Fin structure having hard mask etch stop layers underneath gate sidewall spacers
View Patent ↗A hard mask etch stop is formed on the top surface of tall fins to preserve the fin height and protect the top surface of the fin from damage during etching steps of the transistor fabrication process. In an embodiment, the hard mask etch stop is formed using a dual hard mask system, wherein a hard mask etch stop layer is formed over the surface of a substrate, and a second hard mask layer is used to pattern a fin with a hard mask etch stop layer on the top surface of the fin. The second hard mask layer is removed, while the hard mask etch stop layer remains to protect the top surface of the fin during subsequent fabrication steps.
1. A structure, comprising:
a substrate having a fin, wherein the fin has a base portion and an active portion, and wherein the active portion has a top surface and first and second sidewall surfaces;
isolation regions surrounding the base of the fin;
a gate structure wrapping around the first sidewall surface, the top surface and the second sidewall surface of the fin, wherein the gate structure has gate sidewalls;
sidewall spacers formed on the gate sidewalls and directly on the first and second sidewall surfaces of the fin; and
a hard mask etch stop between the top surface of the fin and the sidewall spacers, wherein the hard mask etch stop is not between the gate structure and the top surface of the fin.
2. The structure of claim 1 , wherein the hard mask etch stop comprises a hard mask material.
3. The structure of claim 2 , wherein the hard mask material is selected from the group consisting of silicon dioxide, titanium oxide, hafnium oxide, aluminum oxide, and other dielectric films.
4. The structure of claim 1 , wherein the hard mask etch stop comprises:
a first hard mask layer; and
a sacrificial fill material formed over the first hard mask layer.
5. The structure of claim 4 , wherein the hard mask layer is selected from the grouping consisting of silicon dioxide, titanium oxide, hafnium oxide, aluminum oxide, and other dielectric films.
6. The structure of claim 4 , wherein the sacrificial fill is selected from the group consisting of carbon hard mask, photoresist, dielectric material, bottom anti-reflective coating (BARC), nitride, or oxide.
7. The structure of claim 1 , wherein the active portion of the fin has a fin height above the isolation regions, a fin width, and an aspect ratio, wherein the aspect ratio is the ratio of the fin height to the fin width.
8. The structure of claim 7 , wherein the aspect ratio is greater than 10:1.