Welding system with potted circuit board and method of making thereof
A method and apparatus for providing welding type power is disclosed. At least one circuit board is used that is partially potted using a potting barrier affixed to the circuit board. The partially potted portion can be inside an enclosed air flow space.
1. A welding-type system comprising:
an input circuit disposed to receive input power and to provide intermediate power;
a power circuit, having a power control input and at least one switch responsive to the control input, and wherein the power circuit is disposed to receive intermediate power and provide welding type output power;
a controller, having a set point input and a control output, wherein the control output is connected to the power control input;
wherein a first subset of components from at least one of the power circuit, input circuit and controller are disposed on a first circuit board; wherein the adhesive is a different material from the potting compound, and wherein the power circuit further includes a second subset of components; and
a potting barrier affixed to the first circuit board using at least an adhesive, and wherein the first subset of components are mounted on the circuit board within the potting barrier; and
potting compound in the entire area within the potting barrier and on the circuit board.
2. The welding-type system of claim 1 , wherein the potting barrier is further affixed to the circuit board using at least one mechanical fastener.
3. The welding-type system of claim 1 , wherein the potting barrier is a rigid structure when affixed to the circuit board.
4. The welding-type system of claim 1 , wherein the second subset of components are at least partially mounted on the first circuit board outside of the potting barrier.
5. The welding-type system of claim 4 , wherein the input circuit and the power circuit are disposed inside a housing and the first circuit board is at least partially mounted inside an enclosed air flow space within the housing.
6. The welding-type system of claim 5 , wherein the controller includes a third subset of components that are at least partially mounted outside of the enclosed airflow space.
7. The welding-type system of claim 6 , wherein the power circuit includes a converter with at least one converter switch and a converter switch heat sink, wherein the converter switch heat sink is in the first subset of components.
8. The welding-type system of claim 1 , wherein the potting barrier defines an area that is entirely potted without voids.
9. A partially potted circuit board for use in a welding-type system comprising:
a circuit board;
a plurality of components mounted to the circuit board, wherein the plurality of components includes a first subset of components and a second subset of components;
a potting barrier affixed to the first circuit board using at least an adhesive, wherein the first subset of components are mounted on the circuit board within the potting barrier; and
potting compound within the potting barrier and on the circuit board; wherein the adhesive is a different material from the potting compound.
10. The partially potted circuit board of claim 9 , wherein the potting barrier is further affixed to the circuit board using at least one mechanical fastener.
11. The partially potted circuit board of claim 10 , wherein the potting barrier is a rigid structure when affixed to the circuit board.
12. The partially potted circuit board of claim 11 , wherein the second subset of components are at least partially mounted on the first circuit board outside of the potting barrier.
13. The partially potted circuit board of claim 12 , wherein the welding type system includes a housing, and the partially potted circuit board is at least partially mounted inside an enclosed air flow space within the housing.
14. The partially potted circuit board of claim 9 , wherein the potting barrier defines an area that is entirely potted without voids.