Methods for surface attachment of flipped active componenets
View Patent ↗A method for selectively transferring active components from a source substrate to a destination substrate includes pressing a first stamp having first pillars protruding therefrom against active components on the source substrate to adhere respective primary surfaces of the active components including electrical connections thereon to respective transfer surfaces of the first pillars. A second stamp having second pillars protruding therefrom is pressed against the active components on the first stamp to adhere respective secondary surfaces of the active components to respective transfer surfaces of the second pillars. The transfer surfaces of the second pillars have greater adhesive strength than the first pillars. The second stamp is pressed against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate.
1. A method for transferring active components from a source substrate to a destination substrate, the method comprising:
providing a source substrate having a process side including active components therein or thereon, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces;
pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars;
pressing a second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars; and
pressing the second stamp including the active components on the second pillars thereof against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate.
2. The method of claim 1 , wherein the first pillars are dimensioned such that the first pillars contact the active components between the electrical connections on the respective primary surfaces thereof.
3. The method of claim 1 , wherein the respective surfaces of the second pillars have a greater surface area than the respective surfaces of the first pillars.
4. The method of claim 1 , wherein the second pillars comprise a material having a greater adhesive strength per unit area than that of the first pillars.
5. The method of claim 1 , wherein the second pillars comprise vacuum collets configured to provide a vacuum strength greater than the adhesive strength of the first pillars to adhere the respective secondary surfaces of the active components thereto.
6. The method of claim 1 , wherein the electrical connections comprise conductive pads on the respective surfaces of the active components.
7. The method of claim 1 , wherein the electrical connections comprise conductive posts protruding from the respective surfaces of the active components.
8. The method of claim 1 , wherein the electrical connections on the respective primary surfaces of the active components are adhered to respective electrical contacts on the receiving surface of the destination substrate.
9. The method of claim 8 , wherein the electrical connections on the respective primary surfaces of the active components are adhered to the respective electrical contacts on the receiving surface of the destination substrate by an adhesive layer thereon.
10. The method of claim 8 , wherein the electrical contacts on the destination substrate comprise a conductive material softer than that of the electrical connections of the active components, and wherein pressing the second stamp against the destination substrate drives the electrical connections of the active components through the electrical contacts on the destination substrate.
11. A method for selectively transferring active components from a source substrate to a destination substrate, the method comprising:
providing a source substrate having a process side including a plurality of active components including electrical connections on respective surfaces thereof and a back side opposite the process side;
providing a first stamp having a plurality of first pillars protruding therefrom that are spatially aligned to the active components, each first pillar having a first area;
pressing the first pillars against corresponding active components between the electrical connections thereof to adhere the active components to the first pillars;
providing a second stamp having a plurality of second pillars protruding therefrom that are spatially aligned to the first pillars, each second pillar having a second area larger than the first area;
pressing the second pillars against corresponding active components to adhere respective surfaces of the active components opposite the electrical connections to the second pillars with van der Waal's forces; and
pressing the second stamp including the active components on the second pillars thereof against the destination substrate to adhere the respective surfaces of the active components including the electrical connections thereon to the destination substrate.
12. The method of claim 11 , further including providing destination substrate contacts formed on the destination substrate that are electrically connected to the electrical connections of the adhered active components.
13. The method of claim 12 , further including heating the electrical connections or destination substrate contacts to increase the adhesion between the active components and the destination substrate and reduce the electrical resistance between the electrical connections and the destination substrate contacts.
14. The method of claim 11 , further including providing the electrical connections as connection pads.
15. The method of claim 11 , further including providing the electrical connections as connection posts.
16. The method of claim 15 , further including providing the connection posts having a height that is greater than a base width.
17. The method of claim 15 , wherein the connection posts have a base area and a peak area, wherein the base area is greater than the peak area.
18. The method of claim 15 , wherein the connection posts on an active component are separated by a post separation distance, and further including providing a first stamp having first pillars with a first width that is smaller than the post separation distance.
19. The method of claim 15 , further including providing destination substrate contacts having a surface formed on the destination substrate and pressing the connection posts through the surface of the destination substrate contacts into the destination substrate contacts to electrically connect the electrical connections of the adhered active components to the destination substrate contacts.
20. The method of claim 19 , further including providing an adhesive layer over the destination substrate contacts to adhere the active components to the destination substrate.
21. The method of claim 20 , further including pressing the connection posts through the adhesive layer into the destination substrate contacts.