Photosensitive dry film and process for producing printed wiring board using the same

1. A photosensitive dry film for forming a solder resist layer, comprising:

a supporting film;

a photosensitive resin layer provided on one side of the supporting film; and

a protective film formed on one side of the photosensitive resin layer such that the protective film is on an opposite side with respect to the supporting film,

wherein the one side of the supporting film on which the photosensitive resin layer is provided has an arithmetic average surface roughness Ra in a range of 100 nm to 390 nm, the photosensitive resin comprises at least one thermosetting component selected from the group consisting of isocyanate compound, a blocked isocyanate compound, an amino resin, a maleimide compound, a benzoxazine resin, a carbodiimide resin, a cyclocarbonate compound, a polyfunctional epoxy compound, a polyfunctional oxetane compound, and an episulfide resin, and the protective film comprises at least one selected from the group consisting of a polyester film, a polyethylene film, a polytetrafluoroethylene film, a polypropylene film, and paper subjected to a surface treatment.

2. The photosensitive dry film according to claim 1 , wherein adhesion between the protective film and the photosensitive resin layer is smaller than adhesion between the supporting film and the photosensitive resin layer.

3. The photosensitive dry film according to claim 1 , wherein the photosensitive resin layer has a thickness in a range of 5 μm to 150 μm.

4. The photosensitive dry film according to claim 1 , wherein the supporting film comprises a resin composition comprising a thermoplastic resin and a filler.

5. A process for producing a printed wiring board, comprising:

laminating the photosensitive resin layer of the photosensitive dry film of claim 1 on a board;

exposing the supporting film of the photosensitive dry film from above;

detaching the supporting film from the photosensitive dry film and subsequently developing such that a resin layer patterned on the board is formed; and

curing the patterned resin layer by light irradiation or heat such that a cured coating film is formed,

wherein the cured coating film has a surface having an arithmetic average surface roughness Ra in a range of 100 nm to 390 nm.

6. The photosensitive dry film according to claim 2 , wherein the photosensitive resin layer has a thickness in a range of 5 μm to 150 μm.

7. The photosensitive dry film according to claim 2 , wherein the supporting film comprises a resin composition comprising a thermoplastic resin and a filler.

8. A process for producing a printed wiring board, comprising:

laminating the photosensitive resin layer of the photosensitive dry film of claim 2 on a board;

exposing the supporting film of the photosensitive dry film from above;

detaching the supporting film from the photosensitive dry film and subsequently developing such that a resin layer patterned on the board is formed; and

curing the patterned resin layer by light irradiation or heat such that a cured coating film is formed,

wherein the cured coating film has a surface having an arithmetic average surface roughness Ra in a range of 100 nm to 390 nm.

9. The photosensitive dry film according to claim 3 , wherein the supporting film comprises a resin composition comprising a thermoplastic resin and a filler.

10. A process for producing a printed wiring board from the photosensitive dry film, comprising:

laminating the photosensitive resin layer of the photosensitive dry film of claim 3 on a board;

exposing the supporting film of the photosensitive dry film from above;

detaching the supporting film from the photosensitive dry film and subsequently developing such that a resin layer patterned on the board is formed; and

curing the patterned resin layer by light irradiation or heat such that a cured coating film is formed,

wherein the cured coating film has a surface having an arithmetic average surface roughness Ra in a range of 100 nm to 390 nm.

11. A process for producing a printed wiring board from the photosensitive dry film, comprising:

laminating the photosensitive resin layer of the photosensitive dry film of claim 4 on a board;

exposing the supporting film of the photosensitive dry film from above;

detaching the supporting film from the photosensitive dry film and subsequently developing such that a resin layer patterned on the board is formed; and

curing the patterned resin layer by light irradiation or heat such that a cured coating film is formed,

wherein the cured coating film has a surface having an arithmetic average surface roughness Ra in a range of 100 nm to 390 nm.

12. The photosensitive dry film according to claim 1 , wherein the arithmetic average surface roughness Ra of the one side of the supporting film on which the photosensitive resin layer is provided is in a range of 150 nm to 390 nm.

13. The process according to claim 5 , wherein the arithmetic average surface roughness Ra of the surface of the cured coating film is in a range of 150 nm to 390 nm.

14. The process according to claim 8 , wherein the arithmetic average surface roughness Ra of the surface of the cured coating film is in a range of 150 nm to 390 nm.

15. The process according to claim 10 , wherein the arithmetic average surface roughness Ra of the surface of the cured coating film is in a range of 150 nm to 390 nm.

16. The photosensitive dry film according to claim 2 , wherein the arithmetic average surface roughness Ra of the surface of the cured coating film is in a range of 150 nm to 390 nm.

17. The photosensitive dry film according to claim 3 , wherein the arithmetic average surface roughness Ra of the surface of the cured coating film is in a range of 150 nm to 390 nm.

18. The photosensitive dry film according to claim 4 , wherein the arithmetic average surface roughness Ra of the surface of the cured coating film is in a range of 150 nm to 390 nm.