Methods for surface attachment of flipped active components

1. A method for transferring a plurality of active components from a source substrate to a destination substrate, the method comprising:

providing a source substrate having a process side including the plurality active components therein or thereon, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces;

pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; and

after pressing the first stamp against the plurality of active components, transferring the plurality of active components to a receiving surface of a destination substrate utilizing a second stamp having second pillars protruding therefrom, wherein each active component includes a component substrate different from the destination substrate, wherein transferring the plurality of active components to the receiving surface comprises:

pressing the second stamp against a destination substrate to adhere the plurality of active components to a receiving surface of the destination substrate; and

removing the second stamp from the receiving surface of the destination, thereby transferring the active components to the destination substrate and forming a display.

2. The method of claim 1 , wherein the second stamp transfers the active components from the first stamp to the destination substrate.

3. The method of claim 1 , wherein the plurality of active components comprises a plurality of integrated circuits.

4. The method of claim 1 , wherein the receiving surface comprises an adhesive layer.

5. The method of claim 4 , wherein the adhesive layer is a curable adhesive layer.

6. The method of claim 1 , wherein transferring the plurality of active components to the receiving surface comprises: pressing the second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars.

7. The method of claim 6 , wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars.

8. The method of claim 1 , wherein pressing the second stamp against the destination substrate adheres the respective primary surfaces of the plurality of active components to the receiving surface of the destination substrate.

9. A method for transferring a plurality of active components from a source substrate to a destination substrate, the method comprising:

providing a source substrate having a process side including the plurality active components therein or thereon, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces;

pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; and

after pressing the first stamp against the plurality of active components, transferring the plurality of active components to a receiving surface of a destination substrate utilizing a second stamp having second pillars protruding therefrom, wherein transferring the plurality of active components to the receiving surface comprises:

pressing the second stamp against a destination substrate to adhere the plurality of active components to a receiving surface of the destination substrate.

10. The method of claim 9 , wherein the second stamp transfers the active components from the first stamp to the destination substrate.

11. The method of claim 9 , wherein the plurality of active components comprises a plurality of integrated circuits.

12. The method of claim 9 , wherein transferring the plurality of active components to the receiving surface comprises: removing the second stamp from the receiving surface of the destination, thereby transferring the active components to the destination substrate and forming a display.

13. The method of claim 9 , wherein the receiving surface comprises an adhesive layer.

14. The method of claim 13 , wherein the adhesive layer is a curable adhesive layer.

15. The method of claim 9 , wherein the first stamp has more first pillars than the second stamp has second pillars.

16. The method of claim 9 , wherein each active component includes a component substrate different from the destination substrate.

17. The method of claim 9 , wherein transferring the plurality of active components to the receiving surface comprises: pressing the second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars.

18. The method of claim 9 , wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars.

19. The method of claim 9 , wherein pressing the second stamp against the destination substrate adheres the respective primary surfaces of the plurality of active components to the receiving surface of the destination substrate.

20. The method of claim 9 , wherein the respective surfaces of the second pillars have a greater surface area than the respective surfaces of the first pillars.