Semiconductor device having bilayer metal layer
View Patent ↗A semiconductor device includes an opening, a metal nitride layer, a bilayer metal layer and a conductive bulk layer. The opening is disposed in a first dielectric layer. The metal nitride layer is disposed in the opening. The bilayer metal layer is disposed on the metal nitride layer in the opening, where the bilayer metal layer includes a first metal layer and a second metal layer which is disposed on the first metal layer and has a greater metal concentration than that of the first metal layer. The conductive bulk layer is filled in the opening.
1. A semiconductor device, comprising:
an opening disposed in a first dielectric layer;
a bilayer metal layer disposed in the opening, wherein the bilayer metal layer comprises a first metal layer and a second metal layer disposed on the first metal layer and both the first metal layer and the second metal layer having <110> crystalline orientation and <211> crystalline orientation; and
a conductive bulk layer filled in the opening.
2. The semiconductor device according to claim 1 , wherein the second metal layer comprises a pure metal layer.
3. The semiconductor device according to claim 1 , wherein the bilayer metal layer consists of tantalum.
4. The semiconductor device according to claim 3 , wherein the bilayer metal layer only comprises alpha-phase tantalum.
5. The semiconductor device according to claim 1 , further comprising: a metal nitride layer disposed in the opening, under the bilayer metal layer.
6. The semiconductor device according to claim 1 , wherein the metal nitride layer has a metal concentration less than a metal concentration of the first metal layer.
7. The semiconductor device according to claim 1 , wherein a ratio between the <110> crystalline orientation and the <211> crystalline orientation is substantially between 1:1 to 5:1.