Patent Assignment
Reel/Frame 042231/0140
Assignment of Assignor's Interest
Recorded: 2017-04-11
Pages: 12
Assignor
SEMPRIUS, INC.
Executed: 2017-01-31
Assignee
SEMPRIUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
1100 LA AVENIDA STREET, BUILDING A, MOUNTAIN VIEW, CALIFORNIA, 94043
Covered Properties
(91)
Optical Systems Fabricated by Printing-Based Assembly
Reinforced Composite Stamp for Dry Transfer Printing of Semiconductor Elements
Oled Device with Embedded Chip Driving
Printable, Flexible and Stretchable Diamond for Thermal Management
Vacuum Coupled Tool Apparatus for Dry Transfer Printing Semiconductor Elements
Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp Transfer
Concentrator-Type Photovoltaic (Cpv) Modules, Receiver and Sub-Receivers and Methods of Forming Same
Methods of Forming Printable Integrated Circuit Devices by Selective Etching to Suspend the Devices from a Handling Substrate and Devices Formed Thereby
Optical Systems Fabricated by Printing-Based Assembly
Oled Device with Embedded Chip Driving
Application:
13/191,975 →
Publication:
US 2011/0279014
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Interconnection Structures and Methods for Transfer-Printed Integrated Circuit Elements with Improved Interconnection Alignment Tolerance
Laser Assisted Transfer Welding Process
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Methods for Surface Attachment of Flipped Active Components
Substrates with Transferable Chiplets
Moisture-Proof Expansion Chamber for Equalizing Pressure in Sealed Concentrator Photovoltaic Solar Modules
Application:
13/520,911 →
Publication:
US 2013/0125956
Breathing and Desiccant Regenerating Cycle for Reducing Condensation in Concentrator Photovoltaic Modules
Methods of Selectively Transferring Active Components
Electrically Bonded Arrays of Transfer Printed Active Components
Photovoltaic Devices with Off-Axis Image Display
Application:
13/700,411 →
Publication:
US 2013/0153934
High Concentration Photovoltaic Modules and Methods of Fabricating the Same
Application:
13/705,980 →
Publication:
US 2013/0146120
Indirect Temperature Measurements of Direct Bandgap (Multijunction) Solar Cells Using Wavelength Shifts of Sub-Junction Luminescence Emission Peaks
Application:
13/766,497 →
Publication:
US 2013/0215929
Apparatus and Process for Producing Plano-Convex Silicone-on-Glass Lens Arrays
Application:
13/812,100 →
Publication:
US 2013/0182333
Methods of Fabricating Printable Compound Semiconductor Devices on Release Layers
Structures and Methods for Testing Printable Integrated Circuits
Surface Mountable Solar Receiver with Integrated Through Substrate Interconnect and Optical Element Cradle
Application:
13/827,623 →
Publication:
US 2014/0048128
Surface-Mountable Lens Cradles and Interconnection Structures for Concentrator-Type Photovoltaic Devices
Application:
13/835,851 →
Publication:
US 2014/0034127
Optical Systems Fabricated by Printing-Based Assembly
Power Augmentation in Concentrator Photovoltaic Modules by Collection of Diffuse Light
Application:
14/211,262 →
Publication:
US 2014/0261627
Engineered Substrates for Semiconductor Epitaxy and Methods of Fabricating the Same
High Efficiency Solar Receivers Including Stacked Solar Cells for Concentrator Photovoltaics
Application:
14/211,708 →
Publication:
US 2014/0261628
Through-Silicon Vias and Interposers Formed by Metal-Catalyzed Wet Etching
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
Methods for Surface Attachment of Flipped Active Components
Substrates with Transferable Chiplets
Printing-Based Assembly of Multi-Junction, Multi-Terminal Photovoltaic Devices and Related Methods
Application:
14/599,290 →
Publication:
US 2015/0207012
Multi-Junction Power Converter with Photon Recycling
Application:
14/683,498 →
Publication:
US 2015/0295114
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
Electrically Bonded Arrays of Transfer Printed Active Components
Application:
14/715,191 →
Publication:
US 2015/0327388
Optical Systems Fabricated by Printing-Based Assembly
Methods for Surface Attachment of Flipped Active Components
Structures and Methods for Testing Printable Integrated Circuits
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Laser Assisted Transfer Welding Process
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Printable Device Wafers with Sacrificial Layers Gaps
Multi-Junction Photovoltaic Micro-Cell Architectures for Energy Harvesting and/or Laser Power Conversion
Application:
15/280,484 →
Publication:
US 2017/0018675
Layers of Safety & Failsafe Capability for Operation of Class Iv Laser in Consumer Electronics Devices
