Substrates with transferable chiplets
View Patent ↗A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The transparent intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the transparent intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the transparent intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength. The breakable tethers physically secure the active components to the transparent intermediate substrate. Related devices are also discussed.
1. A transfer device, comprising:
a transparent intermediate substrate having a patterned side;
a patterned photo-sensitive adhesive layer adhered to the patterned side of the transparent intermediate substrate, the patterned adhesive layer comprising a material configured to provide altered adhesive strength responsive to exposure to electromagnetic radiation; and
a plurality of singulated active components adhered to the patterned adhesive layer, the patterned adhesive layer located between the patterned side of the transparent intermediate substrate and the singulated active components, the patterned adhesive layer forming breakable tethers physically connecting the singulated active components to the patterned side of the transparent intermediate substrate.
2. The transfer device of claim 1 , further including a mask on the patterned side of the transparent intermediate substrate.
3. The transfer device of claim 1 , wherein the patterned adhesive layer is a photo-sensitive polymer.
4. The transfer device of claim 1 , wherein the tethers are breakable tethers.
5. The transfer device of claim 1 , wherein the transparent intermediate substrate is a quartz substrate.
6. The transfer device of claim 1 , wherein the active components form a component layer, the transparent intermediate substrate forms a substrate layer, and the tethers form a tether layer that is between the component layer and the substrate layer, and wherein the component layer, the tether layer, and the substrate layer are all different layers.
7. The transfer device of claim 1 , wherein the active components have a process side and a different back side, the active components have connection pads formed on the process side, and the process side is adhered to the patterned adhesive layer.
8. The transfer device of claim 1 , wherein the patterned side of the transparent intermediate substrate is structured to increase a distance between portions of the transparent intermediate substrate and the active components.
9. The transfer device of claim 1 , wherein the tethers are shaped to control a manner in which the tethers breaks when mechanically stressed or to control particulate residue when the tether breaks.
10. The transfer device of claim 1 , further including conductive or adhesive materials located on the connection pads.