IP Library Assignment 057500/0658
Patent Assignment
Reel/Frame 057500/0658

Change of Name

Recorded: 2021-09-16 Pages: 3
Assignor
X-CELEPRINT LIMITED
Executed: 2019-12-23
Assignee
X DISPLAY COMPANY TECHNOLOGY LIMITED
6TH FLOOR, 2 GRAND CANAL SQUARE, DUBLIN 2, IRELAND
Covered Properties (26)
Methods of Forming Printable Integrated Circuit Devices by Selective Etching to Suspend the Devices from a Handling Substrate and Devices Formed Thereby
Patent: 8,877,648 →
Application: 12/732,868 →
Publication: US 2010/0248484
Interconnection Structures and Methods for Transfer-Printed Integrated Circuit Elements with Improved Interconnection Alignment Tolerance
Patent: 9,899,329 →
Application: 13/302,497 →
Publication: US 2012/0126229
Methods for Surface Attachment of Flipped Active Components
Patent: 8,889,485 →
Application: 13/491,196 →
Publication: US 2012/0313241
Methods of Selectively Transferring Active Components
Patent: 9,496,155 →
Application: 13/638,019 →
Publication: US 2013/0273695
Electrically Bonded Arrays of Transfer Printed Active Components
Patent: 9,049,797 →
Application: 13/638,040 →
Publication: US 2013/0153277
Structures and Methods for Testing Printable Integrated Circuits
Patent: 9,142,468 →
Application: 13/818,901 →
Publication: US 2013/0221355
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
Patent: 9,040,425 →
Application: 14/334,179 →
Publication: US 2015/0079783
Methods for Surface Attachment of Flipped Active Components
Patent: 9,307,652 →
Application: 14/541,276 →
Publication: US 2015/0135525
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
Patent: 9,443,883 →
Application: 14/708,893 →
Publication: US 2015/0380436
Electrically Bonded Arrays of Transfer Printed Active Components
Application: 14/715,191 →
Publication: US 2015/0327388
Structures and Methods for Testing Printable Integrated Circuits
Patent: 9,923,133 →
Application: 14/831,236 →
Publication: US 2015/0380619
Printable Device Wafers with Sacrificial Layers Gaps
Patent: 9,899,432 →
Application: 15/243,228 →
Publication: US 2017/0133412
Interconnection Structures and Methods for Transfer-Printed Integrated Circuit Elements with Improved Interconnection Alignment Tolerance
Application: 15/863,164 →
Publication: US 2018/0130751
Printable Device Wafers with Sacrificial Layers
Application: 15/864,813 →
Publication: US 2018/0130829
Methods of Making Printable Device Wafers with Sacrificial Layers
Application: 16/192,751 →
Publication: US 2019/0088690
Printed Components on Substrate Posts
Application: 16/207,690 →
Publication: US 2020/0176285
Module Structures with Component on Substrate Post
Application: 16/207,738 →
Publication: US 2020/0176286
Printing Components Over Substrate Post Edges
Application: 16/207,774 →
Publication: US 2020/0177149
Printing Component Arrays with Different Orientations
Application: 16/274,969 →
Publication: US 2020/0258761
Cavity Structures
Application: 16/297,427 →
Publication: US 2020/0176671
High-Precision Printed Structures
Application: 16/408,155 →
Pixel Modules with Controllers and Light Emitters
Application: 16/442,142 →
Publication: US 2020/0395510
Structures and Methods for Electrically Connecting Printed Components
Application: 16/532,591 →
Publication: US 2021/0043816
Displays with Unpatterned Layers of Light-Absorbing Material
Application: 16/669,493 →
Publication: US 2021/0135070
Wafers with Etchable Sacrificial Patterns, Anchors, Tethers, and Printable Devices
Application: 16/697,104 →
Publication: US 2020/0098796
Laser-Formed Interconnects for Redundant Devices
Application: 16/702,352 →
Publication: US 2020/0194370
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 26, 2010
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 024147/0249 →
Assignment of Assignor's Interest Nov 22, 2011
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 027268/0179 →
Assignment of Assignor's Interest Jun 7, 2012
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 028337/0872 →
Assignment of Assignor's Interest Dec 3, 2012
From: MENARD, ETIENNE; BOWER, CHRISTOPHER; MEITL, MATTHEW; GARROU, PHILIP
To: SEMPRIUS, INC.
