Differential trace pair system

1. A differential trace pair system, comprising:

a board including a board structure having a first board structure member and a second board structure member that is spaced part from the first board structure member; and

a differential trace pair that is provided in the board and that includes:

a first differential trace pair portion located outside the board structure, having a first width, and configured to provide a first impedance at a data transmission speed; and

a second differential trace pair portion that extends through the board structure, and that includes:

a primary width section in the second differential trace pair portion that is configured to provide a second impedance at the data transmission speed that is substantially similar to the first impedance, and that includes a first outer edge and a second outer edge that is located opposite the second differential trace pair portion from the first outer edge, wherein the first outer edge and the second outer edge define a second width; and

a reduced width section in the second differential trace pair portion that is configured to provide a third impedance at the data transmission speed that is substantially similar to the first impedance and the second impedance, and that includes:

a first board structure member channel that is defined by the first outer edge adjacent the first board structure member, that maintains substantially the same spacing between the first outer edge and the first board structure member, and that provides for a transition of the second differential trace pair portion from the second width to a third width and then back to the second width, wherein the third width is smaller than the second width; and

a second board structure member channel that is defined by the second outer edge adjacent the second board structure member, that maintains substantially the same spacing between the second outer edge and the second board structure member, and that provides for a transition of the second differential trace pair portion from the second width to the third width and then back to the second width.

2. The differential trace pair system of claim 1 , wherein the differential trace pair includes:

a first differential trace that includes the first outer edge and a first inner edge located opposite the first differential trace from the first outer edge; and

a second differential trace that includes the second outer edge and a second inner edge that is located opposite the second differential trace from the second outer edge, and wherein the first inner edge and the second inner edge are substantially parallel along a length of the second differential trace pair portion including the primary width section having the second width and the reduced width section having the third width.

3. The differential trace pair system of claim 1 , wherein the first differential trace pair portion includes a first differential trace pair spacing between a first differential trace and a second differential trace that are included in the differential trace pair, and the second differential trace pair portion includes a second differential trace pair spacing between the first differential trace and the second differential trace that is substantially similar to the first differential trace pair spacing.

4. The differential trace pair system of claim 3 , wherein the first differential trace, the second differential trace, and the second differential trace pair spacing that provide the reduced width section of the second differential trace pair portion are configured to provide the third impedance that is no more than 8% greater than the first impedance of the first differential trace pair portion and the second impedance of the primary width section in the second differential trace pair portion.

5. The differential trace pair system of claim 1 , wherein the first board structure member includes a first connection pad, and the second board structure member include a second connection pad.

6. The differential trace pair system of claim 5 , further comprising:

a first clearance area defined adjacent the first connection pad, and a second clearance area defined adjacent the second connection pad, wherein the second differential trace pair portion extends into the first clearance area and the second clearance area.

7. The differential trace pair system of claim 1 , further comprising:

a third board structure member and a fourth board structure member included on the board structure, wherein the second differential trace pair portion is connected to the third board structure member and the fourth board structure member.

8. An information handling system (IHS), comprising:

a processor;

a circuit board having a connection pad array that couples the processor to the circuit board, wherein the connection pad array includes a first connection pad and a second connection pad that is spaced apart from the first connection pad; and

a differential trace pair that is provided in the circuit board and that includes:

a first differential trace pair portion located outside the connection pad array, having a first width, and configured to provide a first impedance at a data transmission speed; and

a second differential trace pair portion that extends through the connection pad array, and including:

a primary width section in the second differential trace pair portion that is configured to provide a second impedance at the data transmission speed that is substantially similar to the first impedance, and that includes a first outer edge and a second outer edge that is located opposite the second differential trace pair portion from the first outer edge, wherein the first outer edge and the second outer edge define a second width; and

a reduced width section in the second differential trace pair portion that is configured to provide a third impedance at the data transmission speed that is substantially similar to the first impedance and the second impedance, and that includes:

a first connection pad channel that is defined by the first outer edge adjacent the first connection pad, that maintains substantially the same spacing between the first outer edge and the first connection pad, and that provides for a transition of the second differential trace pair portion from the second width to a third width and then back to the second width, wherein the third width is smaller than the second width; and

a second connection pad channel that is defined by the second outer edge adjacent the second connection pad, that maintains substantially the same spacing between the second outer edge and the second connection pad, and that provides for a transition of the second differential trace pair portion from the second width to the third width and then back to the second width.

9. The IHS of claim 8 , wherein the differential trace pair includes:

a first differential trace that includes the first outer edge and a first inner edge located opposite the first differential trace from the first outer edge, and

a second differential trace includes the second outer edge and a second inner edge that is located opposite the second differential trace from the second outer edge, and wherein the first inner edge and the second inner edge are substantially parallel along a length of the second differential trace pair portion including the primary width section having the second width and the reduced width section having the third width.

