Heat-shrinkable laminate film
A heat-shrinkable laminate film includes layer (A) and layer (B) laminated via an interface having an interlayer strength of ≦0.5 N/15 mm, in which layer (A) has at least a substrate layer containing a polypropylene-based resin, layer (B) has at least a seal layer containing a polyethylene-base resin, and any of the following is satisfied: (1) the difference in heat shrinkage rate between layer (A) and layer (B) is ≦10% at 100° C., and the laminate film includes a gas barrier layer containing a saponified ethylene-vinyl alcohol copolymer and has an oxygen transmission rate of ≦60 cc/m 2 ·day·atm; and (2) the difference in heat shrinkage rate between layer (A) and layer (B) is ≦20% at 100° C., and the heat-shrinkable laminate film includes a gas barrier layer containing an aromatic polyamide-based copolymer and has an oxygen transmission rate of ≦60 cc/m 2 ·day·atm.
1. A heat-shrinkable laminate film comprising a layer (A) and a layer (B) laminated via an interface having an interlayer strength of 0.5 N/15 mm or lower, wherein the layer (A) comprises at least a substrate layer containing a polypropylene-based resin, the layer (B) comprises at least a seal layer containing a polyethylene-base resin, and any of the following conditions (1) and (2) is satisfied:
(1) the difference in heat shrinkage rate between the layer (A) and the layer (B), when peeled at the interface, either in machine direction (MD) or transverse direction (TD), is 10% or less at 100° C., and the heat-shrinkable laminate film comprises a gas barrier layer containing a saponified ethylene-vinyl alcohol copolymer and has an oxygen transmission rate of 60 cc/m 2 ·day·atm or lower at 23° C., 65% RH; and
(2) the difference in heat shrinkage rate between the layer (A) and the layer (B), when peeled at the interface, either in machine direction (MD) or transverse direction (TD), is 20% or less at 100° C., and the heat-shrinkable laminate film comprises a gas barrier layer containing an aromatic polyamide-based copolymer and has an oxygen transmission rate of 60 cc/m 2 ·day·atm or lower at 23° C., 65% RH.
2. The heat-shrinkable laminate film according to claim 1 , wherein the heat-shrinkable laminate film comprises a gas barrier layer containing an aromatic polyamide copolymer, and has a total-layer heat shrinkage rate in the machine direction of 20% or more at 140° C.
3. The heat-shrinkable laminate film according to claim 1 , wherein the substrate layer, a first adhesive layer containing a modified polyolefin-based resin, a gas barrier layer containing an aromatic polyamide-based copolymer, a second adhesive layer containing a modified polyolefin-based resin, and the seal layer are laminated in the stated order, and either an interface between the first adhesive layer and the gas barrier layer, or an interface between the gas barrier layer and the second adhesive layer has an interlayer strength of 0.5 N/15 mm or lower.
4. The heat-shrinkable laminate film according to claim 1 , wherein the second adhesive layer has a melting point higher than that of the first adhesive layer by 15° C. or more.
5. The heat-shrinkable laminate film according to claim 1 , wherein the heat-shrinkable laminate film comprises a gas barrier layer containing a saponified ethylene-vinyl alcohol copolymer, and has a total-layer heat shrinkage rate in the machine direction of 30% or more at 100° C.
6. The heat-shrinkable laminate film according to claim 1 , wherein the substrate layer, a first adhesive layer containing a modified polyolefin-based resin, a gas barrier layer containing a saponified ethylene-vinyl alcohol copolymer, a second adhesive layer containing a modified polyolefin-based resin, and the seal layer are laminated in the stated order, and either an interface between the first adhesive layer and the gas barrier layer, or an interface between the gas barrier layer and the second adhesive layer has an interlayer strength of 0.5 N/15 mm or lower.
7. The heat-shrinkable laminate film according to claim 1 , wherein the first adhesive layer has a melting point equal to or lower than that of the second adhesive layer.
8. The heat-shrinkable laminate film according to claim 1 , wherein each of the resins other than the gas barrier layer has a melting point of 170° C. or lower.
9. The heat-shrinkable laminate film according to claim 1 , wherein the difference in highest melting point between the resin making the substrate layer and the resin making the seal layer is 30° C. or less.
10. The heat-shrinkable laminate film according to claim 1 , wherein the heat-shrinkable laminate film has a total-layer heat shrinkage rate in the transverse direction of 5% or less at 60° C.
11. The heat-shrinkable laminate film according to claim 1 , wherein the heat-shrinkable laminate film has a total layer thickness of 25 μm or less.
12. The heat-shrinkable laminate film according to claim 1 , wherein the heat-shrinkable laminate film has 5-mm or less warpage when allowed to stand for 1 hour at 23° C., 50% RH.