IP Library Granted Patent US 9,576,991
Granted Patent B2
US 9,576,991 · App. 14/796,050 · Granted Feb 21, 2017

Photo sensor module

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,576,991
App. No.
14/796,050
Granted
Feb 21, 2017
Kind
B2
Abstract

The present disclosure relates to a photo sensor module. The thickness and size of an IC chip may be reduced by manufacturing a photo sensor based on a semiconductor substrate and improving the structure to place a UV sensor on the upper section of an active device or a passive device. The photo sensor module includes a semiconductor substrate, a field oxide layer, formed on the semiconductor substrate, and a photo sensor comprising a photo diode formed on the field oxide layer.

Claims (24)

1. A photo sensor module comprising:

a semiconductor substrate;

a field oxide layer, disposed on the semiconductor substrate;

a photo sensor comprising a photo diode formed on the field oxide layer; and

an insulator film disposed on the field oxide layer and the photosensor;

wherein a part of the insulator film is removed and a part of the photo diode is exposed to outside.

2. The photo sensor module of claim 1 , further comprising:

a first WELL region and a second WELL region disposed on the semiconductor substrate;

a first source/drain region disposed on the first WELL region and a second source/drain region disposed on the second WELL region;

an isolation layer disposed between the first WELL region and the second WELL region; and

a first gate insulator film disposed on the first WELL region and a second gate insulator film disposed on the second WELL region.

3. The photo sensor module of claim 2 , further comprising:

a passivation layer disposed on the insulator film.

4. The photo sensor module of claim 3 , wherein:

a part of the passivation layer is removed.

5. The photo sensor module of claim 1 , wherein the photo diode comprises two or more doping region formed in a module form to sense UV.

6. The photo sensor module of claim 1 , wherein the photo diode comprises:

a first doping region of high concentration;

a second doping region of low concentration, doped in a different impurity type from the first doping region; and

a third doping region of high concentration, doped in an identical impurity type as the second doping region.

7. The photo sensor module of claim 1 , wherein the photo diode comprises:

a first doping region of high concentration;

a second doping region of low concentration doped in an identical impurity type as the first doping region; and

a third doping region of high concentration doped in different impurity type from the second doping region.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2019
From: MAGNACHIP SEMICONDUCTOR, LTD
To: ATRIA TECHNOLOGIES INC.
Reel/Frame 048058/0864 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2015
From: HEBERT, FRANCOIS; CHOE, SEONG MIN
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 036056/0339 →