Patent Assignment
Reel/Frame 052631/0800
Change of Name
Recorded: 2020-05-11
Pages: 10
Assignor
X-CELEPRINT LIMITED
Executed: 2019-12-23
Assignee
X DISPLAY COMPANY TECHNOLOGY LIMITED
2 GRAND CANAL SQUARE, 6TH FLOOR, DUBLIN, D02 A342, IRELAND
Covered Properties
(289)
Reinforced Composite Stamp for Dry Transfer Printing of Semiconductor Elements
PCT:
PCT/US2009/051350 ↗
Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp Transfer
PCT:
PCT/US2009/065078 ↗
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
PCT:
PCT/US2010/002519 ↗
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
PCT:
PCT/US2010/028844 ↗
Printed Assemblies of Ultrathin, Microscale Inorganic Light Emitting Diodes for Deformable and Semitransparent Displays
PCT:
PCT/US2010/034520 ↗
Vacuum Coupled Tool Apparatus for Dry Transfer Printing Semiconductor Elements
PCT:
PCT/US2010/039414 ↗
Selective Transfer of Active Components
PCT:
PCT/US2011/029357 ↗
Electrically Bonded Arrays of Transfer Printed Active Components
PCT:
PCT/US2011/029365 ↗
Materials and Processes for Releasing Printable Compound Semiconductor Devices
PCT:
PCT/US2011/046575 ↗
Structures and Methods for Testing Printable Integrated Circuits
PCT:
PCT/US2011/048945 ↗
Through-Silicon Vias and Interposers Formed by Metal-Catalyzed Wet Etching
PCT:
PCT/US2014/028599 ↗
Optical Systems Fabricated by Printing-Based Assembly
Reinforced Composite Stamp for Dry Transfer Printing of Semiconductor Elements
Oled Device with Embedded Chip Driving
Printable, Flexible and Stretchable Diamond for Thermal Management
Vacuum Coupled Tool Apparatus for Dry Transfer Printing Semiconductor Elements
Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp Transfer
Methods of Forming Printable Integrated Circuit Devices by Selective Etching to Suspend the Devices from a Handling Substrate and Devices Formed Thereby
Optical Systems Fabricated by Printing-Based Assembly
Oled Device with Embedded Chip Driving
Application:
13/191,975 →
Publication:
US 2011/0279014
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Interconnection Structures and Methods for Transfer-Printed Integrated Circuit Elements with Improved Interconnection Alignment Tolerance
Laser Assisted Transfer Welding Process
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Methods for Surface Attachment of Flipped Active Components
Substrates with Transferable Chiplets
Methods of Selectively Transferring Active Components
Electrically Bonded Arrays of Transfer Printed Active Components
Methods of Fabricating Printable Compound Semiconductor Devices on Release Layers
Structures and Methods for Testing Printable Integrated Circuits
Optical Systems Fabricated by Printing-Based Assembly
Through-Silicon Vias and Interposers Formed by Metal-Catalyzed Wet Etching
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
Methods for Surface Attachment of Flipped Active Components
Substrates with Transferable Chiplets
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
Printable Inorganic Semiconductor Structures
Electrically Bonded Arrays of Transfer Printed Active Components
Application:
14/715,191 →
Publication:
US 2015/0327388
Multilayer Printed Capacitors
Micro Assembled Led Displays and Lighting Elements
Micro Assembled Led Displays and Lighting Elements
Micro Assembled Led Displays and Lighting Elements
Micro Assembled Led Displays and Lighting Elements
Micro Assembled Led Displays and Lighting Elements
Micro Assembled Led Displays and Lighting Elements
Micro Assembled Led Displays and Lighting Elements
Micro Assembled Led Displays and Lighting Elements
Systems and Methods for Preparing Gan and Related Materials for Micro Assembly
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Small-Aperture-Ratio Display with Electrical Component
Two-terminal store-and-control circuit
Inorganic Light-Emitting Diode with Encapsulating Reflector
Self-Compensating Circuit for Faulty Display Pixels
Patent:
9,468,050 →
Application:
14/795,830 →
Active-Matrix Touchscreen
Optical Systems Fabricated by Printing-Based Assembly
Apparatus and Methods for Micro-Transfer-Printing
Apparatus and Methods for Micro-Transfer-Printing
Apparatus and Methods for Micro-Transfer-Printing
Application:
14/804,031 →
Publication:
US 2016/0020131
Apparatus and Methods for Micro-Transfer-Printing
Apparatus and Methods for Micro-Transfer-Printing
Parallel Redundant Chiplet System
Redistribution Layer for Substrate Contacts
Printable Inorganic Semiconductor Method
Patent:
9,368,683 →
Application:
14/807,311 →
Self-Compensating Circuit for Faulty Display Pixels
Inorganic-Light-Emitter Display with Integrated Black Matrix