Miniaturized Devices for Combined Optical Power Conversion and Data Transmission
Application:
15/280,627 →
Publication:
US 2017/0093501
Wafer-Integrated, Ultra-Low Profile Concentrated Photovoltaics (Cpv) for Space Applications
Optical Systems Fabricated by Printing-Based Assembly
Optical Systems Fabricated by Printing-Based Assembly
Optical Systems Fabricated by Printing-Based Assembly
Methods for Surface Attachment of Flipped Active Components
Printable, Flexible, and Stretchable Inorganic Light Emitting Diode Displays and Other Systems
Application:
60/885,306 →
Optical Systems Fabricated by Printing-Based Assembly
Application:
60/944,611 →
Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp Transfer
Application:
61/116,136 →
Surface Mountable Leadless Sub-Receiver for Concentrator Photovoltaic Systems
Application:
61/151,073 →
Concentrator Photovoltaics Module Employing Ultra-Thin Micro-Solar Cells with Massively Parallel Two-Stage Optics
Application:
61/151,083 →
Methods of Forming Integrated Circuit Chips from Semiconductor-on-Insulator (SOI) Substrates
Application:
61/163,535 →
Method of Fabricating and Aligning Secondary Optical Components to Concentrator Photovoltaic Cells While Providing a Controlled Local Environment
Application:
61/166,513 →
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Application:
61/242,955 →
Moisture-Proof Expansion Chamber for Equalizing Pressure in Sealed Concentrator Photovoltaic Solar Modules
Application:
61/293,069 →
Selective Transfer of Active Components
Application:
61/318,508 →
Active Backplane
Application:
61/318,522 →
Photovoltaic Device with Off-Axis Image Display
Application:
61/352,028 →
Apparatus and Process for Producing Plano-Convex Silicone-On-Glass Lens Array
Application:
61/367,491 →
Materials and Processes for Releasing Printable Compound Semiconductor Devices
Application:
61/371,467 →
Structures and Methods for Testing Printable Integrated Circuits
Application:
61/377,131 →
Interconnection Structure and Method for Transfer-Printed Integrated Circuits
Application:
61/416,527 →
Substrates with Transferable Chiplets
Application:
61/494,507 →
Methods for Surface Attachment of Flipped Active Components
Application:
61/494,514 →
Breathing and Desiccant Regenerating Cycle for Reducing Condensation in Concentrator Photovoltaic Modules
Application:
61/521,967 →
High Concentration Photovoltaic Modules and Methods of Fabricating the Same
Application:
61/568,900 →
Indirect Temperature Measurement Of Direct Bandgap (Multijunction) Solar Cells Using The Wavelength Shift Of A Sub-Junction Luminescence Emission Peak
Application:
61/599,737 →
Surface-Mountable Lens Cradles and Interconnection Structures for Concentrator-Type Photovoltaic Devices
Application:
61/677,892 →
Surface Mountable Solar Receiver with Integrated Through Substrate Interconnect and Optical Element Cradle
Application:
61/683,958 →
Indirect Temperature Measurements Of Direct Bandgap (Multijunction) Solar Cells Using Wavelength Shifts Of Sub-Junction Luminescence Emission Peaks
Application:
61/704,162 →
Indirect Temperature Measurements of Direct Bandgap (Multijunction) Solar Cells Using Wavelength Shifts of Sub-Junction Luminescence Emission Peaks
Application:
61/704,889 →
Power Augmentation in Concentrator Photovoltaic Modules by Collection of Diffuse Light
Application:
61/782,622 →
High Efficiency Solar Receivers Including Stacked Solar Cells for Concentrator Photovoltaics
Application:
61/782,983 →
Through-Silicon Vias And Interposers Formed By Metal-Catalyzed Wet Etching
Application:
61/788,452 →
Engineered Substrates for Semiconductor Epitaxy
Application:
61/788,526 →
Printing-based assembly of quadruple junction, four-terminal microscale solar cells and their use in modules with high operating efficiencies
Application:
61/928,364 →
Multijunction Laser Power Converter with Photon Recycling
Application:
61/978,569 →
Miniaturized Devices for Combined Optical Power Conversion and Data Transmission
Application:
62/234,302 →
Multi-Junction Photovoltaic Micro-Cell Architectures for Energy Harvesting and/or Laser Power Conversion
Application:
62/234,305 →
Layers of Safety & Failsafe Capability for Operation of Class IV Laser in Consumer Electronics Devices
Application:
62/234,324 →
Wafer-Integrated, Ultra-Low Profile Concentrated Photovoltaics (CPV) for Space Applications
Application:
62/236,325 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 14, 2008
From: WINTERS, DUSTIN L.; HAMER, JOHN W.; PARRETT, GARY; BOWER, CHRISTOPHER
To: EASTMAN KODAK COMPANY; SEMPRIUS, INC.
