IP Library Granted Patent US 9,885,670
Granted Patent B2
US 9,885,670 · App. 14/758,054 · Granted Feb 6, 2018

Inspection apparatus and adjusting method

Inventor: Takahiro Jingu (Tokyo, JP)
Assignee: Hitachi High-Technologies Corporation
G01N21/9501G01N21/956G01N21/93G01N2201/127
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Quick Facts
Patent No.
US 9,885,670
App. No.
14/758,054
Granted
Feb 6, 2018
Kind
B2
Abstract

An inspection apparatus which can be accurately calibrated regardless of a use environment or an amount of use time is implemented. A reference substrate 100 provided with a diffraction grating 107 is mounted on a transport system 110 , an illumination region 106 is formed on the diffraction grating 107 by light 105 from an illumination optical system 104 , reflected light is collected by a detection optical system 108 , and an output value from a sensor 111 is measured. It is determined whether or not a difference between a simulation value preserved in a processing section 112 and the output value from the sensor 111 is within a predetermined allowable range, and the optical system is adjusted so that the difference enters the allowable range. Since standard data for performing calibration on the inspection apparatus is obtained by using the diffraction grating, it is possible to implement the inspection apparatus which can be accurately calibrated regardless of a use environment or an amount of use time.

Claims (54)

1. An inspection apparatus comprising:

an illumination optical system that forms an illumination region by using illumination light;

a detection optical system that detects light from a sample; and

a processing section that performs adjustment on the detection optical system by using light emitted from a first diffraction pattern when the illumination region is formed on the first diffraction pattern, wherein

the inspection apparatus is calibrated without regard to particle size by adjusting an amount of the illumination light in a stepped fashion when the inspection apparatus is adjusted, the stepped illumination being carried oud by the illumination optical system forming the illumination region and by setting an amount of the illumination light to a first illumination light amount, thereafter, the processing section performing the adjustment on the detection optical system, the illumination optical system forming the illumination region by changing the amount of the illumination light to a second illumination light amount smaller than the first illumination light amount, thereafter, the processing section performing the adjustment on the detection optical system.

2. The inspection apparatus according to claim 1 , wherein the processing section compares simulation data stored in the processing section with an output data from the illumination optical system, performing adjustment on the detection optical system to make difference between the simulation data and the output data from the illumination optical system to be within an allowable range.

3. The inspection apparatus according to claim 2 , wherein the detection optical system includes a first detection optical section, and a second detection optical section which is disposed at a position which is different from a position of the first detection optical section, and

wherein the processing section performs calibration on the first detection optical section and the second detection optical section.

4. The inspection apparatus according to claim 3 , further comprising:

a support stand on which the sample is placed,

wherein the first diffraction pattern is formed on the support stand, and

wherein the support stand is rotated when the processing section performs the adjustment.

5. The inspection apparatus according to claim 4 , wherein a second diffraction pattern is formed on the support stand.

6. The inspection apparatus according to claim 5 , wherein a height of the first diffraction pattern is different from a height of the second diffraction pattern.

7. The inspection apparatus according to claim 6 , wherein a pitch of the first diffraction pattern is different from a pitch of the second diffraction pattern.

8. The inspection apparatus according to claim 7 , wherein the adjustment includes changing a size of a first aperture of the first detection optical section and changing a size of a second aperture of the second detection optical section.

9. The inspection apparatus according to claim 8 , wherein the adjustment includes changing a position of the first aperture and changing a position of the second aperture.

10. The inspection apparatus according to claim 9 , wherein the adjustment includes changing installation of a lens of the first detection optical section and changing installation of a lens of the second detection optical section.

11. The inspection apparatus according to claim 1 , wherein the detection optical system includes a first detection optical section, and a second detection optical section which is disposed at a position which is different from a position of the first detection optical section, and

wherein the processing section performs adjustment on the first detection optical section and the second detection optical section.

12. The inspection apparatus according to claim 1 , further comprising:

a support stand on which the sample is placed, wherein

the first diffraction pattern is formed on the support stand, and

wherein the support stand is rotated when the processing section performs the adjustment.