Methods for Surface Attachment of Flipped Active Components
Chiplets with Connection Posts
Display Tile Structure and Tiled Display
Compound Micro-Assembly Strategies and Devices
Application:
14/822,868 →
Publication:
US 2016/0093600
Printable Component Structure with Electrical Contact
Structures and Methods for Testing Printable Integrated Circuits
Distributed Charge-Pump Power-Supply System
Crystalline Color-Conversion Device
Heterogeneous Light Emitter Display System
Bit-Plane Pulse Width Modulated Digital Display System
Micro Assembled Hybrid Displays and Lighting Elements
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Display with Micro-Led Front Light
Oleds for Micro Transfer Printing
Display with Integrated Electrodes
Laser Assisted Transfer Welding Process
Stamp with Structured Posts
Display with Color Conversion
Laser Array Display
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Micro-Light-Emitting Diode Backlight System
Multi-Layer Stamp
Serial Row-Select Matrix-Addressed System
Distributed Pulse Width Modulation Control
Method for Producing a Semiconductor Component and a Semiconductor Component
Method for Producing a Semiconductor Component and a Semiconductor Component
Matrix-Addressed Device Repair
Printable Inorganic Semiconductor Method
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Printed Capacitors
Micro Assembled Led Displays and Lighting Elements
Printable Device Wafers with Sacrificial Layers Gaps
Micro-Transfer Printable Electronic Component
Apparatus and Methods for Micro-Transfer-Printing
Optical Systems Fabricated by Printing-Based Assembly
Optical Systems Fabricated by Printing-Based Assembly
Optical Systems Fabricated by Printing-Based Assembly
Digital-Drive Pulse-Width-Modulated Output System
Apparatus and Methods for Micro-Transfer-Printing
Application:
15/417,780 →
Publication:
US 2017/0207193
Methods for Surface Attachment of Flipped Active Components
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Display with Fused Leds
Efficiently Micro-Transfer Printing Micro-Scale Devices Onto Large-Format Substrates
Inorganic Led Pixel Structure
Isolation Structure for Micro-Transfer-Printable Devices
Wirelessly Powered Display and System
Micro-Printed Display
Pressure-Activated Electrical Interconnection by Micro-Transfer Printing
Micro-Transfer Printed LED and Color Filter Structure
Bit-Plane Pulse Width Modulated Digital Display System
Printable Inorganic Semiconductor Structures
Distributed Pulse-Width Modulation System with Multi-Bit Digital Storage and Output Device
Micro-Transfer-Printed Light-Emitting Diode Device
Voltage-Balanced Serial Iled Pixel and Display
Led Structure with Polarized Light Emission
Display Tile Structure and Tiled Display
Devices with a Single Metal Layer
Chiplets with Wicking Posts
Color-Filter Device
Printable 3D Electronic Structure
SYSTEMS AND METHODS FOR PREPARING GaN AND RELATED MATERIALS FOR MICRO ASSEMBLY
Electrically Parallel Fused Leds
Self-Compensating Circuit for Faulty Display Pixels
Apparatus and Methods for Micro-Transfer-Printing
Application:
15/705,755 →
Publication:
US 2018/0001614
Printable Inorganic Semiconductor Structures
Active-Matrix Touchscreen
Multi-Led Components
Micro-Transfer Printing with Volatile Adhesive Layer
Crystalline Color-Conversion Device
Led Optical Components
Spatially Dithered High-Resolution Displays
Micro-Transfer-Printable Flip-Chip Structures and Methods
Pressure-Activated Electrical Interconnection by Micro-Transfer Printing
Transfer Printed Device Repair
Multi-Resolution Compound Micro-Devices
Patent:
10,297,585 →
Application:
15/850,049 →
Interconnection Structures and Methods for Transfer-Printed Integrated Circuit Elements with Improved Interconnection Alignment Tolerance
Printable Device Wafers with Sacrificial Layers
Matrix-Addressed Systems with Row-Select Circuits Comprising a Serial Shift Register
Redistribution Layer for Substrate Contacts
Stacked Pixel Structures
Inorganic Light-Emitting-Diode Displays with Multi-Iled Pixels
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Active-Matrix Displays with Common Pixel Control
Displays with Transparent Bezels
Displays with Transparent Bezels
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Testing Transfer-Print Micro-Devices on Wafer
Micro-Device Pockets for Transfer Printing
Application:
15/937,450 →
Publication:
US 2018/0286734
Micro-Transfer Printers with Roll Stamp(S)
Application:
15/941,849 →
Publication:
US 2019/0300289
Micro-Transfer-Printable Flip-Chip Structures and Methods
Bezel-Free Displays
