Field-effect transistor
View Patent ↗A field-effect transistor includes a codoped layer made of Al x Ga 1-x N (0≦x≦1) and formed on a p-type Si substrate, a GaN layer formed on the codoped layer, and an AlGaN layer formed on the GaN layer. The codoped layer contains C and Si as impurity elements. The impurity concentration of C in the codoped layer is equal to or higher than 5×10 17 /cm 3 . The impurity concentration of Si in the codoped layer is lower than the impurity concentration of C. The impurity concentration of C in the GaN layer is equal to or lower than 1×10 17 /cm 3 . The thickness of the GaN layer is equal to or greater than 0.75 μm.
1. A field-effect transistor comprising:
a first semiconductor layer made of a first nitride semiconductor and formed on a substrate;
a second semiconductor layer made of a second nitride semiconductor and formed on the first semiconductor layer; and
a third semiconductor layer made of a third nitride semiconductor with a band gap wider than that of the second nitride semiconductor and formed on the second semiconductor layer, wherein:
the first semiconductor layer includes carbon (C) and Si as impurity elements,
an impurity concentration of carbon (C) in the first semiconductor layer is equal to or higher than 5×10 17 /cm 3 ,
an impurity concentration of Si in the first semiconductor layer is lower than the impurity concentration of carbon (C) in the first semiconductor layer,
an impurity concentration of carbon (C) in the second semiconductor layer is equal to or lower than 1×10 17 /cm 3 , and
a thickness of the second semiconductor layer is equal to or greater than 0.75 μm.
2. The field-effect transistor according to claim 1 , wherein
the first nitride semiconductor is made of Al x Ga 1-x N (0≦x≦1),
the second nitride semiconductor is made of GaN, and
the third nitride semiconductor is made of AlGaN.
3. The field-effect transistor according to claim 1 , wherein
the first nitride semiconductor is made of Al x Ga 1-x N (0≦x≦1) and Al y Ga 1-y N (0≦y≦1, x≠y),
the first semiconductor layer is a superlattice layer made of the first nitride semiconductor,
the second nitride semiconductor is made of GaN, and
the third nitride semiconductor is made of AlGaN.
4. A field-effect transistor comprising:
a first semiconductor layer made of a first nitride semiconductor and layered on a substrate;
a second semiconductor layer made of a second nitride semiconductor and formed on the first semiconductor layer; and
a third semiconductor layer made of a third nitride semiconductor with a band gap wider than that of the second nitride semiconductor and formed on the second semiconductor layer, wherein:
the first semiconductor layer contains:
a first impurity having an ionization energy Ea and a concentration Na; and
a second impurity having an ionization energy Ed smaller than the ionization energy Ea, and a concentration Nd smaller than the concentration Na,
a trap level is formed at the first semiconductor layer, the trap level having an activation energy greater than a sum of the ionization energy Ea and the ionization energy Ed,
an impurity concentration of carbon (C) in the second semiconductor layer is equal to or lower than 1×10 17 /cm 3 , and
a thickness of the second semiconductor layer is equal to or greater than 0.75 μm.
5. The field-effect transistor according to claim 4 , wherein
the first nitride semiconductor is made of Al x Ga 1-x N (0≦x≦1),
the second nitride semiconductor is made of GaN, and
the third nitride semiconductor is made of AlGaN.
6. The field-effect transistor according to claim 4 , wherein
the first nitride semiconductor is formed by Al x Ga 1-x N (0≦x≦1) and Al y Ga 1-y N (0≦y≦1, x≈y),
the first semiconductor layer is a superlattice layer made of the first nitride semiconductor,
the second nitride semiconductor is made of GaN, and
the third nitride semiconductor is made of AlGaN.