10. The IHS of claim 8 , wherein the first differential trace pair portion includes a first differential trace pair spacing between a first differential trace and a second differential trace that are included in the differential trace pair, and the second differential trace pair portion includes a second differential trace pair spacing between the first differential trace and the second differential trace that is substantially similar to the first differential trace pair spacing.

11. The IHS of claim 10 , wherein the first differential trace, the second differential trace, and the second differential trace pair spacing that provide the reduced width section of the second differential trace pair portion are configured to provide the third impedance that is no more than 8% greater than the first impedance of the first differential trace pair portion and the second impedance of the primary width section in the second differential trace pair portion.

12. The IHS of claim 8 , further comprising:

a Ball Grid Array (BGA) engaging the connection pad array, wherein the processor is mounted to the BGA.

13. The IHS of claim 8 , further comprising:

a first clearance area defined adjacent the first connection pad, and a second clearance area defined adjacent the second connection pad, wherein the second differential trace pair portion extends into the first clearance area and the second clearance area.

14. The IHS of claim 8 , further comprising:

a third connection pad and a fourth connection pad included on the connection pad array, wherein the second differential trace pair portion is connected to the third connection pad and the fourth connection pad.

15. A method for providing a differential trace pair, comprising:

providing a board including a board structure having a first board structure member and a second board structure member that is spaced part from the first board structure member;

creating a first differential trace pair portion of a differential trace pair in the board and outside the board structure, wherein the first differential trace pair portion includes a first width and is configured to provide a first impedance at a data transmission speed;

creating a second differential trace pair portion of the differential trace pair in the board that extends from the first differential trace pair portion and through the board structure, and that includes:

a primary width section in the second differential trace pair portion that is configured to provide a second impedance at the data transmission speed that is substantially similar to the first impedance, wherein the primary width section includes a first outer edge and a second outer edge that is located opposite the second differential trace pair portion from the first outer edge, and wherein the first outer edge and the second outer edge define a second width of the second differential trace pair portion that is different than the first width;

creating a reduced width section in the second differential trace pair portion that is configured to provide a third impedance at the data transmission speed that is substantially similar to the first impedance and the second impedance, wherein the creating the reduced width section in the second differential trace pair portion includes:

defining a first board structure member channel in the first outer edge adjacent the first board structure member, wherein the first board structure member channel maintains substantially the same spacing between the first outer edge and the first board structure member, and wherein the first board structure member channel provides for a transition of the second differential trace pair portion from the second width to a third width and then back to the second width, and wherein the third width is smaller than the second width; and

defining a second board structure member channel in the second outer edge adjacent the second board structure member, wherein the second board structure member channel maintains substantially the same spacing between the second outer edge and the second board structure member, and wherein the second board structure member channel provides for a transition of the second differential trace pair portion from the second width to the third width and then back to the second width.

16. The method of claim 15 , further comprising:

providing a first differential trace in the second differential trace pair portion that includes the first outer edge and a first inner edge located opposite the first differential trace from the first outer edge; and

providing a second differential trace in the second differential trace pair portion that includes the second outer edge and a second inner edge that is located opposite the second differential trace from the second outer edge, and the first inner edge and the second inner edge are substantially parallel along a length of the second differential trace pair portion including the primary width section having the second width and the reduced width section having the third width.

17. The method of claim 15 , further comprising:

providing a first differential trace pair spacing between a first differential trace and a second differential trace that are included in the first differential trace pair portion; and

providing a second differential trace pair spacing between the first differential trace and the second differential trace that are included in the second differential trace pair portion, wherein the second differential trace pair spacing is substantially similar to the first differential trace pair spacing.

18. The method of claim 17 , further comprising:

providing the first differential trace, the second differential trace, and the second differential trace pair spacing that provide the reduced width section of the second differential trace pair portion with the third impedance that is no more than 8% greater than the first impedance of the first differential trace pair portion and the second impedance of the primary width section in the second differential trace pair portion.

19. The method of claim 15 , wherein the first board structure member includes a first connection pad and a first clearance area defined adjacent the first connection pad, the second board structure member include a second connection pad and a second clearance area defined adjacent the second connection pad, and the method further comprises:

providing the second differential trace pair portion extending into the first clearance area and the second clearance area.

20. The method of claim 15 , wherein the board structure includes a third board structure member and a fourth board structure member, and the method further comprises:

connecting the second differential trace pair portion to the third board structure member and the fourth board structure member.