SYSTEMS AND METHODS FOR PREPARING GaN AND RELATED MATERIALS FOR MICRO ASSEMBLY
Matrix-Addressed Tiles and Arrays
Flexible Devices and Methods Using Laser Lift-Off
Micro-Transfer Printed Led and Color Filter Structures
Methods for Surface Attachment of Flipped Active Components
Multi-Layer Tethers for Micro-Transfer Printing
Micro-Light-Emitting-Diode Displays
Iled Displays with Substrate Holes
Structures and Methods for Electrical Connection of Micro-Devices and Substrates
Parallel Redundant Chiplet System with Printed Circuits for Reduced Faults
Micro-Light-Emitting Diode Backlight System
Bit-Plane Pulse Width Modulated Digital Display System
Multi-Level Micro-Device Tethers
Redundant Pixel Layouts
Pressure-Activated Electrical Interconnection with Additive Repair
Printable Inorganic Semiconductor Structures
Micro-Transfer Printing with Selective Component Removal
Patent:
10,573,544 →
Application:
16/163,559 →
Micro-Transfer Printable Electronic Component
Interconnection by Lateral Transfer Printing
Rigid Micro-Modules with Iled and Light Conductor
Methods of Making Printable Device Wafers with Sacrificial Layers
Micro-Transfer-Printable Flip-Chip Structures and Methods
Printing Components to Substrate Posts
Printed Components on Substrate Posts
Module Structures with Component on Substrate Post
Application:
16/207,738 →
Publication:
US 2020/0176286
Printing Components Over Substrate Post Edges
Device Source Wafers with Patterned Dissociation Interfaces
Efficiently Micro-Transfer Printing Micro-Scale Devices Onto Large-Format Substrates
Color-Filter Device
Micro Assembled Led Displays and Lighting Elements
Oleds for Micro Transfer Printing
Printing Component Arrays with Different Orientations
Cavity Structures
Application:
16/297,427 →
Publication:
US 2020/0176671
High-Precision Printed Structures
Patent:
10,714,374 →
Application:
16/408,155 →
Pixel Modules with Controllers and Light Emitters
Micro-Transfer-Printable Flip-Chip Structures and Methods
Printable Inorganic Semiconductor Structures
Structures and Methods for Electrically Connecting Printed Components
Chiplets with Connection Posts
Micro-Transfer-Printable Flip-Chip Structures and Methods
Devices with a Single Metal Layer
Flexible Devices and Methods Using Laser Lift-Off
Application:
16/655,134 →
Publication:
US 2020/0052164
Interconnection by Lateral Transfer Printing
Displays with Unpatterned Layers of Light-Absorbing Material
Micro-Transfer Printing with Selective Component Removal
Wafers with Etchable Sacrificial Patterns, Anchors, Tethers, and Printable Devices
Laser-Formed Interconnects for Redundant Devices
Chiplets with Connection Posts
Transfer Stamps with Multiple Separate Pedestals
Methods of Making Printed Structures
Displays with Embedded Light Emitters
Micro-Transfer Printing with Selective Component Removal
Printable, Flexible, and Stretchable Inorganic Light Emitting Diode Displays and Other Systems
Application:
60/885,306 →
Optical Systems Fabricated by Printing-Based Assembly
Application:
60/944,611 →
Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp Transfer
Application:
61/116,136 →
Methods of Forming Integrated Circuit Chips from Semiconductor-on-Insulator (SOI) Substrates
Application:
61/163,535 →
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Application:
61/242,955 →
Selective Transfer of Active Components
Application:
61/318,508 →
Active Backplane
Application:
61/318,522 →
Materials and Processes for Releasing Printable Compound Semiconductor Devices
Application:
61/371,467 →
Structures and Methods for Testing Printable Integrated Circuits
Application:
61/377,131 →
Interconnection Structure and Method for Transfer-Printed Integrated Circuits
Application:
61/416,527 →
Substrates with Transferable Chiplets
Application:
61/494,507 →
Methods for Surface Attachment of Flipped Active Components
Application:
61/494,514 →
Through-Silicon Vias And Interposers Formed By Metal-Catalyzed Wet Etching
Application:
61/788,452 →
Systems and Methods for Preparing Gan and Related Materials for Micro Assembly
Application:
62/014,070 →
Micro Assembled High Frequency Devices and Arrays
Application:
62/014,074 →
Micro Assembled Led Displays and Lighting Elements
Application:
62/014,077 →
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Application:
62/014,078 →
Systems and Methods for Providing Micro Assembled Devices
Application:
62/014,079 →
Apparatus and Method for Micro-Transfer Printing
Application:
62/026,694 →
Micro Assembled Led Displays and Lighting Elements
Application:
62/026,695 →
Methods and Tools for Micro-Transfer Printing
Application:
62/027,166 →
