UPPER ELECTRODE, EDGE RING, AND PLASMA PROCESSING APPARATUS
According to one embodiment, an upper electrode to be arranged opposite to a lower electrode and serving as a shower head in a plasma processing apparatus of a parallel-plate type is provided. The upper electrode includes a concave portion provided on an outer peripheral side of a processing object opposing region configured to face a mounting region for a processing object to be placed on the lower electrode.
1 . An upper electrode to be arranged opposite to a lower electrode and serving as a shower head in a plasma processing apparatus of a parallel-plate type, comprising:
a concave portion provided on an outer peripheral side of a processing object opposing region configured to face a mounting region for a processing object to be placed on the lower electrode.
2 . The upper electrode according to claim 1 , further comprising a convex portion provided on an outer peripheral side of the concave portion and configured to protrude toward the lower electrode more than the processing object opposing region.
3 . The upper electrode according to claim 1 , wherein the concave portion has a Rogowski shape.
4 . The upper electrode according to claim 1 , further comprising gas passages in the processing object opposing region, the gas passages penetrating the upper electrode in a thickness direction.
5 . An edge ring to be arranged around a processing object support member serving as a lower electrode in a plasma processing apparatus of a parallel-plate type,
wherein, in a region of at least a processing object support member side of a surface facing an upper electrode of the plasma processing apparatus, a distance from the upper electrode to the surface increases in a direction from an inner peripheral side of the region toward an outer peripheral side of the region.
6 . The edge ring according to claim 5 , further comprising a concave portion provided on the surface facing the upper electrode.
7 . The edge ring according to claim 6 , wherein the concave portion has a Rogowski shape.
8 . The edge ring according to claim 5 , wherein, in an exposed surface to be exposed to the upper electrode, a distance from the upper electrode to the exposed surface increased in the direction from the inner peripheral side toward the outer peripheral side.
9 . The edge ring according to claim 5 , further comprising a reverse surface on a reverse side relative to the surface facing the upper electrode, the reverse surface being in parallel with a processing object support surface of the processing object support member and flat.
10 . A plasma processing apparatus of a parallel-plate type, comprising:
a chamber;
a processing object support member serving as a lower electrode and configured to hold a processing object in the chamber; and
an upper electrode arranged opposite to the processing object support member and serving as a shower head in the chamber; wherein
an edge ring is arranged around the processing object support member, and
the upper electrode includes a first concave portion provided on an outer peripheral side of a processing object opposing region that faces a mounting region for the processing object of the processing object support member.
11 . The plasma processing apparatus according to claim 10 , wherein the upper electrode includes a convex portion provided on an outer peripheral side of the first concave portion and protruding toward the lower electrode more than the processing object opposing region.
12 . The plasma processing apparatus according to claim 10 , wherein the first concave portion has a Rogowski shape.
13 . The plasma processing apparatus according to claim 10 , wherein a surface of the edge ring facing the upper electrode is in parallel with a processing object support surface of the processing object support member.
14 . The plasma processing apparatus according to claim 10 , wherein the first concave portion is provided at a position that faces a region where the edge ring is arranged.
15 . The plasma processing apparatus according to claim 10 , wherein, in a region of at least a processing object support member side of a surface of the edge ring facing the upper electrode, a distance from the upper electrode to the surface of the edge ring increases in a direction from an inner peripheral side of the region toward an outer peripheral side of the region.
16 . The plasma processing apparatus according to claim 15 , wherein the edge ring includes a second concave portion provided on the surface facing the upper electrode.
17 . The plasma processing apparatus according to claim 16 , wherein the second concave portion of the edge ring has a Rogowski shape.
18 . The plasma processing apparatus according to claim 15 , wherein, in an exposed surface of the edge ring to be exposed to the upper electrode, a distance from the upper electrode to the exposed surface is increased in the direction from the inner peripheral side toward the outer peripheral side.
19 . The plasma processing apparatus according to claim 10 , wherein a thickness of the edge ring is reduced in a direction from an inner peripheral side toward an outer peripheral side.
20 . The plasma processing apparatus according to claim 10 , wherein the upper electrode includes gas passages in the processing object opposing region, the gas passages penetrating the upper electrode in a thickness direction.