IP Library Granted Patent US 10,299,414
Granted Patent B2
US 10,299,414 · App. 14/764,055 · Granted May 21, 2019

Cooling mechanism for data center

Inventors: Hiroyuki Shiraiwa (Miyakonojo, JP); Hidetoshi Kaneo (Sunto-gun, JP)
Assignees: HIDETOSHI KANEO; INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY
H05K7/20827F25B25/005H05K7/20309H05K7/20318
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Quick Facts
Patent No.
US 10,299,414
App. No.
14/764,055
Granted
May 21, 2019
Kind
B2
Abstract

[Problem to be Solved] A technical object is to develop a novel cooling mechanism for a data center that can be operated at low running costs, can eliminate dust penetration, water droplet occurrence, and water leakage, can reduce temperature unevenness in the indoor space, and can achieve prompt fire extinction with little damage even in the case where a fire breaks out. [Solution] Provided is a cooling mechanism for a data center, including: an evaporative condenser and a liquid receiver arranged outside of the data center; and an evaporator arranged in an indoor space of the data center. The indoor space is cooled by evaporating a refrigerant in the evaporator, and the refrigerant is condensed by the evaporative condenser.

Claims (12)

1. A cooling mechanism for a data center, the cooling mechanism comprising:

a primary cooling cycle including, outside of the data center, a reciprocating compressor, a first evaporative condenser, a high-pressure liquid receiver, a liquid level controlling mechanism, a low-pressure liquid receiver, and a cascade condenser, and the primary cooling cycle further including a bypass pipe line for bypassing the reciprocating compressor; and

a secondary cooling cycle formed as a loop circuit, the secondary cooling cycle including (i) an evaporator arranged in an indoor space of the data center, the evaporator being connected to a liquid receiver and a liquid pump by pipe lines in the loop circuit, (ii) a second evaporative condenser directly connected via a refrigerant conduit to the liquid receiver in the secondary cooling cycle in parallel to the cascade condenser, and (iii) carbon dioxide as a secondary refrigerant condensed by the cascade condenser downstream of the evaporator, the cascade condenser being directly connected to the liquid receiver in the secondary cooling cycle, wherein:

the evaporator is configured to evaporate the secondary refrigerant so as to cool the indoor space,

the first evaporative condenser is configured to condense a primary refrigerant, and

the primary cooling cycle is configured to stop the compressor and open the bypass pipe line for bypassing the compressor in response to a condensation temperature of the first evaporative condenser being equal to or lower than a predetermined temperature so as to circulate the primary refrigerant without operating the compressor and cool the indoor space with the secondary refrigerant, the second refrigerant having been condensed by the cascade condenser in the secondary cooling cycle.

2. The cooling mechanism for the data center according to claim 1 , wherein the cascade condenser is disposed within the liquid receiver in the secondary cooling cycle.

3. The cooling mechanism for the data center according to claim 1 , wherein the second cooling cycle includes at least one blowoff valve configured to blow off the secondary refrigerant in the indoor space.

4. The cooling mechanism for the data center according to claim 1 , wherein

the evaporator is surrounded by an upright partition wall configured to produce an inverse stack effect, and

when air in the vicinity of the evaporator is cooled, high-temperature air existing in an upper part of the indoor space of the data center is drawn toward the evaporator without using a fan, the high-temperature air is cooled, and then the cooled air is discharged downward.

5. The cooling mechanism for the data center according to claim 4 , wherein a lower part of the partition wall is provided with an extension/contraction part.

Assignments (2)
CHANGE OF NAME Recorded Nov 28, 2017
From: HACHIYO ENGINEERING CO., LTD.
To: HIDETOSHI KANEO
Reel/Frame 044236/0746 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2015
From: SHIRAIWA, HIROYUKI; KANEO, HIDETOSHI
To: HACHIYO ENGINEERING CO., LTD.; INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JAPAN
Reel/Frame 036197/0875 →
Priority Claims (2)
JP 2013-024376 · Feb 12, 2013 · national
JP 2013-126770 · Jun 17, 2013 · national
Continuity (1)
Related Publication 20160014934A1 · Jan 14, 2016