Vertical magnetic barrier for integrated electronic module and related methods

1. An integrated electronic component assembly, comprising:

a first inductor;

a second inductor;

an electrically-conductive structure comprising an integrated circuit die attachment region and pads to which the first and second inductors are mechanically and electrically attached;

an electrically-conductive magnetically-permeable shield located within the integrated electronic component assembly, the electrically-conductive magnetically-permeable shield coupled to the electrically-conductive structure or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second inductors, including a portion extending in a direction out of a plane defined by the pads;

an integrated circuit die mechanically attached to the integrated circuit die attachment region, the integrated circuit including circuitry configured to provide at least a portion of a switched-mode regulator circuit; and

wherein the first inductor comprises a storage inductor conductively coupled to the integrated circuit die;

wherein the second inductor comprises a portion a notch filter circuit; and

wherein the electrically-conductive magnetically-permeable shield is configured to stabilize a notch frequency established by the notch filter circuit as compared to an integrated electronic component assembly lacking the electrically-conductive magnetically-permeable shield.

2. The integrated electronic component assembly of claim 1 , wherein the electrically-conductive structure includes a metallization layer coupled to a first dielectric material, the first dielectric material comprising a substrate for the integrated electronic component assembly.

3. The integrated electronic component assembly of claim 1 , wherein the electrically-conductive structure includes an electrically-conductive lead frame.

4. The integrated electronic component assembly of claim 2 , further comprising an encapsulant;

wherein the first and second inductors and the electrically-conductive magnetically-permeable shield are encapsulated by the encapsulant.

5. The integrated electronic component assembly of claim 2 , further comprising a housing;

wherein the first and second inductors and the shield are located within a cavity defined at least in part by the housing.

6. The integrated electronic component assembly of claim 3 , wherein the electrically-conductive magnetically-permeable shield is defined by a portion of the electrically-conductive lead frame.

7. The integrated electronic component assembly of claim 4 , wherein the first and second inductors and the electrically-conductive magnetically-permeable shield are located in a cavity within the encapsulant.

8. The integrated electronic component assembly of claim 6 , wherein the electrically-conductive magnetically-permeable shield is defined by a plated portion of the electrically-conductive lead frame, the plated portion comprising a magnetically-permeable plating material.

9. A method for forming an integrated electronic component assembly, the method comprising:

forming an electrically-conductive structure comprising an integrated circuit die attachment region and pads to which first and second inductors are mechanically and electrically attached: and

forming an electrically-conductive magnetically-permeable shield located within the integrated electronic component assembly, the electrically-conductive magnetically-permeable shield coupled to the electrically-conductive structure or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second inductors, including a portion extending in a direction out of a plane defined by the first and second component attachment regions; and

mechanically attaching an integrated circuit die to the integrated circuit die attachment region, the integrated circuit including circuitry configured to provide at least a portion of a switched-mode regulator circuit;

wherein the first inductor comprises a storage inductor conductively coupled to the integrated circuit die;

wherein the second inductor comprises a portion a notch filter circuit; and

wherein the electrically-conductive magnetically-permeable shield is configured to stabilize a notch frequency established by the notch filter circuit as compared to an integrated electronic component assembly lacking the electrically-conductive magnetically-permeable shield.

10. The method of claim 9 , further comprising encapsulating the first and second inductors and the electrically-conductive magnetically-permeable shield using an encapsulant.

11. The method of claim 9 , further comprising forming a housing;

wherein the first and second inductors and the shield are located within a cavity defined at least in part by the housing.

12. The method of claim 9 , wherein the electrically-conductive structure includes a metallization layer coupled to a first dielectric material, the first dielectric material comprising a substrate for the integrated electronic component assembly;

wherein the metallization layer comprises plated regions and interconnections.

13. The method of claim 9 , wherein forming the electrically-conductive structure includes forming an electrically-conductive lead frame.

14. The method of claim 10 , wherein the first and second inductors and the electrically-conductive magnetically-permeable shield are located in a cavity within the encapsulant.

15. The method of claim 13 , wherein the electrically-conductive magnetically-permeable shield is defined by a portion of the electrically-conductive lead frame.

16. The method of claim 15 , wherein the electrically-conductive magnetically-permeable shield is defined by a plated portion of the electrically-conductive lead frame, the plated portion comprising a magnetically-permeable plating material.

17. A method of operating a switched-mode regulator circuit included in an integrated electronic component assembly, comprising:

storing energy in a first inductor electrically and mechanically coupled to first pads, the first inductor forming a portion of the switched-mode regulator circuit;

filtering an output of the switched-mode regulator circuit using a notch filter comprising a second inductor, the second inductor electrically and mechanically coupled to second pads;

suppressing magnetic coupling between the first and second inductors using an electrically-conductive, magnetically-permeable shield located within the integrated electronic component assembly and located between the first and second inductors, the electrically-conductive magnetically-permeable shield including a portion extending in a direction out of a plane defined by the first pads and the second pads;

wherein an integrated circuit comprising at least a portion of the switched-mode regulator circuit, the first inductor, the second inductor, and the electrically-conductive magnetically-permeable shield are located within the integrated electronic component assembly; and

wherein the electrically-conductive magnetically-permeable shield is coupled to an electrically-conductive structure or defined by the electrically-conductive structure, the electrically-conductive structure comprising the first pads, the second pads, and an integrated circuit die attachment region to which the integrated circuit is attached.

18. The method of claim 17 , wherein the electrically-conductive magnetically-permeable shield is coupled to an electrically-conductive structure.

19. The method of claim 17 , wherein the electrically-conductive magnetically-permeable shield is defined by the electrically-conductive structure.

20. The method of claim 19 , wherein the electrically-conductive magnetically-permeable shield is defined by a portion of an electrically-conductive lead frame.