Imaging device including semiconductor substrate and unit pixel cell
View Patent ↗An imaging device includes a semiconductor substrate and at least one unit pixel cell provided to a surface of the semiconductor substrate. Each of the at least one unit pixel cell includes: a photoelectric converter including a pixel electrode and a photoelectric conversion layer located on the pixel electrode, the photoelectric converter converting incident light into electric charges; a charge detection transistor that includes a part of the semiconductor substrate and detects the electric charges; and a reset transistor that includes a gate electrode and initializes a voltage of the photoelectric converter. The pixel electrode is located above the charge detection transistor. The reset transistor is located between the charge detection transistor and the pixel electrode. When viewed from a direction normal to the surface of the semiconductor substrate, at least a part of the gate electrode is located outside the pixel electrode.
1. An imaging device comprising:
a semiconductor substrate; and
at least one unit pixel cell provided to a surface of the semiconductor substrate, each of the at least one unit pixel cell including:
a photoelectric converter that includes a pixel electrode and a photoelectric conversion layer located on the pixel electrode, the photoelectric converter converting incident light into electric charges;
a charge detection transistor that includes a part of the semiconductor substrate and detects the electric charges; and
a reset transistor that includes a gate electrode and initializes a voltage of the photoelectric converter, wherein
the pixel electrode, the reset transistor, and the charge detection transistor are arranged in that order toward the semiconductor substrate from the pixel electrode in cross sectional view, the reset transistor is included in one of the at least one unit pixel cell, and when viewed from the direction normal to the surface of the semiconductor substrate, at least a part of the gate electrode of the reset transistor is not covered by the pixel electrode of the photoelectric convertor included in the one of the at least one unit pixel cell,
a first unit pixel cell and a second unit pixel cell are directly adjacent to each other, and
when viewed from the direction normal to the surface of the semiconductor substrate, at least a part of the gate electrode included in the first unit pixel cell overlaps the pixel electrode included in the second unit pixel cell.
2. The imaging device according to claim 1 , wherein
the part of the semiconductor substrate comprises a first semiconductor,
the reset transistor includes at least a part of a semiconductor layer, the at least a part of the semiconductor layer comprising a second semiconductor, and
a band gap of the second semiconductor is larger than a band gap of the first semiconductor.
3. The imaging device according to claim 1 , wherein
the reset transistor includes a source electrode and a drain electrode, and
the charge detection transistor is connected to the pixel electrode and one of the source electrode and the drain electrode.
4. The imaging device according to claim 1 , wherein
a first unit pixel cell and a second unit pixel cell are directly adjacent to each other, and
when viewed from the direction normal to the surface of the semiconductor substrate, at least a part of the gate electrode included in the first unit pixel cell is closer to the pixel electrode included in the second unit pixel cell than the pixel electrode included in the first unit pixel cell.
5. The imaging device according to claim 1 , wherein
each of the at least one unit pixel cell further includes a light shielding film having a light shielding property, and
when viewed from the direction normal to the surface of the semiconductor substrate, the light shielding film is located in a position continuous with the pixel electrode, at least a part of the gate electrode overlapping the light shielding film.
6. The imaging device according to claim 1 , wherein
the reset transistor includes at least a part of a semiconductor layer,
the photoelectric converter is located above the surface of the semiconductor substrate through a multilayer interconnection structure, the multilayer interconnection structure including a first interconnection layer and a second interconnection layer, the first interconnection layer being closer to the semiconductor substrate than the second interconnection layer is, and
the semiconductor layer is located above the first interconnection layer.
7. The imaging device according to claim 6 , wherein the upper interconnection layer is an uppermost layer of the multilayer interconnection structure.
8. The imaging device according to claim 1 , wherein the gate electrode of the reset transistor is closer to the pixel electrode than the semiconductor substrate.
9. The imaging device according to claim 1 , wherein the gate electrode of the reset transistor directly faces the pixel electrode through an insulating layer.