IP Library Granted Patent US 9,633,719
Granted Patent B2
US 9,633,719 · App. 14/724,945 · Granted Apr 25, 2017

Programming memory cells to be programmed to different levels to an intermediate level from a lowest level

Inventors: Carmine Miccoli (Boise, ID); Christian Caillat (Boise, ID); Akira Goda (Boise, ID)
Assignee: Micron Technology, Inc.
G11C11/5628G11C16/10G11C16/3418G11C16/3459
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Quick Facts
Patent No.
US 9,633,719
App. No.
14/724,945
Granted
Apr 25, 2017
Kind
B2
Abstract

Embodiments of methods and memory devices for performing the methods are disclosed. In an embodiment, one such method includes programming all memory cells that are to be respectively programmed to different levels other than a lowest level, corresponding to a lowest data state, to an intermediate level from the lowest level and respectively programming all the memory cells that are to be respectively programmed to the different levels other than the lowest level to the different levels other than the lowest level from the intermediate level.

Claims (44)

1. A method of programming a memory device, comprising:

programming memory cells of a grouping of memory cells to an intermediate level from a lowest level corresponding to a lowest data state, wherein the memory cells that are programmed to the intermediate level comprise all the memory cells of the grouping of memory cells that are to be programmed from the intermediate level to levels other than the lowest level; and

respectively programming different memory cells of the memory cells that are programmed to the intermediate level to different levels of the levels other than the lowest level from the intermediate level.

2. The method of claim 1 , wherein the intermediate level represents a range of threshold voltages.

3. The method of claim 1 , wherein the memory cells that are programmed to the intermediate level are commonly coupled to a single access line and are programmed to the intermediate level in response to applying a single programming voltage pulse to the single access line.

4. The method of claim 3 , wherein the single programming voltage pulse is based on a number of program/erase cycles applied to the single access line or to a memory block that includes the single access line.

5. The method of claim 1 , wherein the memory cells that are programmed to the intermediate level are commonly coupled to a single access line and are programmed to the intermediate level in response to:

applying a first voltage pulse to the single access line; and

applying a second voltage pulse to the single access line after applying the first voltage pulse to the single access line;

wherein the second voltage pulse is the first voltage pulse incremented by a step voltage.

6. The method of claim 5 , where no verify operation is performed between applying the first and second voltage pulses.

7. The method of claim 1 , wherein programming the memory cells of the grouping of memory cells to the intermediate level from the lowest level comprises:

programming memory cells of a first grouping of memory cells commonly coupled to a first access line to the intermediate level from the lowest level; and

programming memory cells of a second grouping of memory cells commonly coupled to a second access line, adjacent to the first access line, to the intermediate level from the lowest level;

wherein the memory cells of the first grouping of memory cells that are programmed to the intermediate level from the lowest level comprise all the memory cells of the first grouping of memory cells that are to be programmed from the intermediate level to the levels other than the lowest level; and

wherein the memory cells of the second grouping of memory cells that are programmed to the intermediate level from the lowest level comprise all the memory cells of the second grouping of memory cells that are to be programmed from the intermediate level to the levels other than the lowest level.

8. The method of claim 7 , wherein respectively programming the different memory cells of the memory cells that are programmed to the intermediate level to the different levels of the levels other than the lowest level from the intermediate level comprises:

respectively programming different memory cells of the first grouping of memory cells that are programmed to the intermediate level to the different levels of the levels other than the lowest level from the intermediate level; and

after respectively programming the different memory cells of the first grouping of memory cells to the different levels of the levels other than the lowest level from the intermediate level, respectively programming different memory cells of the second grouping of memory cells that are programmed to the intermediate level to the different levels of the levels other than the lowest level from the intermediate level.

9. The method of claim 8 , wherein the memory cells of the first grouping of memory cells that are programmed to the intermediate level from the lowest level are programmed to the intermediate level from the lowest level before the memory cells of the second grouping of memory cells are programmed to the intermediate level from the lowest level.

10. The method of claim 1 , wherein programming the memory cells of the grouping of memory cells to the intermediate level from the lowest level comprises programming first memory cells of the grouping of memory cells to the intermediate level from the lowest level, wherein at least one second memory cell of the grouping of memory cells is to remain at the lowest level, and further comprising inhibiting the at least one second memory cell while programming the first memory cells of the grouping of memory cells to the intermediate level from the lowest level.

