Method of manufacturing non-volatile memory having SONOS memory cells
View Patent ↗A method for manufacturing a non-volatile memory with SONOS memory cells, which includes steps of: providing a substrate; forming a first gate oxide layer and a first gate conductive layer onto the substrate; forming a MOS transistor gate by executing a photolithography process on the first gate conductive layer, and then forming an ONO structure on the substrate; and forming a second gate conductive layer on the ONO substrate, and then forming a NVM transistor gate by executing a photolithography process on the second gate conductive layer.
1. A method for manufacturing a non-volatile memory with Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) memory cells, comprising steps of:
providing a substrate;
forming a first gate oxide layer and a first gate conductive layer onto the substrate;
forming a MOS transistor gate by executing a photolithography process on the first gate conductive layer, and then forming an Oxide-Nitride-Oxide (ONO) structure on the substrate; and
forming a second gate conductive layer on the ONO structure, and then forming a non-volatile memory (NVM) transistor gate by executing a photolithography process on the second gate conductive layer.
2. The method according to claim 1 , wherein when etching the second gate conductive layer, a charge trapping layer of the ONO structure serves as a hard mask of the MOS transistor gate.
3. The method according to claim 1 , wherein while etching the first gate conductive layer, a portion of the first gate conductive layer which is not used for forming the MOS transistor gate is remained for forming a capacitor structure with the ONO structure.
4. The method according to claim 1 , wherein while etching the second gate conductive layer, a portion of the second gate conductive layer which is not used for forming the NVM transistor gate is remained for forming a resistor with a desired electrical resistance.