IP Library Granted Patent US 9,343,830
Granted Patent B1
US 9,343,830 · App. 14/733,314 · Granted May 17, 2016

Integrated circuit chip tester with embedded micro link

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Quick Facts
Patent No.
US 9,343,830
App. No.
14/733,314
Granted
May 17, 2016
Kind
B1
Abstract

A contact for testing an integrated circuit includes a contact body with multiple embedded links within the body having at least two axes of rotation. The contact body is hollow with cavities that house tubular resilient members to bias the embedded links in a first preferred orientation and position.

Claims (14)

1. A contact for testing an integrated circuit, comprising:

an elongate contact body including a front surface and a rear surface, first and second side surfaces, and an upper surface, and a plurality of cavities in the elongate contact body, each cavity having associated therewith a first opening in the upper surface and a second opening in one of the side and front surfaces;

a plurality of resilient tubular members, each disposed in a respective one of said plurality of cavities, each resilient tubular member having a longitudinal axis, each respective second opening associated with a respective cavity sized to receive its resilient tubular member thereinthrough; and

a plurality of contact links each associated with a respective one of said tubular members and extending from said associated cavity through said respective first opening in the upper surface, the plurality of contact links biased by its respective tubular member in a first extended position, each contact link arranged for pivotal movement about an axis parallel to the axis of the respective tubular member.

2. The contact for testing an integrated circuit of claim 1 , wherein a rotation of a first contact link is in a clockwise direction and a rotation of a second contact link is in a counter-clockwise direction when viewed from the first side surface.

3. The contact for testing an integrated circuit of claim 1 , wherein a rotation of a first contact is about an axis of rotation that is orthogonal to an axis of rotation of a second contact.

4. The contact for testing an integrated circuit of claim 1 , wherein the upper surface include front and rear vertical spacers adjacent at least two openings on the upper surface.

5. The contact for testing an integrated circuit of claim 4 , further comprising a spacer platform about a central opening on the upper surface, the spacer platform having a height equal to a height of the vertical spacers.

6. The contact for testing an integrated circuit of claim 1 , wherein the front and rear surface include indentions along a lowermost edge for aligning the contact with a tester.

7. The contact for testing an integrated circuit of claim 1 , wherein the front surface includes an elongate arcuate recess extending horizontally therein.

8. The contact for testing an integrated circuit of claim 1 , wherein each second opening is sized to receive the contact link associated therewith.

9. The contact for testing an integrated circuit of claim 1 , wherein each cavity includes a chamber sized to receive a mating circular fulcrum of a contact link for pivoting movement therein.

10. The contact for testing an integrated circuit of claim 1 , wherein the resilient tubular members are cylindrical.

11. The contact for testing an integrated circuit of claim 1 , wherein at least one second opening is on the front surface and at least one second opening is on a first or second side surface.

Assignments (5)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 047185, FRAME 0624 Recorded Mar 7, 2024
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS AGENT
To: XCERRA CORPORATION
Reel/Frame 066762/0811 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT STATEMENT THAT THIS DOCUMENT SERVES AS AN OATH/DECLARATION PREVIOUSLY RECORDED ON REEL 047185 FRAME 0628. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Nov 28, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047675/0354 →
PATENT SECURITY AGREEMENT Recorded Oct 2, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047185/0624 →
FIRST SUPPLEMENT TO INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Sep 17, 2015
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 036622/0065 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2015
From: LANDA, VICTOR
To: XCERRA CORPORATION
Reel/Frame 035869/0569 →