Pressure sensing implant
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
1. A circuit comprising:
a housing having a plurality of walls that defines a cavity and an opening;
a sensor connected to said opening in said housing, said sensor comprising:
a lid wafer including at least one electrode and having a first dimension;
a base wafer including at least one electrode and being bonded to said lid wafer, said base wafer having a second dimension shorter than said first dimension; and
wherein said base wafer is positioned entirely within said cavity defined by said housing and a surface of said lid wafer is exposed to an exterior of said housing.
2. The circuit of claim 1 , wherein said sensor is a pressure sensor.
3. The circuit of claim 2 , wherein said pressure sensor is a capacitive pressure sensor.
4. The circuit of claim 1 , wherein said sensor is connected to said opening to hermetically seal said housing.
5. The circuit of claim 1 , wherein a second surface of said lid wafer is accessible from inside said housing.
6. The circuit of claim 1 , wherein said lid wafer, said base wafer, and said housing are comprised of any combination of glass, silicon, or ceramic.
7. The circuit of claim 1 , wherein an antenna is located within said housing.
8. The circuit of claim 7 , wherein an antenna axis is substantially parallel to at least one wall of said housing.
9. The circuit of claim 1 , wherein said circuit is configured to be implanted in a blood vessel.
10. The circuit of claim 1 , wherein said housing is filled with a substance selected from a group including: liquid, gel, vacuum, inert gas, or air.
11. The circuit of claim 1 , wherein the sensor is a capacitive pressure sensor wherein a second surface of said lid wafer is bonded to a first surface of said base wafer.
12. The circuit of claim 11 , further comprising at least one electrical contact on said second surface of said lid wafer.
13. The circuit of claim 12 , further comprising at least one electrical contact on said first surface of said base wafer wherein the at least one electrical contact on said second surface of said lid wafer and said at least one electrical contacts on said first surface of said base wafer are contained within a bondline.
14. A circuit comprising:
a housing having a plurality of walls that defines a cavity and an opening;
a sensor connected to said opening to form a hermetic seal in said housing, said sensor comprising:
a lid wafer having a first dimension, a first surface, and a second surface wherein said first surface is exposed to an exterior of said housing, at least one electrode positioned on said second surface of said lid wafer;
a base wafer having a first surface bonded to said second surface of said lid wafer and having a second dimension shorter than said first dimension, at least one electrode positioned on said first surface of said base wafer; and
wherein said at least one electrode on said second surface of said lid wafer and said at least one electrode on said first surface of said base wafer are contained within a bondline defined between the base wafer and the lid wafer; and
wherein said base wafer is positioned entirely within said cavity defined by said housing.
15. The circuit of claim 14 further comprising a cavity between the lid wafer and base wafer.