Power semiconductor package with conductive clip and related method
View Patent ↗A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.
1. A process for fabricating a semiconductor package comprising:
depositing a dielectric body over a portion of a conductive clip;
forming at least one I/O terminal for said semiconductor package, said dielectric body electrically insulating said at least one I/O terminal from said conductive clip; and
connecting a power electrode of a power semiconductor device to said conductive clip.
2. The process of claim 1 , wherein said dielectric body is drop-on-demand deposited.
3. The process of claim 1 , further comprising depositing a solder resist over at least a portion of said at least one I/O terminal.
4. The process of claim 3 , wherein said solder resist is drop-on-demand deposited.
5. The process of claim 1 , wherein said conductive clip is can-shaped.
6. The process of claim 1 , wherein said conductive clip comprises copper.
7. The process of claim 1 , wherein said conductive clip is plated with either gold or silver.
8. The process of claim 1 , wherein said dielectric body comprises a polymer.
9. The process of claim 1 , wherein said dielectric body comprises dielectric particles in an organic base.
10. The process of claim 9 , wherein said organic base comprises one of an epoxy, acrylate, polyimide and organopolysiloxane.
11. The process of claim 9 , wherein said dielectric particles comprise a metal oxide.
12. The process of claim 11 , wherein said metal oxide is alumina.
13. The process of claim 1 , further comprising forming a conductive pad for said semiconductor package.
14. The process of claim 13 , further comprising forming a track to connect said conductive pad to said at least one I/O terminal.
15. The process of claim 14 , further comprising forming a solder resist body covering at least said track.