13. The inspection apparatus according to claim 12 , wherein a second diffraction pattern is formed on the support stand.

14. The inspection apparatus according to claim 13 , wherein a height of the first diffraction pattern is different from a height of the second diffraction pattern.

15. The inspection apparatus according to claim 13 , wherein a pitch of the first diffraction pattern is different from a pitch of the second diffraction pattern.

16. The inspection apparatus according to claim 1 , wherein the adjustment includes changing a size of an aperture of the detection optical system.

17. The inspection apparatus according to claim 1 , wherein the adjustment includes changing a position of an aperture of the detection optical system.

18. The inspection apparatus according to claim 1 , wherein the adjustment includes changing installation of a lens of the detection optical system.

19. An adjusting method comprising:

supplying illumination light to a first diffraction pattern;

forming an illumination region on the first diffraction pattern; and

performing calibration on a detection optical system by using light emitted from the first diffraction pattern when the illumination region is formed on the first diffraction pattern, wherein

the calibration of the detection optical system is performed without regard to particle size by adjusting an amount of the illumination light in a stepped fashion when the inspection apparatus is adjusted, the stepped illumination being carried oud by setting an amount of the illumination light to a first illumination light amount, thereafter, the amount of the illumination light is changed to a second illumination light amount smaller than the first illumination light amount.

20. The adjusting method according to claim 19 , wherein an output data from the illumination optical system is compared with simulation data previously stored in a processing section, the calibration on the detection optical system is performed to make difference between the simulation data and the output data from the illumination optical system to be within an allowable range.

21. The adjusting method according to claim 20 , wherein the detection optical system includes a first detection optical section, and a second detection optical section which is disposed at a position which is different from a position of the first detection optical section, and

wherein the calibration includes calibration of the first detection optical section and the second detection optical section.

22. The adjusting method according to claim 21 , wherein the first diffraction pattern is rotated when the calibration is performed.

23. The adjusting method according to claim 22 , wherein the calibration is performed by using a second diffraction pattern of a different type from the first diffraction pattern.

24. The adjusting method according to claim 23 , wherein a height of the first diffraction pattern is different from a height of the second diffraction pattern.

25. The adjusting method according to claim 24 , wherein a pitch of the first diffraction pattern is different from a pitch of the second diffraction pattern.

26. The adjusting method according to claim 25 , wherein the calibration includes changing a size of a first aperture of the first detection optical section and changing a size of a second aperture of the second detection optical section.

27. The adjusting method according to claim 26 , wherein the calibration includes changing a position of the first aperture and changing a position of the second aperture.

28. The adjusting method according to claim 27 , wherein the calibration includes changing installation of a lens of the first detection optical section and changing installation of a lens of the second detection optical section.

29. The adjusting method according to claim 19 , wherein the detection optical system includes a first detection optical section, and a second detection optical section which is disposed at a position which is different from a position of the first detection optical section, and

wherein the calibration includes adjustment of the first detection optical section and the second detection optical section.

30. The adjusting method according to claim 19 , wherein the first diffraction pattern is rotated when the calibration is performed.

31. The adjusting method according to claim 19 , wherein the calibration is performed by using a second diffraction pattern of a different type from the first diffraction pattern.

32. The adjusting method according to claim 31 , wherein a height of the first diffraction pattern is different from a height of the second diffraction pattern.

33. The adjusting method according to claim 31 , wherein a pitch of the first diffraction pattern is different from a pitch of the second diffraction pattern.

34. The adjusting method according to claim 19 , wherein the calibration includes changing a size of an aperture of the detection optical system.

35. The adjusting method according to claim 19 , wherein the calibration includes changing a position of an aperture of the detection optical system.

36. The adjusting method according to claim 19 , wherein the calibration includes changing installation of a lens of the detection optical system.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2015
From: JINGU, TAKAHIRO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 035917/0331 →
Priority Claims (1)
JP 2013-003961 · Jan 11, 2013 · national
Continuity (1)
Related Publication 20150346112A1 · Dec 3, 2015