Method and system for real-time in-process measurement of coating thickness
The present disclosure is generally directed to methods and systems for measuring the thickness of coatings or thin films on various substrates. For example, one disclosed method includes the steps of providing and directing light waves of varying wavelengths toward a moving substrate comprising a coating, linearly polarizing the light waves, converting the linearly polarized light waves to circularly polarized light waves, analyzing elliptically polarized light waves reflected by the moving substrate, capturing analyzed light waves, generating light wave data based on the captured light waves, and determining a thickness of the coating based on the light wave data.
1. A method comprising:
providing and directing light waves of varying wavelengths toward a moving substrate comprising a coating;
linearly polarizing the light waves;
converting the linearly polarized light waves to circularly polarized light waves;
analyzing elliptically polarized light waves reflected by the moving substrate;
capturing analyzed light waves;
generating light wave data based on the captured light waves; and
determining a thickness of the coating based on the light wave data.
2. The method of claim 1 , wherein the coating is less than 0.2 microns thick.
3. The method of claim 1 , wherein the coating is a lubricious coating.
4. The method of claim 1 , wherein the coating is a liquid coating.
5. The method of claim 1 , wherein determining the thickness of the coating based on the light wave data comprises determining phase shift and polarization state changes of the captured light waves compared to the provided light waves based on the light wave data.
6. The method of claim 1 , wherein determining the thickness of the coating based on the light wave data comprises applying the Levenberg-Marquardt algorithm to match the light wave data with a theoretical model.
7. The method of claim 1 , further comprising:
detecting a disturbance in the movement of the substrate based on the light wave data; and
adjusting a position or an orientation of an analyzer or adjusting a position or an orientation of a detector based on the detected disturbance.
8. The method of claim 1 , further comprising:
detecting a disturbance in the movement of the substrate based on the light wave data; and
adjusting a position or an orientation of an analyzer and adjusting a position or an orientation of a detector based on the detected disturbance.
9. The method of claim 1 , further comprising adjusting the intensity of the provided light waves based on the light wave data.