Patent Assignment
Reel/Frame 057501/0765
Change of Name
Recorded: 2021-09-16
Pages: 3
Assignor
X-CELEPRINT LIMITED
Executed: 2019-12-23
Assignee
X DISPLAY COMPANY TECHNOLOGY LIMITED
6TH FLOOR, 2 GRAND CANAL SQUARE, DUBLIN 2, IRELAND
Covered Properties
(31)
Optical Systems Fabricated by Printing-Based Assembly
Reinforced Composite Stamp for Dry Transfer Printing of Semiconductor Elements
Oled Device with Embedded Chip Driving
Printable, Flexible and Stretchable Diamond for Thermal Management
Vacuum Coupled Tool Apparatus for Dry Transfer Printing Semiconductor Elements
Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp Transfer
Optical Systems Fabricated by Printing-Based Assembly
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Laser Assisted Transfer Welding Process
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Substrates with Transferable Chiplets
Methods of Fabricating Printable Compound Semiconductor Devices on Release Layers
Optical Systems Fabricated by Printing-Based Assembly
Through-Silicon Vias and Interposers Formed by Metal-Catalyzed Wet Etching
Substrates with Transferable Chiplets
Optical Systems Fabricated by Printing-Based Assembly
Methods for Surface Attachment of Flipped Active Components
High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements
Laser Assisted Transfer Welding Process
Method for Producing a Semiconductor Component and a Semiconductor Component
Method for Producing a Semiconductor Component and a Semiconductor Component
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Printing Transferable Components Using Microstructured Elastomeric Surfaces with Pressure Modulated Reversible Adhesion
Optical Systems Fabricated by Printing-Based Assembly
Optical Systems Fabricated by Printing-Based Assembly
Optical Systems Fabricated by Printing-Based Assembly
Methods for Surface Attachment of Flipped Active Components
Isolation Structure for Micro-Transfer-Printable Devices
Method for Producing a Semiconductor Component and a Semiconductor Component
Methods for Surface Attachment of Flipped Active Components
Optical Systems Fabricated by Printing-Based Assembly
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 14, 2008
From: WINTERS, DUSTIN L.; HAMER, JOHN W.; PARRETT, GARY; BOWER, CHRISTOPHER
To: EASTMAN KODAK COMPANY; SEMPRIUS, INC.
Reel/Frame 021389/0879 →
Assignment of Assignor's Interest
Sep 22, 2008
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 021564/0278 →
Assignment of Assignor's Interest
Sep 10, 2009
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023211/0629 →
Assignment of Assignor's Interest
Dec 7, 2009
From: ROGERS, JOHN A.; KIM, TAE HO; CHOI, WON MOOK; KIM, DAE HYEONG
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 023615/0876 →
Assignment of Assignor's Interest
Dec 8, 2009
From: MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 023621/0400 →
Assignment of Assignor's Interest
Jan 15, 2010
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 023795/0173 →
Assignment of Assignor's Interest
Mar 11, 2010
From: EASTMAN KODAK COMPANY
To: GLOBAL OLED TECHNOLOGY LLC
Reel/Frame 024068/0468 →
Assignment of Assignor's Interest
Jul 26, 2010
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 024738/0820 →
Assignment of Assignor's Interest
Jul 26, 2010
From: ROGERS, JOHN A.; NUZZO, RALPH G.; MEITL, MATTHEW; BACA, ALFRED J.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 024738/0935 →
Assignment of Assignor's Interest
May 24, 2011
From: ROGERS, JOHN A.; NUZZO, RALPH G.; MEITL, MATTHEW; BACA, ALFRED J.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 026330/0862 →
Assignment of Assignor's Interest
May 24, 2011
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 026330/0822 →
Confirmatory License
Aug 30, 2011
From: UNIVERSITY OF ILLINOIS
To: ENERGY, UNITED STATE DEPARTMENT OF
Reel/Frame 026833/0046 →
Confirmatory License
Aug 30, 2011
From: UNIVERSITY OF ILLINOIS
To: ENERGY, UNITED STATE DEPARTMENT OF
Reel/Frame 026833/0051 →
Assignment of Assignor's Interest
Dec 6, 2011
From: ROGERS, JOHN A.; KIM, SEOK; CARLSON, ANDREW
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 027338/0080 →
Assignment of Assignor's Interest
Dec 6, 2011
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 027339/0120 →
Assignment of Assignor's Interest
Dec 22, 2011
From: CARLISLE, JOHN
To: ADVANCED DIAMOND TECHNOLOGIES, INC.
Reel/Frame 027435/0323 →
Assignment of Assignor's Interest
Jan 18, 2012
From: MENARD, ETIENNE; MEITL, MATTHEW
To: SEMPRIUS, INC.
Reel/Frame 027553/0892 →
Assignment of Assignor's Interest
Jan 18, 2012
From: ROGERS, JOHN A.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 027553/0989 →
Assignment of Assignor's Interest
May 30, 2012
From: BOWER, CHRISTOPHER; MENARD, ETIENNE; HAMER, JOHN; COK, RONALD S.
To: SEMPRIUS, INC.
Reel/Frame 028288/0001 →
Assignment of Assignor's Interest
Jun 7, 2012
From: BOWER, CHRISTOPHER; CARR, JOSEPH
To: SEMPRIUS, INC.
Reel/Frame 028338/0230 →
Assignment of Assignor's Interest
Apr 15, 2013
From: MEITL, MATTHEW; BOWER, CHRISTOPHER; MENARD, ETIENNE; CARTER, JAMES
To: SEMPRIUS, INC.
Reel/Frame 030216/0254 →
Assignment of Assignor's Interest
Jul 23, 2014
From: MEITL, MATTHEW; BOWER, CHRISTOPHER
To: SEMPRIUS, INC.
Reel/Frame 033371/0602 →
Assignment of Assignor's Interest
Sep 10, 2014
From: MENARD, ETIENNE
To: SEMPRIUS, INC.
Reel/Frame 033707/0245 →
Assignment of Assignor's Interest
Sep 10, 2014
From: ROGERS, JOHN A.; NUZZO, RALPH G.; MEITL, MATTHEW; BACA, ALFRED J.
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 033707/0197 →
Security Agreement
Oct 30, 2014
From: SEMPRIUS INC.
To: SILICON VALLEY BANK; HORIZON TECHNOLOGY FINANCE CORPORATION, AS COLLATERAL AGENT; HORIZON FUNDING TRUST 2013-1
Reel/Frame 034098/0475 →