The package according to claim 14 , wherein the area of the top of the cavity is greater than the area of the bottom surface.
18. The package according to claim 14 , wherein the thermo sensor is fabricated by a growth process which integrates the thereto sensor with the package body.
19. A light emitting device package comprising:
a package body having a top-opened cavity disposed in at least a portion thereof;
a first electrode layer electrically isolated from the package body with an insulating layer interposed between the first electrode layer and package body, and a second electrode layer electrically isolated from the package body with the insulating layer interposed between the second electrode layer and package body, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity;
a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity; and
a thermo sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device, the thermo sensor fabricated by a growth process which integrates the thermo sensor with the package body,
wherein the cavity is at least a partial depressed portion of the package body, the package body includes a raised portion around the open region of the cavity, and the thermo sensor is placed on the raised portion,
wherein the area of the top of the cavity is greater than the area of the bottom surface,
wherein a bottom surface of the thermo sensor includes a first area coming into contact with the package body, and a second area facing the bottom surface of the cavity,
wherein the thermo sensor is located on top of one of the electrode layers,
wherein the first electrode layer and the second electrode layer are disposed on a side surface of the cavity,
wherein the second area of the thermo sensor is separated from the side surface of the cavity, and
wherein an upper surface of the first electrode layer and an upper surface of the second electrode layer are exposed on the side surface of the cavity.