Reel/Frame 021389/0879 →
Assignment of Assignor's Interest
Sep 22, 2008
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 021564/0278 →
Assignment of Assignor's Interest
Sep 10, 2009
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023211/0629 →
Assignment of Assignor's Interest
Dec 7, 2009
From: ROGERS, JOHN A.; KIM, TAE HO; CHOI, WON MOOK; KIM, DAE HYEONG
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 023615/0876 →
Assignment of Assignor's Interest
Dec 8, 2009
From: MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 023621/0400 →
Assignment of Assignor's Interest
Jan 15, 2010
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023795/0173 →
Assignment of Assignor's Interest
Mar 11, 2010
From: EASTMAN KODAK COMPANY
To: GLOBAL OLED TECHNOLOGY LLC
Reel/Frame 024068/0468 →
Assignment of Assignor's Interest
Mar 26, 2010
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; MEITL, MATTHEW; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 024147/0249 →
Assignment of Assignor's Interest
Jun 9, 2010
From: MENARD, ETIENNE; BOWER, CHRISTOPHER; BURROUGHS, SCOTT; CARR, JOE
To: SEMPRIUS, INC.
Reel/Frame 024508/0626 →
Assignment of Assignor's Interest
Jul 26, 2010
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 024738/0820 →
Assignment of Assignor's Interest
Jul 26, 2010
From: ROGERS, JOHN A.; NUZZO, RALPH G.; MEITL, MATTHEW; BACA, ALFRED J.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 024738/0935 →
Assignment of Assignor's Interest
May 24, 2011
From: ROGERS, JOHN A.; NUZZO, RALPH G.; MEITL, MATTHEW; BACA, ALFRED J.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 026330/0862 →
Assignment of Assignor's Interest
May 24, 2011
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 026330/0822 →
Confirmatory License
Aug 30, 2011
From: UNIVERSITY OF ILLINOIS
To: ENERGY, UNITED STATE DEPARTMENT OF
Reel/Frame 026833/0046 →
Confirmatory License
Aug 30, 2011
From: UNIVERSITY OF ILLINOIS
To: ENERGY, UNITED STATE DEPARTMENT OF
Reel/Frame 026833/0051 →
Assignment of Assignor's Interest
Nov 22, 2011
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 027268/0179 →
Assignment of Assignor's Interest
Dec 6, 2011
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 027339/0120 →
Assignment of Assignor's Interest
Dec 6, 2011
From: ROGERS, JOHN A.; KIM, SEOK; CARLSON, ANDREW
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 027338/0080 →
Assignment of Assignor's Interest
Dec 22, 2011
From: CARLISLE, JOHN
To: ADVANCED DIAMOND TECHNOLOGIES, INC.
Reel/Frame 027435/0323 →
Assignment of Assignor's Interest
Jan 18, 2012
From: ROGERS, JOHN A.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 027553/0989 →
Assignment of Assignor's Interest
Jan 18, 2012
From: MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 027553/0892 →
Assignment of Assignor's Interest
May 30, 2012
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; HAMER, JOHN; COK, RONALD S.
To: SEMPRIUS, INC.
Reel/Frame 028288/0001 →
Assignment of Assignor's Interest
Jun 7, 2012
From: BOWER, CHRISTOPHER; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 028338/0230 →
Assignment of Assignor's Interest
Jun 7, 2012
From: BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 028337/0872 →
Assignment of Assignor's Interest
Feb 6, 2013
From: FURMAN, BRUCE; MENARD, ETIENNE; BUKOVNIK, RUDY; BURROUGHS, SCOTT
To: SEMPRIUS, INC.
Reel/Frame 029767/0378 →