IP Library Granted Patent US 9,536,618
Granted Patent B2
US 9,536,618 · App. 14/746,416 · Granted Jan 3, 2017

Apparatuses and methods to control body potential in memory operations

Inventors: Han Zhao (Santa Clara, CA); Akira Goda (Boise, ID); Krishna K. Parat (Palo Alto, CA); Aurielo Giancarlo Mauri (Meda, IT); Haitao Liu (Boise, ID); Toru Tanzawa (Tokyo, JP); Shigekazu Yamada (Suginamiku, JP); Koji Sakui (Setagayaku, JP)
Assignee: Micron Technology, Inc.
G11C16/32G11C16/0483G11C16/06G11C16/16G11C8/08G11C16/08G11C2213/71
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Quick Facts
Patent No.
US 9,536,618
App. No.
14/746,416
Granted
Jan 3, 2017
Kind
B2
Abstract

Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described.

Claims (31)

1. An apparatus comprising:

a memory cell string including memory cells located in different levels of the apparatus, the memory cell string including a body associated with the memory cells;

a source coupled to the memory cell string;

a data line coupled to the memory cell string; and

a module configured to perform at least one of storing information in a memory cell among the memory cells and determining a value of information stored in a memory cell among the memory cells during a first time interval of an operation, to apply a voltage having a positive value to a control gate of a selected memory cell among the memory cells of the memory cell string during a second time interval of the operation, and to apply a voltage having a positive value to at least one of the source and the data line during the second time interval of the operation for controlling a potential of the body.

2. The apparatus of claim 1 , wherein the module being configured to apply a voltage having a positive value to at least one of the source and the data line during a second time interval of the operation comprises the module being configured to induce drain leakage current in at least a portion of the body during the second time interval.

3. The apparatus of claim 1 , wherein the module being configured to apply a voltage having a positive value to at least one of the source and the data line during a second time interval of the operation comprises the module being configured to inject holes into the body during the second time interval.

4. The apparatus of claim 1 , wherein the module being configured to apply a voltage having a positive value to at least one of the source and the data line during a second time interval comprises the module being configured to apply a voltage having a positive value to the data line during the second time interval and to apply a voltage having a positive value to the source during the second time interval.

5. The apparatus of claim 1 , wherein the module is configured to apply a voltage having ground potential to a control gate of an unselected memory cell among the memory cells of the memory cell string during the second time interval.

6. The apparatus of claim 1 , wherein the module is configured to apply a voltage having a positive value to a control gate of an unselected memory cell among the memory cells of the memory cell string control gate during at least a portion of the second time interval.

7. The apparatus of claim 1 , wherein the module is configured to perform a read operation during one of the first and second time intervals.

8. The apparatus of claim 1 , wherein the module is configured to perform a write verify stage during one of the first and second time intervals.

9. The apparatus of claim 1 , wherein the module is configured to apply a first voltage having a positive value to the source during one of the first and second time intervals, and to apply a second voltage having a positive value to the data line during one of the first and second time intervals.

10. A method comprising:

performing an operation on a memory cell among memory cells of a memory cell string of a device during a first time interval of the operation, the memory cells of the memory cell string located in different levels of the device, the memory cell string including a body associated with the memory cells and coupled to a data line and a source of the device; and

inducing drain leakage current in at least a portion of the body during a second time interval of the operation while a voltage on a control gate of the memory cell has a positive value during at least a portion of the second time interval.

11. The method of claim 10 , wherein performing the operation includes storing information in the memory cell.

12. The method of claim 10 , wherein performing the operation includes determining a value of information stored in the memory cell.

13. The method of claim 10 , wherein performing the operation includes determining whether a value of information stored in the memory cell reaches a target value.

14. The method of claim 10 , wherein performing the operation during the first time interval includes applying a voltage having a first value during at least a portion of the first time interval to a select gate associated with a select transistor of the memory cell string; and wherein inducing drain leakage current during a second time interval includes applying a voltage having a second value during at least a portion of the second time interval to the select gate, wherein the second value is less than the first value.

15. A method comprising:

determining, during a first time interval of an operation, a value of information stored in a selected memory among memory cells of a memory cell string, the memory cells of the memory cell string located in different levels of a device, the memory cell string including a body associated with the memory cells;

applying a voltage having a positive voltage value to a control gate of the selected memory cell during a second time interval of the operation; and

applying a voltage having a positive value to at least one of a data line coupled to the memory cell string and a source coupled to the memory cell string during a second time interval of the operation to control a potential of the body.

16. The method of claim 15 , wherein applying a voltage having a positive value to at least one of a data line coupled to the memory cell string and a source coupled to the memory cell string during a second time interval of the operation to control a potential of the body comprises applying a voltage having a positive value to the data line during the second time interval and applying a voltage having a positive value to the source during the second time interval.

17. The method of claim 15 , further comprising:

applying a voltage having ground potential to a control gate of an unselected memory cell among the memory cells of the memory cell string during the second time interval.

18. The method of claim 15 , further comprising:

applying a voltage having a positive value to a control gate of an unselected memory cell among the memory cells of the memory cell string during at least a portion of the second time interval.

19. The apparatus of claim 15 , further comprising holding the control gate of the selected memory cell at a positive voltage value after the second time interval.

20. The apparatus of claim 19 , further comprising holding a control gate of an unselected memory cell among the memory cells of the memory cell string at a positive voltage value after the second time interval.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Continuity (2)
Division 13707067 · Dec 6, 2012
Related Publication 20150287472A1 · Oct 8, 2015