IP Library Granted Patent US 10,049,858
Granted Patent B2
US 10,049,858 · App. 14/771,525 · Granted Aug 14, 2018

System and method for protection of vacuum seals in plasma processing systems

Inventors: Vladimir Nagorny (Tracy, CA); Steven Parks (Fremont, CA); Martin Zucker (Orinda, CA)
Assignee: MATTSON TECHNOLOGY, INC.
H01J37/32513H01J37/321H01J37/32522H01J2237/166
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Quick Facts
Patent No.
US 10,049,858
App. No.
14/771,525
Granted
Aug 14, 2018
Kind
B2
Abstract

Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber defining a sidewall and an inductive coil wrapped around at least a portion of the sidewall. A vacuum seal can be positioned between the sidewall of the vacuum chamber and a heat sink. A thermally conductive bridge can be coupled between the sidewall and heat sink. Further, the thermally conductive bridge can be positioned relative to the vacuum seal such that the thermally conductive bridge redirects a conductive heat path from the sidewall or any heat source to the heat sink so that the heat path bypasses the vacuum seal.

Claims (23)

1. A plasma processing system, comprising:

a vacuum chamber defining a sidewall;

an inductive coil disposed adjacent the sidewall configured to induce a plasma in the vacuum chamber;

a Faraday shield disposed between the inductive coil and the sidewall;

a vacuum seal coupling the sidewall of the vacuum chamber to a heat sink, the heat sink comprising the Faraday shield; and

a thermally conductive bridge coupled between the sidewall and the Faraday shield;

wherein the thermally conductive bridge is positioned relative to the vacuum seal such that the thermally conductive bridge redirects a conductive heat path from a heat source to the Faraday shield so that the heat path bypasses the vacuum seal.

2. The plasma processing system of claim 1 , wherein the bridge is flexible and conformable to the shape of the vacuum seal and vacuum chamber.

3. The plasma processing system of claim 2 , wherein the bridge is elastic so that a contact to the heat source and to the Faraday shield can be made by compressing the bridge in at least one direction.

4. The plasma processing system of claim 3 , wherein the bridge comprises a first component for making contact with the heat source and a second component for making contact with the Faraday shield.

5. The plasma processing system of claim 1 , wherein the bridge comprises a heat conducting component and elastic component coupled to the heat conducting component.

6. The plasma processing system of claim 1 , wherein the heat path conducts through at least a portion of the sidewall.

7. The plasma processing system of claim 1 , wherein the thermally conductive bridge is positioned so that the heat path bypasses a portion of the sidewall abutting the vacuum seal.

8. The plasma processing system of claim 1 , where the sidewall is mechanically connected to the top cap of the vacuum chamber by the vacuum seal and the bridge.

9. The plasma processing system of claim 1 , wherein the heat sink comprises a top cap of the plasma chamber.

10. The plasma processing system of claim 1 , wherein the heat sink comprises a top plate of a plasma processing chamber in communication with the vacuum chamber.

11. The plasma processing system of claim 1 , wherein the sidewall comprises a quartz material.

12. The plasma processing system of claim 1 , wherein the plasma processing system comprises a plasma screen proximate to the vacuum seal.

13. The plasma processing system of claim 1 , wherein the bridge is located between the inductive coil and the vacuum seal.

14. The plasma processing system of claim 1 , wherein the bridge is separated from the vacuum seal by a washer.

15. The plasma processing system of claim 1 , wherein the bridge comprises a heat conducting component and a flexible component coupled to the heat conducting component.

16. The plasma processing system of claim 1 , wherein the bridge comprises a spring loaded C-clamp.

17. The plasma processing system of claim 16 , wherein the spring loaded C-clamp has a plurality of cuts.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2021
From: EAST WEST BANK
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 055950/0452 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2019
From: MATTSON TECHNOLOGY, INC.
To: MATTSON TECHNOLOGY, INC.; BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
Reel/Frame 050582/0796 →
SECURITY INTEREST Recorded Aug 27, 2018
From: MATTSON TECHNOLOGY, INC.
To: EAST WEST BANK
Reel/Frame 046956/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2015
From: NAGORNY, VLADIMIR; PARKS, STEVEN; ZUCKER, MARTIN
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 036517/0474 →
Continuity (2)
Provisional Application 61821326 · May 9, 2013
Related Publication 20160013025A1 · Jan 14, 2016
Cited By (1)
US 12,562,342