IP Library Patent Application 14753837
Patent Application
App. No. 14/753,837

SYSTEM AND METHOD FOR THE SONIC-ASSISTED CLEANING OF SUBSTRATES UTILIZING A SONIC-TREATED LIQUID

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Quick Facts
Patent No.
US None
App. No.
14/753,837
Abstract

The present invention is directed to sonic-assisted systems mid methods of processing of substrates utilizing a sonic-treated liquid. In one embodiment, the sonic-treated liquid can be created by subjecting a desired processing liquid to sonic energy generated by a first sonic energy source prior to being applied So the substrate, The sonic-treated liquid is applied to the substrate where a second source of sonic energy applies sonic energy to the substrate. The sonic-treated liquid can be used as the coupling fluid between the second source of sonic energy and the substrate.

Claims (42)

1 . A system for processing substrates comprising:

a support for supporting a substrate;

a vibration transmitter positioned close to and spaced from a surface of a substrate on the support;

a dispenser for providing a liquid between a portion of the vibration transmitter and a surface of a substrate on the support;

a first source of sonic energy for applying sonic energy to the liquid prior to the liquid being provided between the vibration transmitter and the surface of the substrate; and

a second source of sonic energy operably coupled to the vibration transmitter.

2 . The system of claim 1 wherein the support is a rotatable support.

3 . The system of claim 1 further comprising:

a source of the liquid;

a supply line fluidly coupling the liquid source to the dispenser; and

wherein the first source of sonic energy is operably coupled to the supply line at a location between the liquid source and the dispenser.

4 . The system of claim 1 wherein the first source of sonic energy applies sonic energy to the liquid so as to cause cavitations within the liquid.

5 . The system of claim 1 wherein the first source of sonic energy applies sonic energy to the liquid in a manner that achieves a desired bubble size within the liquid.

6 . The system of claim 1 wherein the first source of sonic energy comprises one or more transducers adapted to operate at a first frequency and a first power and the second source of sonic energy comprises one or more transducers adapted to operate a second power and a second frequency.

7 . The system of claim 1 further comprising:

a supply line fluidly coupled to the dispenser; and

wherein the first source of sonic energy comprises one or more transducers acoustically coupled to the supply line.

8 . The system of claim 1 wherein the dispenser provides the liquid so as to form a layer of the liquid on a surface of a substrate on the support, the transmitter being in contact with the layer of the liquid.

9 . The system of claim 1 wherein the transmitter is selected from the group consisting of a pie-shaped transmitter, a rod-like transmitter, a plate transmitter, and a lens transmitter.

10 . The system of claim 1 wherein the transmitter is constructed of quartz, sapphire, boron-nitride or vitreous carbon.

11 . The system of claim 1 further comprising a first dispenser adapted to apply a layer of fluid on a surface of a substrate on the support, the transmitter being in contact with the layer of the fluid.

12 . The system of claim 11 , wherein the liquid dispenser provides the liquid at or near the vibration transmitter and the surface of the substrate.

13 . The system of claim 1 , wherein the portion of the vibration transmitter is an elongated edge portion.

14 . A system for processing substrates comprising:

a support for supporting a substrate;

a first sonic energy source for applying sonic energy to a liquid, thereby creating a sonic-treated liquid;

a second source of sonic energy positioned close to and spaced from a surface of a substrate on the support; and

means for applying the sonic-treated liquid to a surface of a substrate on the support.

15 . The system of claim 1 wherein the second sonic energy source operates at a different power and/or frequency than the first sonic energy source.

16 . A system for processing substrates comprising:

a rotatable support for supporting and rotating a substrate;

a vibration transmitter positioned so that at least a portion of the transmitter is adjacent to a surface of a substrate on the support;

a first dispenser for applying a liquid to the surface of the substrate on the support so as to form a film of liquid on the surface of the substrate that couples the portion of the transmitter to the surface of the substrate;

a first source of sonic energy for applying sonic energy to the liquid prior to the liquid being applied to the surface of the substrate; and

a second source of sonic energy operably coupled to the vibration transmitter.

17 . The system of claim 16 further comprising:

a source of the liquid;

a supply line fluidly coupling the liquid source to the first dispenser; and

wherein the first source of sonic energy is operably coupled to the supply line at a location between the liquid source and the first dispenser.

18 . The system of claim 16 wherein the first source of sonic energy is adapted to apply sonic energy at a power and frequency that cavitates the liquid.

19 . The system of claim 16 wherein the first source of sonic energy comprises one or more transducers adapted to operate at a first frequency and a first power and the second source of sonic energy comprises one or more transducers adapted to operate at a second power and a second frequency.

20 . The system of claim 19 wherein the first power and/or frequency is different from the second power and/or frequency.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2018
From: AKRION SYSTEMS LLC
To: NAURA AKRION INC.
Reel/Frame 045097/0140 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: FAN, YAN
To: AKRION SYSTEMS LLC
Reel/Frame 035939/0606 →