IP Library › Patent Application 14791382
Patent Application
App. No. 14/791,382

RF FRONT-END ARCHITECTURE FOR MACHINE-TO-MACHINE APPLICATIONS

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Quick Facts
Patent No.
US None
App. No.
14/791,382
Abstract

One embodiment of the present invention provides an RF front-end module for machine-to-machine applications. The RF front-end module includes an integrated circuit (IC) chip that comprises multiple functional blocks. The multiple functional blocks include at least a transmission chain, a receiving chain, a synthesizer, and one or more interfaces for interfacing with other off-chip front-end components.

Claims (23)

1 . An RF front-end module for machine-to-machine applications, comprising:

an integrated circuit (IC) chip that comprises multiple functional blocks, wherein the multiple functional blocks include at least:

a transmission chain,

a receiving chain,

a synthesizer, and

one or more interfaces for interfacing with other off-chip front-end components.

2 . The RF front-end module of claim 1 , wherein the receiving chain includes a receiver, an analog-to-digital converter (ADC), and a digital interface for interfacing with a baseband processor.

3 . The RF front-end module of claim 2 , wherein the digital interface is a serial interface.

4 . The RF front-end module of claim 1 , wherein the transmission chain includes a transmitter, a digital-to-analog converter (DAC), and a digital interface for interfacing with a baseband processor.

5 . The RF front-end module of claim 4 , wherein the digital interface is a serial interface.

6 . The RF front-end module of claim 1 , wherein the functional blocks further comprise a power detector coupled to the transmission chain.

7 . The RF front-end module of claim 1 , wherein the functional blocks further comprise a temperature sensor.

8 . The RF front-end module of claim 1 , wherein the one or more interfaces include one or more of:

a Mobile Industry Processor Interface (MIPI) RF front-end interface;

a general purpose input/output (GPIO) interface; and

a Serial Peripheral Interface (SPI).

9 . The RF front-end module of claim 1 , wherein the functional blocks further include a second digital-to-analog converter (DAC) configured to provide a control signal to an oscillator.

10 . The RF front-end module of claim 8 , wherein the oscillator is located off-chip, and wherein the oscillator is a voltage-controlled oscillator.

11 . The RF front-end module of claim 1 , wherein the other off-chip front-end components include one or more of:

a filter;

a switch; and

an amplifier.

12 . The RF front-end module of claim 1 , wherein the transmission chain and the receiving chain are configured to operate in compliance with a Long-Term Evolution (LTE) Category 0 (Cat-0) Standard.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME AND SIGNATURE OF THE SIGNATORY OF THE ASSIGNEE INSIDE THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 053461 FRAME: 0858. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Aug 31, 2020
From: AVIACOMM INC.
To: NANJING AVIACOMM SEMICONDUCTOR CO., LTD.
Reel/Frame 053651/0216 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2020
From: AVIACOMM INC.
To: NANJING AVIACOMM SEMICONDUCTOR CO., LTD.
Reel/Frame 053461/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 14, 2015
From: WANG, HANS; LI, TAO; ZHANG, BINGLEI; MO, SHIH HSIUNG
To: AVIACOMM INC.
Reel/Frame 036332/0260 →