IP Library › Patent Application 14735843
Patent Application
App. No. 14/735,843

METHOD FOR IMPROVING SAFETY OF VOLTAGE REGULATOR

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Quick Facts
Patent No.
US None
App. No.
14/735,843
Abstract

A method for improving safety of voltage regulator is disclosed. In order to improve safety of a voltage regulator, a MOS-FET is disposed on a source power lane that receives power supplied from a DC power supply. A set of voltage regulators is connected to a set of fork power lanes, correspondingly, branching off from the source power lane. PTC thermistors are disposed on a surface or in the vicinity of semiconductor chips of the voltage regulators. When temperature at any one of the PTC thermistors increases, a protection controller turns off the MOS-FET. When temperature detected by a temperature sensor incorporated within the semiconductor chip has increased, each of the voltage regulators turns off the MOS-FET via a base management controller.

Claims (27)

1 . A power-supply system comprising:

a protection switch disposed on a power lane receiving power from a DC power supply;

a plurality of voltage regulators, wherein at least one of said voltage regulators includes a switching element and branching off from said power lane;

a temperature sensor for detecting temperature of said voltage regulators; and

a controller for turning off said protection switch when temperature at any one of said voltage regulators has increased and for stopping power supplied to said plurality of voltage regulators.

2 . The power-supply system of claim 1 , wherein said temperature sensor detects temperature of a semiconductor chip when said switching element is incorporated within said semiconductor chip.

3 . The power-supply system of claim 2 , wherein said temperature sensor detects temperatures inside of said semiconductor chip.

4 . The power-supply system of claim 1 , wherein said temperature sensor includes a FTC thermistor.

5 . The power-supply system of claim 1 , wherein in response to an abnormality for ON/OFF resistances of said switching elements, said voltage regulators send a signal to turn off said protection switch to said controller.

6 . The power-supply system of claim 1 , wherein said voltage regulators include a first voltage regulator and a second voltage regulator that output mutually different voltages, and loads of said voltage regulators include a device that operates with output voltage from said first voltage regulator and output voltage from said second voltage regulator.

7 . A sub-system for a computer comprising:

a processor and a system memory;

a protection switch disposed on a power lane receiving power from a DC power supply;

a plurality of voltage regulators, wherein at least one of said voltage regulators includes a switching element to supply power to said processor and said system memory;

a first temperature sensor for detecting temperature of said voltage regulators; and

a first protection circuit for turning off said protection switch in response to a temperature at any of said voltage regulators has increased.

8 . The sub-system of claim 7 , wherein said switching element is incorporated within a semiconductor chip, and said first protection circuit turns off said protection switch in response to a temperature of said semiconductor chip has increased.

9 . The sub-system of claim 8 , further comprising:

a second temperature sensor incorporated within said semiconductor chip; and

a second protection circuit for turning off said protection switch in response to a temperature detected by said second temperature sensor has increased.

10 . A method for improving safety of a voltage regulator, said method comprising:

providing a voltage regulator with a switching element at one of a plurality of fork power lanes branching off from a source power lane;

detecting temperature at said switching element of one of said voltage regulators; and

stopping power supplied from said source power lane in response to a temperature at any of said voltage regulators has increased.

11 . The method of claim 10 , wherein said detecting temperature further includes detecting temperature of a semiconductor chip when said switching element is incorporated within said semiconductor chip.

12 . The method of claim 10 , further comprising: in response to an abnormality occurs in ON resistance of said switching elements, stopping power supplied from said source power lane.

13 . The method of claim 10 , further comprising: in response to an abnormality occurs in OFF resistance of said switching elements, stopping power supplied from said source power lane.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2015
From: ODAOHHARA, SHIGEFUMI; HINKLE, JONATHAN RANDALL
To: LENOVO (SINGAPORE) PTE. LTD.
Reel/Frame 035818/0348 →