Packaged integrated circuit devices with through-body conductive vias, and methods of making same
View Patent ↗A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.
1. A device, comprising:
a first group of embedded die and a second group of embedded die vertically aligned with the first group, wherein each of the first and second groups of embedded die comprise a vertically-aligned plurality of individual embedded die, each of the individual embedded die comprise an integrated circuit die and a body of encapsulant material, and each integrated circuit die has a back side that is embedded in the body of encapsulant material and a front side that is generally flush with an outermost surface of the first group or the second group of embedded die;
at least one first conductive via that extends through the first group of embedded die;
at least one second conductive via that extends through the second group of embedded die; and
at least one conductive structure positioned between the first and second groups of embedded die that provides an electrically conductive flow path between the first and second conductive vias.
2. The device of claim 1 , wherein the back side of each integrated circuit die of the individual embedded die in each of the first and second groups of embedded die are positioned facing one another.
3. The device of claim 2 , wherein the first conductive via extends from the front side of an integrated circuit die of an individual embedded die in the first group of embedded die to the front side of another integrated circuit die of another individual embedded die in the first group of embedded die.
4. The device of claim 2 , further comprising an adhesive material positioned between the facing back sides of the integrated circuit dies of the individual embedded die.
5. The device of claim 1 , wherein the first conductive via is formed through the body of encapsulant material of all of the individual embedded die in the first group of embedded die.
6. The device of claim 5 , wherein the second conductive via is formed through the body of encapsulant material of all of the individual embedded die in the second group of embedded die.
7. The device of claim 1 , wherein the first and second groups of embedded die are stacked vertically above one another.