High thermal conductivity materials for thermal management applications
High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit ( 304 ) and a thermally conductive unit ( 306, 308, 310 ) in thermal communication with the heat generating unit ( 304 ) for conducting heat generated by the heat generating unit ( 304 ) away from the heat generating unit ( 304 ), the thermally conductive unit ( 306, 308, 310 ) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.
1. An electronic device comprising:
a heat spreader having a first side and a second side opposite the first side;
a heat generating unit disposed on the first side of the heat spreader in thermal communication with the heat spreader; and
a heat sink disposed on the second side of the heat spreader in thermal communications with the heat spreader,
wherein at least one of the heat spreader and the heat sink comprise a high thermal conductivity material having a room temperature thermal conductivity of at least 230 W/mK;
wherein the high thermal conductivity material comprises one or more light atoms and a heavy atom,
wherein the one or more light atoms are selected from the group consisting of Beryllium (Be), Boron (B), Carbon (C), and Nitrogen (N);
wherein the heavy atom element is selected from the group consisting of Arsenic (As), Gallium (Ga), Antimony (Sb), Selenium (Se), Vanadium (V), Yttrium (Y), Niobium (Nb), Tantalum (Ta), Chromium (Cr), Molybdenum (Mo), and Zirconium (Zr); and
wherein the heavy atom is between 4 and 17 times heavier than the light atom.
2. The electronic device of claim 1 , wherein the high thermal conductivity material is cubic Boron Arsenide (BAs).
3. The electronic device of claim 1 , wherein the heavy atom is at least 70% isotopically pure.
4. The electronic device of claim 1 , wherein the heavy atom is at least 90% isotopically pure.
5. An electronic device comprising:
a heat spreader having a first side and a second side opposite the first side;
a heat generating unit disposed on the first side of the heat spreader in thermal communication with the heat spreader; and
a heat sink disposed on the second side of the heat spreader in thermal communications with the heat spreader,
wherein at least one of the heat spreader and the heat sink comprise a high thermal conductivity material;
wherein the high thermal conductivity material is Boron Antimonide (BSb) or Beryllium Selenide (BeSe).