Active cryogenic electronic envelope
A data acquisition module is disclosed for use with electronic components such as superconductive magnets wherein the electronic components and the data acquisition module may reside inside a cryostat. The data acquisition module allows conventional electronic technologies to work inside cryostats at cryogenic temperatures as low as 4° K. This is achieved by management of heat inside the module to keep the module operating at a temperature above the cryogenic temperature. This approach avoids the difficulties that arise from changes in carrier mobility in semiconductors operating at deep cryogenic temperatures. A cryogenic system comprises a cryostat containing a cryogenic fluid and at least one sensor, and a data acquisition module located within the cryostat, the module in communication with the at least one sensor to acquire data, wherein the module comprises a thermal package, a conditioning and digitizing electronic module, a controller module, a power module, and a thermal management module.
1. A cryogenic system comprising:
a cryostat containing a cryogenic fluid and at least one sensor; and
a data acquisition module located within the cryostat, the data acquisition module in communication with the at least one sensor to acquire data, the data acquisition module comprising a thermal package comprising:
a conditioning and digitizing electronic module,
a controller module,
a power module, and
a thermal management module, the thermal management module operable to provide temperature control to the data acquisition module to maintain the data acquisition module at a temperature between 70 K to 315 K, the thermal management module operable to control a heater based on a measurement from a temperature detector.
2. The cryogenic system of claim 1 , wherein the thermal package comprises multiple overlapping layers, wherein an outermost layer comprises a material with a low thermal conductivity, wherein a middle layer comprises a metallic layer, and wherein an inner most layer comprises a material with a low thermal conductivity.
3. The cryogenic system of claim 1 , wherein the conditioning and digitizing electronic module comprises front end electronics and a digitizer operable to digitize analog signals produced by the at least one sensor.
4. The cryogenic system of claim 1 , wherein the controller module is operable to provide communications, data processing, and buffering, and to electrically isolate a communication channel.
5. The cryogenic system of claim 1 , wherein the power module is operable to provide power to the conditioning and digitizing electronic module, the thermal management module, and the controller module.
6. The cryogenic system of claim 1 , wherein the heater comprises a thin film heater, and wherein the temperature detector comprises a resistance temperature detector (RTD).
7. The cryogenic system of claim 1 , wherein the thermal package further comprises a thermal channel and a thermal valve.
8. The cryogenic system of claim 7 , wherein the thermal channel comprises a thermally conducting material connected to the thermal valve.
9. The cryogenic system of claim 8 , wherein the thermal valve comprises an electromechanical device that is controlled by the thermal management module.
10. The cryogenic system of claim 1 , wherein cryogenic fluid is at a temperature between 0 K and 90 K.
11. A data acquisition module for use within a cryogenic system containing a cryogenic fluid and at least one sensor, comprising:
a thermal package comprising:
a conditioning and digitizing electronic module;
a controller module;
a power module; and
a thermal management module, the thermal management module operable to provide temperature control to the data acquisition module to maintain the data acquisition module at a temperature between 70 K to 315 K, the thermal management module operable to control a heater based on a measurement from a temperature detector.
12. The data acquisition module of claim 11 , wherein the thermal package comprises multiple overlapping layers, wherein an outermost layer comprises a material with a low thermal conductivity, wherein a middle layer comprises a metallic layer, and wherein an inner most layer comprises a material with a low thermal conductivity.
13. The data acquisition module of claim 11 , wherein the conditioning and digitizing electronic module comprises front end electronics and a digitizer operable to digitize analog signals produced by the at least one sensor.
14. The data acquisition module of claim 11 , wherein the controller module is operable to provide communications, data processing, and buffering, and to electrically isolate a communication channel.
15. The data acquisition module of claim 11 , wherein the power module is operable to provide power to the conditioning and digitizing electronic module, the thermal management module, and the controller module.
16. The data acquisition module of claim 11 , wherein the heater comprises a thin film heater, and wherein the temperature detector comprises a resistance temperature detector (RTD).
17. The data acquisition module of claim 11 , wherein the thermal package further comprises a thermal channel and a thermal valve.
18. The data acquisition module of claim 17 , wherein the thermal channel comprises a thermally conducting material connected to the thermal valve.
19. The data acquisition module of claim 18 , wherein the thermal valve comprises an electromechanical device that is controlled by the thermal management module.
20. The data acquisition module of claim 11 , wherein cryogenic fluid is at a temperature between 0 K and 90 K.