Apparatus and methods for micro-transfer-printing
View Patent ↗In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
1. A conformable transfer device, the transfer device comprising:
a base comprising a first material;
a sub-base comprising a second material and disposed on the base, wherein the sub-base has a smaller cross-sectional area than the base;
a bulk volume having a first surface and a second surface opposite the first surface, the second surface in contact with the sub-base and the base, the bulk volume comprising a material different from the first and second materials and disposed at least partly on the sub-base and at least partly on the base, wherein a thickness of a portion of the bulk volume that is disposed on the sub-base is less than a thickness of the sub-base; and
a plurality of posts disposed on the first surface of the bulk volume, opposite and above the sub-base, for picking up printable material, wherein the plurality of posts, the base, the sub-base, and the bulk volume are arranged such that a force applied to a surface of the base opposite the sub-base is transmitted to the plurality of posts.
2. The device of claim 1 , wherein the first material comprises glass.
3. The device of claim 1 , wherein the first and second materials are the same.
4. The device of claim 1 , wherein the bulk volume and the plurality of posts are formed from a single material.
5. The device of claim 1 , wherein the bulk volume comprises a polymer.
6. The device of claim 1 , wherein the first material is transparent.
7. The device of claim 1 , wherein the second material is transparent.
8. The device of claim 1 , wherein the posts have a first Young's modulus and the base has a second Young's modulus, greater than the first Young's modulus.
9. The device of claim 1 , wherein a least a portion of the posts are arranged on the first surface from 1 mm to 15 mm away from an edge of the first surface.
10. The devices of claim 1 , wherein the bulk volume has a side surface between the first and second surfaces and the side surface has a rounded profile, convex profile or concave profile.
11. The device of claim 1 , wherein the bulk volume has a side surface between the first and second surfaces and the side surface has a beveled edge forming an angle from horizontal (parallel to the first surface) of no greater than 75°.
12. The device of claim 1 , wherein each of the plurality of posts comprises a contact surface on the end of the post opposite the bulk volume, wherein the contact surfaces of the plurality of posts are substantially in a same plane.
13. The device of claim 1 , wherein a thickness of the plurality of posts is from 1 micron to 100 microns.
14. The device of claim 1 , wherein a thickness of the bulk volume is from 0.5 mm to 5 mm.
15. The device of claim 1 , wherein a ratio of a thickness of the plurality of posts to a thickness of the bulk volume is from 1:1 to 1:10.
16. The device of claim 1 , wherein each post of the plurality of posts has at least one of a width, length, and height from 50 nanometers to 10 micrometers.
17. The device of claim 1 , wherein the plurality of posts are formed in a continuous, unitary layer.
18. The device of claim 1 , wherein an aspect ratio (height to width) of each post of the plurality of posts is less than or equal to 4:1.
19. The device of claim 1 , wherein each of the plurality of posts comprises a contact surface on the end of the post opposite the bulk volume, wherein the contact surfaces of the plurality of posts are substantially in a same plane.
20. The device of claim 1 , wherein a thickness of the posts is from 1 micron to 100 microns.
21. The device of claim 1 , wherein a thickness of the bulk volume is from 0.5 mm to 5 mm.
22. The device of claim 1 , wherein a ratio of a thickness of the posts to a thickness of the bulk volume is from 1:1 to 1:10.
23. The device of claim 1 , wherein the bulk volume has a Young's modulus from 1 GPa to 10 GPa.
24. The device of claim 1 , wherein the posts have a Young's modulus from 1 MPa to 10 MPa.
25. The device of claim 1 , wherein the bulk volume comprises a polymer having a coefficient of thermal expansion less than or equal to 14.5 ppm.
26. The device of claim 1 , wherein the posts occupy an area selected from 10 cm 2 to 260 cm 2 .
27. The device of claim 1 , wherein each post of the plurality of posts has at least one of a width, length, and height from 50 nanometers to 10 micrometers.
28. The device of claim 1 , wherein the posts are formed in a continuous, unitary layer.
29. The device of claim 1 , wherein the posts comprise a polymer.
30. The device of claim 1 , wherein the bulk volume is Polydimethylsiloxane (PDMS).
31. The device of claim 1 , wherein the bulk volume has a greater modulus than the posts.
32. The device of claim 1 , wherein an aspect ratio (height to width) of each post of the posts is less than or equal to 4:1.
33. The device of claim 1 , wherein the bulk volume has a side surface between the first and second surfaces, the side surface.
34. The device of claim 33 , wherein the side surface has at least one of a beveled edge and a rounded edge.