Memory cell having isolated charge sites and method of fabricating same
View Patent ↗Memory cells having isolated charge sites and methods of fabricating memory cells having isolated charge sites are described. In an example, a nonvolatile charge trap memory device includes a substrate having a channel region, a source region and a drain region. A gate stack is disposed above the substrate, over the channel region. The gate stack includes a tunnel dielectric layer disposed above the channel region, a first charge-trapping region and a second charge-trapping region. The regions are disposed above the tunnel dielectric layer and separated by a distance. The gate stack also includes an isolating dielectric layer disposed above the tunnel dielectric layer and between the first charge-trapping region and the second charge-trapping region. A gate dielectric layer is disposed above the first charge-trapping region, the second charge-trapping region and the isolating dielectric layer. A gate electrode is disposed above the gate dielectric layer.
1. A nonvolatile charge trap memory device, comprising:
a substrate having a channel region, a source region and a drain region; and
a gate stack disposed above the substrate, over the channel region, wherein the gate stack comprises:
a tunnel dielectric layer disposed above the channel region, the tunnel dielectric layer having outermost sidewalls;
a first charge-trapping region and a second charge-trapping region, the first and second charge-trapping regions disposed above the tunnel dielectric layer and separated by a distance, and the first and second charge-trapping regions having outermost sidewalls in vertical alignment with the outermost sidewalls of the tunnel dielectric layer;
an isolating dielectric layer disposed above the tunnel dielectric layer and between the first charge-trapping region and the second charge-trapping region;
a gate dielectric layer disposed above the first charge-trapping region, the second charge-trapping region and the isolating dielectric layer; and
a gate electrode disposed above the gate dielectric layer.
2. The nonvolatile charge trap memory device of claim 1 , wherein the isolating dielectric layer both physically and electrically isolates the first charge-trapping region from the second charge-trapping region.
3. The nonvolatile charge trap memory device of claim 1 , wherein the distance between the first charge-trapping region and the second charge-trapping region is approximately in the range of 3-20 nanometers.
4. The nonvolatile charge trap memory device of claim 1 , wherein the isolating dielectric layer comprises silicon oxide or silicon dioxide.
5. The nonvolatile charge trap memory device of claim 1 , wherein the gate dielectric layer comprises a high-k dielectric material.
6. The nonvolatile charge trap memory device of claim 1 , wherein the gate electrode is a metal gate electrode.
7. The nonvolatile charge trap memory device of claim 1 , wherein the nonvolatile charge trap memory device is a SONOS-type device.
8. The nonvolatile charge trap memory device of claim 7 , wherein the source region, the drain region and the gate electrode are N-type, and the SONOS-type device is an N-type SONOS-type device.
9. A nonvolatile charge trap memory device, comprising:
a substrate having a channel region, a source region and a drain region; and
a gate stack disposed above the substrate, over the channel region, wherein the gate stack comprises:
a first tunnel dielectric layer region and a second tunnel dielectric layer region disposed above the channel region and separated by a distance;
a first charge-trapping region and a second charge-trapping region, the first and second charge-trapping regions disposed above the first tunnel dielectric layer region and second tunnel dielectric layer region, respectively, and separated by the distance, wherein the first and second charge-trapping regions have outermost sidewalls, and the first tunnel dielectric layer region and second tunnel dielectric layer region are along at least a portion of the outermost sidewalls of the first and second charge-trapping regions, respectively;
an isolating dielectric layer disposed above the channel region, between the first charge-trapping region and the second charge-trapping region, and between the first tunnel dielectric layer region and the second tunnel dielectric layer region;
a gate dielectric layer disposed above the first charge-trapping region, the second charge-trapping region and the isolating dielectric layer; and
a gate electrode disposed above the gate dielectric layer.
10. The nonvolatile charge trap memory device of claim 9 , wherein the isolating dielectric layer both physically and electrically isolates the first charge-trapping region from the second charge-trapping region.
11. The nonvolatile charge trap memory device of claim 9 , wherein the distance between the first charge-trapping region and the second charge-trapping region is approximately in the range of 3-20 nanometers.
12. The nonvolatile charge trap memory device of claim 9 , wherein the isolating dielectric layer comprises silicon oxide or silicon dioxide.
13. The nonvolatile charge trap memory device of claim 9 , wherein the gate dielectric layer comprises a high-k dielectric material.
14. The nonvolatile charge trap memory device of claim 9 , wherein the gate electrode is a metal gate electrode.
15. The nonvolatile charge trap memory device of claim 9 , wherein the nonvolatile charge trap memory device is a SONOS-type device.
16. The nonvolatile charge trap memory device of claim 15 , wherein the source region, the drain region and the gate electrode are N-type, and the SONOS-type device is an N-type SONOS-type device.
17. The nonvolatile charge trap memory device of claim 9 , wherein the first tunnel dielectric layer region and second tunnel dielectric layer region are along the entire outermost sidewalls of the first and second charge-trapping regions, respectively.
18. A nonvolatile charge trap memory device, comprising:
a substrate having a channel region, a source region and a drain region; and
a gate stack disposed above the substrate, over the channel region, wherein the gate stack comprises:
a first tunnel dielectric layer region and a second tunnel dielectric layer region disposed above the channel region and separated by a distance;
a first charge-trapping region and a second charge-trapping region, the regions disposed above the first tunnel dielectric layer region and second tunnel dielectric layer region, respectively, and separated by the distance, wherein the first tunnel dielectric layer region further extends along an outer sidewall of the first charge-trapping region, and the second tunnel dielectric layer region further extends along an outer sidewall of the second charge-trapping region;
an isolating dielectric layer disposed above the channel region, between the first charge-trapping region and the second charge-trapping region, and between the first tunnel dielectric layer region and the second tunnel dielectric layer region;
a gate dielectric layer disposed above the first charge-trapping region, the second charge-trapping region and the isolating dielectric layer; and
a gate electrode disposed above the gate dielectric layer.
19. The nonvolatile charge trap memory device of claim 18 , wherein the isolating dielectric layer both physically and electrically isolates the first charge-trapping region from the second charge-trapping region.
20. The nonvolatile charge trap memory device of claim 18 , wherein the distance between the first charge-trapping region and the second charge-trapping region is approximately in the range of 3-20 nanometers.