Ignitable solids having an arrayed structure and methods thereof
The present invention relates to the design and manufacture of an ignitable solid, where the solid is composed of an array of ignitable regions. In some examples, the array provides a three-dimensional periodic arrangement of such ignitable regions. The ignitable region can have any useful geometry and geometric arrangement within the solid, and methods of making such regions are also described herein.
1. An ignitable solid comprising:
a three-dimensional scaffold; and
a plurality of ignitable regions, wherein each ignitable region is disposed within the scaffold and at least one ignitable region comprises a first reactant, and
wherein the plurality of ignitable regions forms a three-dimensional array disposed within the scaffold,
wherein each of the plurality of ignitable regions has a dimension that is of from about 10 nm to about 10 μm and each center-to-center spacing between two ignitable regions is of from about 10 nm to about 10 μm, and
wherein the three-dimensional array extends in a pattern along x-, y-, and z-axes within the scaffold.
2. The ignitable solid of claim 1 , wherein the scaffold comprises a second reactant, and wherein the first and second reactants are configured to undergo an exothermic reaction.
3. The ignitable solid of claim 2 , wherein the first reactant and second reactant are configured as a multilayer.
4. The ignitable solid of claim 2 , wherein the first and second reactants are configured to undergo an exothermic reaction that produces a non-transparent reaction product.
5. The ignitable solid of claim 2 , wherein the first reactant is transparent or semi-transparent, wherein the second reactant is transparent or semi-transparent, and wherein the first and second reactants are configured to undergo and/or propagate an exothermic reaction that produces a non-transparent reaction product.
6. The ignitable solid of claim 1 , wherein the ignitable region further comprises a second reactant, and wherein the first and second reactants are configured to undergo an exothermic reaction.
7. The ignitable solid of claim 1 , wherein the scaffold comprises a plurality of openings, and wherein at least one ignitable region is disposed within at least one opening.
8. The ignitable solid of claim 1 , wherein at least one ignitable region comprises a cylinder, a cone, or a multilayer.
9. The ignitable solid of claim 1 , wherein the three-dimensional array comprises a periodic pattern.
10. The ignitable solid of claim 9 , wherein the period pattern comprises a rectangular, a hexagonal, or a rhombohedral pattern.
11. The ignitable solid of claim 1 , wherein the three-dimensional array comprises an aperiodic pattern.
12. The ignitable solid of claim 1 , further comprising an ignition site in proximity to at least one of the plurality of ignitable regions.
13. The ignitable solid of claim 1 , wherein at least one ignitable region has a dimension that is of from about 50 nm to about 1 μm.
14. The ignitable solid of claim 13 , wherein a center-to-center spacing between two ignitable regions is of from about 10 nm to about 5 μm.
15. The ignitable solid of claim 1 , wherein the solid is a foil, a coating, or a delay line.
16. The ignitable solid of claim 1 , wherein the scaffold comprises silicon, carbon, aluminum, or a fluorocarbon.
17. The ignitable solid of claim 1 , wherein at least one of the plurality of ignitable regions comprises one or more selected from the group consisting of a transition metal, a lanthanoid, and a metal oxide.
18. The ignitable solid of claim 17 , wherein said at least one of the plurality of ignitable regions comprises nickel, platinum, cobalt, aluminum, titanium, zirconium, silicon, or an alloy thereof.
19. The ignitable solid of claim 1 , wherein the solid is transparent.
20. An assembly comprising:
the ignitable solid of claim 1 ; and
a first delay line located in proximity to the ignitable solid and configured to ignite the ignitable solid.
21. The assembly of claim 20 , further comprising a substrate disposed between the first delay line and the ignitable solid.
22. The assembly of claim 21 , further comprising a first ignitable via disposed within the substrate and configured to connect the first delay line and the ignitable solid.
23. The assembly of claim 20 , wherein the first ignitable via comprises one or more reactants configured to undergo and/or propagate an exothermic reaction.
24. The assembly of claim 20 , wherein the scaffold is composed of a material, and wherein the first reactant and the material are configured to undergo and/or propagate an exothermic reaction.
25. The assembly of claim 24 , wherein the first reactant is transparent or semi-transparent, wherein the material is transparent or semi-transparent, and wherein the first reactant and the material are configured to undergo and/or propagate an exothermic reaction that produces a non-transparent reaction product.
26. The assembly of claim 20 , wherein the first delay line comprises one or more reactants configured to undergo and/or propagate an exothermic reaction.
27. An optical switch comprising:
an ignitable solid of claim 1 , wherein the solid comprises one or more transparent reactants configured to undergo and/or propagate an exothermic reaction that produces a non-transparent reaction product.
28. The ignitable solid of claim 1 , further comprising an ignition mechanism.
29. The solid of claim 1 , wherein the pattern along the x-axis comprises a plurality of first ignitable regions, the pattern along the y-axis comprises a plurality of second ignitable regions, and the pattern along the z-axis comprises a plurality of third ignitable regions.
30. An assembly comprising:
a three-dimensional scaffold;
a plurality of ignitable regions, wherein each ignitable region is disposed within the scaffold and at least one ignitable region comprises a first reactant; and
a first delay line having a first end and a second end, wherein the first end is disposed in proximity to an ignition site,
wherein the plurality of ignitable regions forms a three-dimensional array disposed within the scaffold,
wherein each of the plurality of ignitable regions has a dimension that is of from about 10 nm to about 10 μm and each center-to-center spacing between two ignitable regions is of from about 10 nm to about 10 μm, and
wherein the three-dimensional array extends in a pattern along x-, y-, and z-axes within the scaffold.
31. The assembly of claim 30 , wherein the second end of the first delay line is disposed in proximity to at least one of the plurality of ignitable regions.
32. The assembly of claim 30 , further comprising:
a first ignitable via disposed within a substrate and configured to connect the first delay line and said at least one ignitable region, wherein the substrate disposed between the first delay line and the scaffold.
33. The assembly of claim 30 , further comprising:
a substrate disposed between the scaffold and the first delay line, wherein the substrate comprises an ignitable via configured to connect the first delay line to at least one ignitable region.
34. The assembly of claim 30 , wherein the first delay line comprises one or more reactants configured to undergo and/or propagate an exothermic reaction.