Cleaning composition and cleaning method
A cleaning composition includes (A) at least one compound selected from the group consisting of a fatty acid that includes a hydrocarbon group having 8 to 20 carbon atoms, a phosphonic acid that includes a hydrocarbon group having 3 to 20 carbon atoms, a sulfuric acid ester that includes a hydrocarbon group having 3 to 20 carbon atoms, an alkenylsuccinic acid that includes a hydrocarbon group having 3 to 20 carbon atoms, and salts thereof, (B) an organic acid, (C) a water-soluble amine, (D) a water-soluble polymer, and an aqueous medium, the cleaning composition having a pH of 9 or more.
1. A cleaning composition comprising:
(A) at least one compound selected from the group consisting of a fatty acid that includes a hydrocarbon group having 8 to 20 carbon atoms, an alkenylsuccinic acid that includes a hydrocarbon group having 3 to 20 carbon atoms, and salts thereof;
(B) an organic acid;
(C) a water-soluble amine;
(D) a water-soluble polymer; and
an aqueous medium,
the cleaning composition having a pH of 9.2 or more,
wherein a content of component (A) in the cleaning composition is 0.0001 to 0.1 mass %, based on a total mass of the cleaning composition,
wherein a content of component (B) in the cleaning composition is 0.0001 to 0.1 mass %, based on a total mass of the cleaning composition,
wherein a content of component (C) in the cleaning composition is 0.0001 to 0.1 mass %, based on a total mass of the cleaning composition,
wherein a content of component (D) in the cleaning composition is 0.0001 to 1 mass %, based on a total mass of the cleaning composition, and
wherein the cleaning composition is suitable for cleaning a wiring board.
2. The cleaning composition according to claim 1 ,
wherein the component (B) is an amino acid.
3. The cleaning composition according to claim 2 ,
wherein the amino acid is at least one amino acid selected from the group consisting of tryptophan, phenylalanine, arginine, and histidine.
4. The cleaning composition according to claim 1 ,
wherein the component (C) is an alkanolamine.
5. The cleaning composition according to claim 1 ,
wherein the component (D) is at least one water-soluble polymer selected from the group consisting of poly(meth)acrylic acid and a polyalkylene glycol.
6. The cleaning composition according to claim 1 ,
wherein a cleaning target surface of the wiring board includes a wiring material and a barrier metal material, the wiring material being copper or tungsten, and the barrier metal material being at least one material selected from the group consisting of tantalum, titanium, cobalt, ruthenium, manganese, and compounds thereof.
7. The cleaning composition according to claim 6 ,
wherein the cleaning target surface includes a part in which the wiring material and the barrier metal material come in contact with each other.
8. The cleaning composition according to claim 1 ,
wherein an absolute value of a difference in corrosion potential between copper and cobalt when immersed in the cleaning composition is 0.1 V or less.
9. A cleaning method comprising contacting a wiring board with the cleaning composition according to claim 1 , the wiring board including a wiring material and a barrier metal material, the wiring material being copper or tungsten, and the barrier metal material being at least one material selected from the group consisting of tantalum, titanium, cobalt, ruthenium, manganese, and compounds thereof.
10. The cleaning composition according to claim 1 ,
wherein the component (A) comprises a fatty acid that includes a hydrocarbon group haying 8 to 20 carbon atoms, or a salt thereof.
11. The cleaning composition according to claim 1 ,
wherein the component (A) comprises an alkenylsuccinic acid that includes a hydrocarbon group haying 3 to 20 carbon atoms, or a salt thereof.
12. The cleaning composition according to claim 2 ,
wherein the amino acid comprises tryptophan.
13. The cleaning composition according to claim 2 ,
wherein the amino acid comprises phenylalanine.
14. The cleaning composition according to claim 2 ,
wherein the amino acid comprises arginine.
15. The cleaning composition according to claim 2 ,
wherein the amino acid comprises histidine.
16. The cleaning composition according to claim 1 ,
wherein the component (D) comprises poly(meth)acrylic acid.
17. The cleaning composition according to claim 1 ,
wherein the component (D) comprises a polyalkylene glycol.