Micro Assembled Led Displays and Lighting Elements
Application:
62/029,533 →
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Application:
62/029,535 →
Micro Assembled Hybrid Iled-Oled Displays and Lighting Elements
Application:
62/042,093 →
Compound Micro-Assembly Strategies and Devices
Application:
62/055,472 →
Interconnection Architectures Advantageous for Micro-Led Displays Assembled via Micro Transfer Printing
Application:
62/055,485 →
Interconnection Architectures Advantageous for Micro-Led Displays Assembled via Micro Transfer Printing
Application:
62/056,419 →
Method for Producing a Semiconductor Component and a Semiconductor Component
Application:
62/110,358 →
Method for Producing a Semiconductor Component and a Semiconductor Component
Application:
62/110,365 →
Passive Matrix Display with Bottom Emitting Inorganic Micro Scale Light Emitting Diodes
Application:
62/131,230 →
Micro Assembled Micro Led Displays and Lighting Elements
Application:
62/148,603 →
Small-Aperture-Ratio Display with Electrical Component
Application:
62/164,953 →
Inorganic-Light-Emitter Display with Integrated Black Matrix
Application:
62/169,520 →
Micro Assembled Micro Led Displays and Lighting Elements
Application:
62/169,531 →
Self-Compensating Circuit for Faulty Display Pixels
Application:
62/170,583 →
Self-Compensating Circuit for Faulty Display Pixels
Application:
62/170,589 →
Crystalline Color-Conversion Device
Application:
62/173,200 →
Distributed Charge-Pump Power-Supply System
Application:
62/173,206 →
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Application:
62/245,055 →
Efficiently Micro-Transfer Printing Micro-Scale Devices Onto Large-Format Substrates
Application:
62/300,040 →
Inorganic Led Pixel Structure
Application:
62/301,077 →
Micro-Transfer Printable LED Component
Application:
62/303,096 →
Display with Fused Leds
Application:
62/311,288 →
Pressure-Activated Electrical Interconnection by Micro-Transfer Printing
Application:
62/317,107 →
Micro-Transfer Printed LED and Color Filter Structure
Application:
62/318,512 →
Multi-Pixel Distributed Pulse Width Modulation Control
Application:
62/334,351 →
Micro-Transfer-Printed Light-Emitting Diode Device
Application:
62/344,148 →
Voltage-Balanced Serial Iled Pixel and Display
Application:
62/345,304 →
Led Structure with Polarized Light Emission
Application:
62/348,449 →
Single Metal Layer Display
Application:
62/366,945 →
Chiplets with Wicking Posts
Application:
62/367,899 →
Printable 3D Electronic Structure
Application:
62/371,008 →
Matrix-addressed device repair
Application:
62/387,189 →
Serial row-select matrix-addressed system
Application:
62/387,259 →
Distributed Pulse Width Modulation Control
Application:
62/387,544 →
Electrically Parallel Fused Leds
Application:
62/395,001 →
Multi-Led Component
Application:
62/398,007 →
Micro-Transfer Printing with Volatile Adhesive Layer
Application:
62/403,427 →
Led Optical Component
Application:
62/414,085 →
Spatially Dithered High-Resolution Display
Application:
62/420,529 →
Micro-Transfer-Printable Flip-Chip Structure and Method
Application:
62/422,365 →
Isolation Structure for Micro-Transfer-Printable Devices
Application:
62/436,038 →
Micro-Transfer Printed Device Repair
Application:
62/436,240 →
Digital-Drive Pulse-Width-Modulated Output System
Application:
62/444,753 →
Stacked Pixel Structure
Application:
62/450,866 →
Inorganic Light-Emitting-Diode Display with Multi-Iled Pixels
Application:
62/456,451 →
Testing Transfer-Print Micro-Devices on Wafer
Application:
62/469,906 →
Micro-Device Pocket for Transfer Printing
Application:
62/477,834 →
Matrix-Addressed Tile and Array
Application:
62/502,521 →
Micro-Iled Display with Substrate Holes
Application:
62/535,307 →
Multi-Level Micro-Device Tether
Application:
62/545,413 →
Rigid Micro-Modules with Iled and Light Conductor
Application:
62/585,441 →
Interconnection by Lateral Transfer Printing
Application:
62/589,913 →
Device Source Wafers with Patterned Dissociation Interfaces
Application:
62/621,287 →
Laser-Formed Interconnects for Redundant Devices
Application:
62/778,519 →
Methods of Making Printed Structures
Application:
62/786,286 →
Components with Backside Adhesive Layers
Application:
62/815,935 →
Tiled Displays with Black-Matrix Support Screens
Application:
62/817,478 →
Surface-Mountable Pixel Packages and Pixel Engines
Application:
62/817,491 →
Particle Capture Using Transfer Stamp
Application:
62/883,007 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 14, 2008
From: WINTERS, DUSTIN L.; HAMER, JOHN W.; PARRETT, GARY; BOWER, CHRISTOPHER
To: EASTMAN KODAK COMPANY; SEMPRIUS, INC.
