Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide
A resin composition for printed circuit board contains a thermosetting resin and an inorganic filler containing magnesium oxide. A volume average particle size of the magnesium oxide is from 2 μm to 10 μm, inclusive. In a distribution of a particle size of the magnesium oxide, the particle size has maximal frequencies in a first range of from 0.3 μm to 1 μm, inclusive, and in a second range of from 2 μm to 10 μm, inclusive, a maximal volume frequency in the first range is 5% or less, and a maximal volume frequency in the second range is 12% or more. A ratio of 50% accumulated particle size D50 with respect to specific surface area diameter of the magnesium oxide is 4 or less, and a ratio of 90% accumulated particle size D90 with respect to 10% accumulated particle size D10 of the magnesium oxide is 10 or less.
1. A resin composition for printed circuit board, comprising:
a thermosetting resin; and
an inorganic filler containing a magnesium oxide,
wherein a volume average particle size of the magnesium oxide is from 2 μm to 10 μm, inclusive,
in a distribution of a particle size of the magnesium oxide, the particle size has maximal frequencies in a first range of from 0.3 μm to 1 μm, inclusive, and in a second range of from 2 μm to 10 μm, inclusive, a maximal volume frequency in the first range is 5% or less, and a maximal volume frequency in the second range is 12% or more,
a ratio of 50% accumulated particle size D50 with respect to a specific surface area diameter of the magnesium oxide is 4 or less, and
a ratio of 90% accumulated particle size D90 with respect to 10% accumulated particle size D10 of the magnesium oxide is 10 or less.
2. The resin composition according to claim 1 , wherein in the magnesium oxide, 99% accumulated particle size D99 is 20 μm or less, and a ratio of most frequent particle size with respect to a volume average particle size is from 1 to 1.5, inclusive.
3. The resin composition according to claim 1 , wherein a content of the inorganic filler is in a range from 60 parts by mass to 90 parts by mass, inclusive, with respect to a total mass of 100 parts by mass of the thermosetting resin and the inorganic filler, and
a content of the magnesium oxide is equal to or greater than 30 parts by mass with respect to a total mass of 100 parts by mass of the inorganic filler.
4. A prepreg for printed circuit board, comprising:
a fiber base member, and
the resin composition for printed circuit board according to claim 1 with which the fiber base member is impregnated.
5. An insulating substrate which is a hardened substance of the prepreg for printed circuit board according to claim 4 .
6. A metal-clad laminate, comprising:
an insulating layer which is the hardened substance of the prepreg for printed wiring board according to claim 4 ; and
a metal foil laminated on the insulating layer.
7. A printed circuit board, comprising:
an insulating layer which is the hardened substance of the prepreg according to claim 4 ; and
a conductor pattern formed on the insulating layer.