CAVITY STRUCTURES
A cavity structure comprises a cavity substrate comprising a substrate surface, one or more cavity walls extending from the substrate surface, a cap disposed on the one or more cavity walls, and at least a portion of a module tether physically attached to the cavity substrate. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume, for example enclosing a vacuum, air, an added gas, or a liquid. The cavity structure can be a micro-transfer printable structure provided on a cavity structure source wafer. A plurality of cavity structures can be disposed on a destination substrate, for example by transfer printing, dry contact printing, or micro-transfer printing.
1 . A cavity structure, comprising:
a cavity substrate comprising a substrate surface;
one or more cavity walls extending from the substrate surface;
a cap disposed on the one or more cavity walls; and
at least a portion of a module tether physically attached to the cavity substrate,
wherein the cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume.
2 . The cavity structure of claim 1 , wherein the cap comprises a broken or separated cap tether.
3 - 4 . (canceled)
5 . The cavity structure of claim 1 , comprising a component disposed within the cavity.
6 - 7 . (canceled)
8 . The cavity structure of claim 5 , wherein the component comprises a broken or separated component tether.
9 . The cavity structure of claim 1 , comprising a plurality of components disposed within the cavity.
10 . The cavity structure of claim 1 , wherein the cap and the one or more cavity walls are a common structure.
11 . The cavity structure of claim 1 , wherein the cap and the one or more cavity walls are different structures that are adhered together.
12 . The cavity structure of claim 1 , comprising an adhesive layer disposed in contact with the one or more cavity walls.
13 - 15 . (canceled)
16 . The cavity structure of claim 12 , wherein the adhesive layer adheres the one or more cavity walls to the cavity substrate.
17 . The cavity structure of claim 12 , wherein a portion of the adhesive layer is disposed on the cap on a side of the cap adjacent to the cavity substrate.
18 . (canceled)
19 . The cavity structure of claim 1 , comprising:
a module source wafer comprising a sacrificial layer having sacrificial portions laterally spaced apart by anchors; and
a plurality of cavity substrates each having a respective substrate surface, wherein
each of the plurality of cavity substrates is disposed entirely and directly over a corresponding one of the sacrificial portions,
one or more respective cavity walls extend from the respective substrate surface, and
a respective cap is disposed on the one or more respective cavity walls such that the respective substrate surface, the one or more respective cavity walls, and the respective cap form a respective cavity enclosing a respective volume.
20 . The cavity structure of claim 19 , wherein each of the plurality of cavity substrates is physically attached to one of the anchors by at least one module tether.
21 . (canceled)
22 . The cavity structure of claim 1 , comprising:
a module source wafer comprising a patterned sacrificial layer comprising an array of recesses, wherein the cavity substrate is laterally attached to the module source wafer with the at least a portion of the module tether such that the cavity substrate is suspended entirely over a respective recess in the array of recesses thereby defining a gap between the cavity substrate and the respective recess.
23 . The cavity structure of claim 1 , comprising a destination substrate and wherein at least one cavity substrate is adhered to the destination substrate.
24 - 26 . (canceled)
27 . A compound printed cavity system comprising:
a destination substrate; and
a plurality of printed cavity structures disposed on the destination substrate, each of the plurality of printed cavity structures comprising:
a cavity substrate comprising a substrate surface;
one or more cavity walls extending from the substrate surface;
a cap disposed on the one or more cavity walls; and
a broken or separated module tether physically attached to the cavity substrate,
wherein the cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume.
28 . A cavity structure, comprising:
a cavity substrate comprising a substrate surface;
one or more cavity walls extending from the substrate surface; and
an adhesive wafer having adhesive disposed on a side of the adhesive wafer, the adhesive in contact with the one or more cavity walls on a side of the one or more cavity walls opposite the cavity substrate,
wherein the cavity substrate, the one or more cavity walls, and the adhesive wafer form a cavity enclosing a volume.
29 . A cavity structure, comprising:
a cavity substrate comprising a substrate surface;
one or more cavity walls extending from the substrate surface; and
adhesive disposed on the one or more cavity walls only on a side of the one or more cavity walls opposite the cavity substrate.
30 . The cavity structure of claim 28 , comprising a cap disposed on the one or more cavity walls and in contact with the adhesive, wherein the cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume.
31 . A cavity structure, comprising:
a cavity substrate comprising a substrate surface;
one or more cavity walls extending from the substrate surface;
a cap disposed on the one or more cavity walls; and
a component structure disposed on and in contact only with a side of the cap adjacent to the cavity substrate,
wherein the cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume and the component structure.
32 . The cavity structure of claim 31 , comprising at least a portion of a module tether physically attached to the cavity substrate.