11. The method of claim 1 , wherein the memory cells are not read or verified at the intermediate level.

12. A memory device, comprising:

a controller;

wherein the controller is configured to cause the memory device to program memory cells of a grouping of memory cells to an intermediate level from a lowest level corresponding to a lowest data state, wherein the memory cells that are caused to be programmed to the intermediate level from the lowest level comprise all the memory cells of the grouping of memory cells that are to be programmed from the intermediate level to levels other than the lowest level;

wherein the controller is configured to cause the memory device to respectively program different memory cells of the memory cells that are caused to be programmed to the intermediate level to different levels of the levels other than the lowest level from the intermediate level.

13. The memory device of claim 12 , wherein the memory cells that are caused to be programmed to the intermediate level are commonly coupled to a single access line, wherein the controller is configured to cause the memory device to apply a single programming voltage pulse to the single access line so that the memory cells that are caused to be programmed to the intermediate level are caused to be programmed to the intermediate level in response to the single programming voltage pulse.

14. The memory device of claim 13 , wherein the single programming voltage pulse is based on a number of program/erase cycles applied to the single access line or to a memory block that includes the single access line.

15. The memory device of claim 13 , wherein a voltage of the single programming voltage pulse is stored on the memory device.

16. The memory device of claim 12 , wherein the memory cells that are caused to be programmed to the intermediate level are commonly coupled to a single access line, and wherein the controller being configured to cause the memory device to program the memory cells of the grouping of memory cells to the intermediate level from the lowest level comprises:

the controller being configured to cause the memory device to apply a first voltage pulse to the single access line; and

the controller being configured to cause the memory device to apply a second voltage pulse to the single access line after the first voltage pulse is applied to the single access line;

wherein the second voltage pulse is the first voltage pulse incremented by a step voltage.

17. The memory device of claim 16 , where no verify operation is performed between applying the first and second voltage pulses.

18. The memory device of claim 12 , wherein the controller being configured to cause the memory device to program the memory cells of the grouping of memory cells to the intermediate level from the lowest level comprises:

the controller being configured to cause the memory device to program memory cells of a first grouping of memory cells commonly coupled to a first access line to the intermediate level from the lowest level; and

the controller being configured to cause the memory device to program memory cells of a second grouping of memory cells commonly coupled to a second access line, adjacent to the first access line, to the intermediate level from the lowest level;

wherein the memory cells of the first grouping of memory cells that are programmed to the intermediate level from the lowest level comprise all the memory cells of the first grouping of memory cells that are to be programmed from the intermediate level to the levels other than the lowest level; and

wherein the memory cells of the second grouping of memory cells that are programmed to the intermediate level from the lowest level comprise all the memory cells of the second grouping of memory cells that are to be programmed from the intermediate level to the levels other than the lowest level.

19. The memory device of claim 18 , wherein the controller being configured to cause the memory device to respectively program the different memory cells of the memory cells that are caused to be programmed to the intermediate level to the different levels of the levels other than the lowest level from the intermediate level comprises:

the controller being configured to cause the memory device to respectively program different memory cells of the first grouping of memory cells that are programmed to the intermediate level to the different levels of the levels other than the lowest level from the intermediate level; and

the controller being configured, after the different memory cells of the first grouping of memory cells are respectively programmed to the different levels of the levels other than the lowest level from the intermediate level, to respectively program different memory cells of the second grouping of memory cells that are programmed to the intermediate level to the different levels of the levels other than the lowest level from the intermediate level.

20. The memory device of claim 19 , wherein the controller is configured to cause the memory device to program the memory cells of the first grouping of memory cells to the intermediate level from the lowest level before causing the memory device to program the memory cells of the second grouping of memory cells to the intermediate level from the lowest level.

21. The memory device of claim 12 , wherein the memory cells that are caused to be programmed to the intermediate level from the lowest level are first memory cells of the grouping of memory cells, wherein at least one second memory cell of the grouping of memory cells is to remain at the lowest level, and wherein the controller is configured to cause the memory device to inhibit the at least one second memory cell of the grouping of memory cells while the first memory cells are caused to be programmed to the intermediate level from the lowest level.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2015
From: MICCOLI, CARMINE; CAILLAT, CHRISTIAN; GODA, AKIRA
To: MICRON TECHNOLOGY, INC.
Reel/Frame 035740/0315 →
Continuity (1)
Related Publication 20160351253A1 · Dec 1, 2016