Reel/Frame 021389/0879 →
Assignment of Assignor's Interest
Sep 22, 2008
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 021564/0278 →
Assignment of Assignor's Interest
Aug 6, 2009
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023061/0367 →
Assignment of Assignor's Interest
Sep 10, 2009
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023211/0629 →
Assignment of Assignor's Interest
Dec 7, 2009
From: ROGERS, JOHN A.; KIM, TAE HO; CHOI, WON MOOK; KIM, DAE HYEONG
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 023615/0876 →
Assignment of Assignor's Interest
Dec 8, 2009
From: MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 023621/0400 →
Assignment of Assignor's Interest
Jan 15, 2010
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023795/0173 →
Assignment of Assignor's Interest
Mar 11, 2010
From: EASTMAN KODAK COMPANY
To: GLOBAL OLED TECHNOLOGY LLC
Reel/Frame 024068/0468 →
Assignment of Assignor's Interest
Mar 26, 2010
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 024147/0249 →
Assignment of Assignor's Interest
Jun 30, 2010
From: ROGERS, JOHN A.; NUZZO, RALPH; KIM, HOON-SIK; BRUECKNER, ERIC
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 024619/0347 →
Assignment of Assignor's Interest
Jul 26, 2010
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 024738/0820 →
Assignment of Assignor's Interest
Jul 26, 2010
From: ROGERS, JOHN A.; NUZZO, RALPH G.; MEITL, MATTHEW; BACA, ALFRED J.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 024738/0935 →
Assignment of Assignor's Interest
May 24, 2011
From: ROGERS, JOHN A.; NUZZO, RALPH G.; MEITL, MATTHEW; BACA, ALFRED J.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 026330/0862 →
Assignment of Assignor's Interest
May 24, 2011
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 026330/0822 →
Confirmatory License
Aug 30, 2011
From: UNIVERSITY OF ILLINOIS
To: ENERGY, UNITED STATE DEPARTMENT OF
Reel/Frame 026833/0046 →
Confirmatory License
Aug 30, 2011
From: UNIVERSITY OF ILLINOIS
To: ENERGY, UNITED STATE DEPARTMENT OF
Reel/Frame 026833/0051 →
Assignment of Assignor's Interest
Nov 22, 2011
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 027268/0179 →
Assignment of Assignor's Interest
Dec 6, 2011
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 027339/0120 →
Assignment of Assignor's Interest
Dec 6, 2011
From: ROGERS, JOHN A.; KIM, SEOK; CARLSON, ANDREW
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 027338/0080 →
Assignment of Assignor's Interest
Dec 22, 2011
From: CARLISLE, JOHN
To: ADVANCED DIAMOND TECHNOLOGIES, INC.
Reel/Frame 027435/0323 →
Assignment of Assignor's Interest
Jan 18, 2012
From: ROGERS, JOHN A.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 027553/0989 →
Assignment of Assignor's Interest
Jan 18, 2012
From: MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 027553/0892 →
Assignment of Assignor's Interest
May 30, 2012
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; HAMER, JOHN; COK, RONALD S.
To: SEMPRIUS, INC.
Reel/Frame 028288/0001 →
Assignment of Assignor's Interest
Jun 7, 2012
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 028337/0872 →
Assignment of Assignor's Interest
Jul 23, 2014
From: MEITL, MATTHEW; BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 033371/0602 →