Ultrananocrystalline diamond contacts for electronic devices
A method of forming electrical contacts on a diamond substrate comprises producing a plasma ball using a microwave plasma source in the presence of a mixture of gases. The mixture of gases include a source of a p-type or an n-type dopant. The plasma ball is disposed at a first distance from the diamond substrate. The diamond substrate is maintained at a first temperature. The plasma ball is maintained at the first distance from the diamond substrate for a first time, and a UNCD film, which is doped with at least one of a p-type dopant and an n-type dopant, is disposed on the diamond substrate. The doped UNCD film is patterned to define UNCD electrical contacts on the diamond substrate.
1. A method of forming electrical contacts on a diamond substrate, comprising:
producing a plasma ball using a microwave plasma source in the presence of a mixture of gases which include a source of a first p-type dopant or a first n-type dopant;
disposing the plasma ball at a first distance from the diamond substrate, the diamond substrate maintained at a first temperature;
maintaining the plasma ball at the first distance from the substrate for a first time;
disposing an ultrananocrystalline diamond film on the diamond substrate, the ultrananocrystalline diamond film doped with at least one of a second p-type dopant and a second n-type dopant; and
patterning the ultrananocrystalline film to define ultrananocrystalline diamond electrical contacts on the diamond substrate.
2. The method of claim 1 , further comprising:
disposing a masking layer on the ultrananocrystalline diamond film; and
patterning the masking layer to define a pattern of the electrical contacts in the masking layer.
3. The method of claim 1 , wherein the ultrananocrystalline diamond electrical contacts have an X-ray absorption of less than about 1%.
4. The method of claim 1 , wherein the first p-type dopant includes boron.
5. The method of claim 1 , wherein the first n-type dopant includes nitrogen.
6. The method of claim 5 , wherein the ultrananocrystalline diamond film has a percentage of nitrogen in the range of about 0.05 atom % to about 0.5 atom %.
7. The method of claim 1 , wherein the first temperature is in the range of about 350 degrees Celsius to about 950 degrees Celsius.
8. The method of claim 1 , wherein the ultrananocrystalline diamond film is patterned using oxygen plasma etching.
9. The method of claim 1 , wherein the ultrananocrystalline diamond does not oxidize up to a temperature of about 800 degrees Celsius.