Laminated ceramic electronic component
A laminated ceramic electronic component that includes a laminated body formed by laminating a ceramic layer and an internal electrode, and forming an external electrode on an outer surface of the laminated body so as to be electrically connected to the internal electrode. The external electrode includes a conducting layer that is in contact with the internal electrode, and the internal electrode contains Ni. The conducting layer contains metal particles containing a Cu 3 Sn alloy, and a thermosetting resin. The internal electrode and the conducting layer are bonded to each other with a CuSnNi alloy phase interposed therebetween.
1. A laminated ceramic electronic component comprising:
a laminated body having a ceramic layer and an internal electrode containing Ni;
an external electrode on an outer surface of the laminated body and electrically connected to the internal electrode, the external electrode comprising a conducting layer that is in contact with the internal electrode, and the conducting layer having metal particles containing a Cu 3 Sn alloy, and a thermosetting resin; and
a CuSnNi alloy phase interposed between and bonding the internal electrode and the conducting layer to each other.
2. The laminated ceramic electronic component according to claim 1 , wherein a solid solution amount of Ni in the CuSnNi alloy phase is 5 atm % to 42 atm %.
3. The laminated ceramic electronic component according to claim 1 , wherein the metal particles contain Sn in a weight ratio of 36.5% to 47.8% to a total amount of Sn and Cu.
4. The laminated ceramic electronic component according to claim 1 , wherein a ratio of the Cu 3 Sn alloy to a total amount of Sn and Cu contained in the metal particles is 25% by weight or more.
5. The laminated ceramic electronic component according to claim 1 , wherein the conducting layer is a thermally cured thermosetting conductive resin composition.
6. The laminated ceramic electronic component according to claim 5 , wherein the thermally cured thermosetting conductive resin composition contains a Cu powder, a Sn powder, a thermosetting resin and an organic solvent before curing.
7. The laminated ceramic electronic component according to claim 6 , wherein the thermally cured thermosetting conductive resin composition has a Sn powder content of 36.5% by weight to 47.8% by weight based on a total amount of the Cu powder and the Sn powder before curing.
8. The laminated ceramic electronic component according to claim 6 , wherein a total content of the Cu powder and the Sn powder in the thermally cured thermosetting conductive resin composition is 45% by volume to 65% by volume after removal of the organic solvent.
9. The laminated ceramic electronic component according to claim 6 , wherein a D50 value of the Cu powder is 0.5 μm to 3.0 μm and a D50 value of the Sn powder is 1.5 μm to 5.0 μm before curing of the thermally cured thermosetting conductive resin composition.
10. The laminated ceramic electronic component according to claim 5 , wherein a residual stress of the thermally cured thermosetting conductive resin composition is 8 MPa or more.