Reel/Frame 029393/0807 →
Assignment of Assignor's Interest Dec 11, 2012
From: MENARD, ETIENNE; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 029447/0370 →
Assignment of Assignor's Interest May 9, 2013
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 030383/0429 →
Security Agreement Oct 30, 2014
From: SEMPRIUS INC.
To: SILICON VALLEY BANK; HORIZON TECHNOLOGY FINANCE CORPORATION, AS COLLATERAL AGENT; HORIZON FUNDING TRUST 2013-1
Reel/Frame 034098/0475 →
Release of Security Interest Apr 7, 2017
From: SILICON VALLEY BANK; HORIZON TECHNOLOGY FINANCE CORPORATION, AS COLLATERAL AGENT; HORIZON FUNDING TRUST 2013-1
To: SEMPRIUS INC.
Reel/Frame 041932/0462 →
Assignment of Assignor's Interest Apr 11, 2017
From: SEMPRIUS, INC.
To: SEMPRIUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 042231/0140 →
Assignment of Assignor's Interest Apr 13, 2017
From: SEMPRIUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: X-CELEPRINT LIMITED
Reel/Frame 042244/0531 →
Assignment of Assignor's Interest May 25, 2017
From: MENARD, ETIENNE; BOWER, CHRISTOPHER; MEITL, MATTHEW; GARROU, PHILIP
To: SEMPRIUS, INC.
Reel/Frame 042508/0799 →
Assignment of Assignor's Interest May 25, 2017
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 042508/0878 →
Assignment of Assignor's Interest May 25, 2017
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 042508/0916 →
Assignment of Assignor's Interest May 25, 2017
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 042508/0983 →
Assignment of Assignor's Interest May 25, 2017
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 042509/0056 →
Assignment of Assignor's Interest May 25, 2017
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 042509/0101 →
Assignment of Assignor's Interest Feb 2, 2018
From: BOWER, CHRISTOPHER
To: X-CELEPRINT LIMITED
Reel/Frame 045253/0062 →
Assignment of Assignor's Interest Apr 25, 2018
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: X-CELEPRINT LIMITED
Reel/Frame 045631/0889 →
Assignment of Assignor's Interest Feb 15, 2019
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: X-CELEPRINT LIMITED
Reel/Frame 048347/0239 →
Assignment of Assignor's Interest Feb 15, 2019
From: ROTZOLL, ROBERT R.; TRINDADE, ANTÓNIO JOSÉ MARQUES; GUL, RAJA FAZAN; CHIKHAOUI, ALEXANDRE
To: X-CELEPRINT LIMITED
Reel/Frame 048347/0739 →
Assignment of Assignor's Interest Feb 15, 2019
From: GOMEZ, DAVID; BOWER, CHRISTOPHER ANDREW; GUL, RAJA FAZAN; TRINDADE, ANTÓNIO JOSÉ MARQUES
To: X-CELEPRINT LIMITED
Reel/Frame 048348/0112 →
Assignment of Assignor's Interest Feb 15, 2019
From: TRINDADE, ANTÓNIO JOSÉ MARQUES; GUL, RAJA FAZAN; ROTZOLL, ROBERT R.; CHIKHAOUI, ALEXANDRE
To: X-CELEPRINT LIMITED
Reel/Frame 048347/0358 →
Change of Name May 11, 2020
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 052631/0800 →
Assignment of Assignor's Interest Apr 28, 2026
From: X DISPLAY COMPANY TECHNOLOGY LIMITED
To: DAKTRONICS, INC.
Reel/Frame 075482/0209 →