Three dimensional device integration method and integrated device
A device integration method and integrated device. The method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one of a substrate used for thermal spreading, impedance matching or for RF isolation, an antenna, and a matching network comprised of passive elements. A second thermal spreading substrate may be bonded to the remaining portion of the semiconductor device. Interconnections may be made through the first or second substrates. The method may also include bonding a plurality of semiconductor devices to an element, and the element may have recesses in which the semiconductor devices are disposed. A conductor array having a plurality of contact structures may be formed on an exposed surface of the semiconductor device, vias may be formed through the semiconductor device to device regions, and interconnection may be formed between said device regions and said contact structures.
1. An integration method, comprising:
forming a first layer of bondable material with a surface roughness less than about 1 nm (rms) on a first element;
preparing a second element having a surface roughness of less than about 1 nm (rms);
bringing into direct contact said first layer of bondable material with said second element;
directly bonding said first layer of bondable material to said second element with a covalent bond;
obtaining a bond strength at about room temperature sufficient to permit removing a portion of said first element by one of polishing and grinding to leave a remaining portion of said first element after said bonding; and
after said bonding, removing the portion of said first element by one of polishing and grinding to leave the remaining portion of said first element.
2. A method as recited in claim 1 , comprising:
polishing said first layer of bondable material.
3. A method as recited in claim 1 , comprising:
forming a first silicon oxide layer as said first layer of bondable material.
4. A method as recited in claim 1 , comprising:
forming said first layer on a first element comprising a semiconductor device.
5. A method as recited in claim 1 , comprising:
forming said first layer on a first element comprising a first semiconductor device having metallic contact structures.
6. A method as recited in claim 5 , comprising:
preparing said second element comprising a second semiconductor device.
7. A method as recited in claim 6 , comprising:
connecting said first and second semiconductor devices.
8. A method as recited in claim 1 , comprising:
forming said first layer with a surface roughness of no more than 0.5 nm (rms).
9. A method as recited in claim 1 , comprising:
forming a second layer of bondable material on said second element, said second layer of bondable material having a surface roughness less than about 1 nm (rms);
bringing into direct contact said first and second layers; and
directly bonding said first layer to said second layer.
10. A method as recited in claim 1 , comprising:
preparing said second element as a silicon substrate.
11. An integration method, comprising:
forming a first layer of silicon oxide bonding material with a surface roughness no more than about 1 nm (rms) on a first semiconductor device;
forming a second layer of silicon oxide bonding material with a surface roughness of no more than about 1 nm (rms) on a first element having a second substrate;
bringing into direct contact said first silicon oxide bonding material with said second silicon oxide bonding material;
directly bonding said first silicon oxide bonding material to said second silicon oxide bonding material with a covalent bond;
obtaining a bond strength at about room temperature sufficient to permit removing a portion of said first semiconductor device by one of polishing and grinding to leave a remaining portion of said first semiconductor device after said bonding; and
after said bonding, removing the portion of said first semiconductor device by one of polishing and grinding to leave the remaining portion of said first semiconductor device.
12. A method as recited in claim 11 , comprising:
polishing at least one of said first and second layers.
13. A method as recited in claim 11 , comprising:
forming said second layer on said first element comprising a second semiconductor device.
14. A method as recited in claim 13 , comprising:
connecting said first and second semiconductor devices.
15. A method as recited in claim 11 , comprising:
forming said first and second layers each with a surface roughness of no more than 0.5 nm (rms).
16. A method as recited in claim 11 , comprising:
forming said second layer of silicon oxide bonding material on a silicon substrate.
17. A method as recited in claim 1 , comprising:
directly bonding said first layer of silicon oxide bonding material to a second element without application of external pressure or application of voltage.
18. A method as recited in claim 17 , comprising:
directly bonding said first layer of silicon oxide bonding material to said second element in ambient room pressure and temperature.
19. A method as recited in claim 11 , comprising:
directly bonding said first layer of silicon oxide bonding material to said second layer of silicon oxide bonding material without application of external pressure or application of voltage.
20. A method as recited in claim 19 , comprising:
directly bonding said first layer of silicon oxide bonding material to said second layer of silicon oxide bonding material in ambient room pressure and temperature.
21. The method as recited in claim 1 , further comprising forming a second layer on the first element and forming the first layer on the second layer.
22. The method as recited in claim 21 , further comprising polishing the second layer before forming the first layer.