Patent Assignment
Reel/Frame 075482/0209
Assignment of Assignor's Interest
Recorded: 2026-04-28
Pages: 39
Assignor
X DISPLAY COMPANY TECHNOLOGY LIMITED
Executed: 2025-12-23
Assignee
DAKTRONICS, INC.
201 DAKTRONICS DRIVE, BROOKINGS, SOUTH DAKOTA, 57006
Covered Properties
(125)
Micro-Device Substrate Structures with Posts and Indentations
Variable-Resolution Cameras and Optical Communication Systems Comprising Variable-Resolution Cameras
Print-Ready Wafers with Bottom-Anchored Components
Color-Agnostic Pixel Repair Sites
White-Light-Emitting Led Structures
Memory Architectures for Hybrid Cluster Displays
Printing Components to Substrate Posts
Printing Components to Substrate Posts
Pixel Modules with Controllers and Light Emitters
Isolation Structure for Micro-Transfer-Printable Devices
Oleds for Micro Transfer Printing
Oleds for Micro Transfer Printing
Transfer Printing High-Precision Devices
Multilayer Electrical Conductors for Transfer Printing
Multilayer Electrical Conductors for Transfer Printing
Chiplets with Connection Posts
Chiplets with Connection Posts
Chiplets with Connection Posts
Chiplets with Connection Posts
Displays with Integrated Touch Screens
Patent:
11,592,933 →
Application:
17/570,985 →
Displays with Integrated Touch Screens
Laser-Formed Interconnects for Redundant Devices
Laser-Formed Interconnects for Redundant Devices
Hybrid Pulse-Width-Modulation Pixels
High-Precision Printed Structures
Patent:
10,714,374 →
Application:
16/408,155 →
Display Dimming for Pulse-Width-Modulation Pixel Control
Hybrid Electro-Optically Controlled Matrix-Addressed Systems
Hybrid Electro-Optically Controlled Matrix-Addressed Systems
Device Source Wafers with Patterned Dissociation Interfaces
Device Source Wafers with Patterned Dissociation Interfaces
Components with Backside Adhesive Layers
Micro-Transfer Printable Electronic Component
Laser Assisted Transfer Welding Process
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Multilayer Printed Capacitors
Interconnection Structures and Methods for Transfer-Printed Integrated Circuit Elements with Improved Interconnection Alignment Tolerance
Redistribution Layer for Substrate Contacts
Methods of Forming Printable Integrated Circuit Devices by Selective Etching to Suspend the Devices from a Handling Substrate and Devices Formed Thereby
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
Printable Device Wafers with Sacrificial Layers Gaps
Bezel-Free Displays
Bezel-Free Displays
Pulse-Density-Modulation Pixel Control Circuits and Devices Including Them
Micro-Light-Emitting Diode Backlight System
Analog Pulse-Width-Modulation Control Circuits
Printable Inorganic Semiconductor Method
Patent:
9,368,683 →
Application:
14/807,311 →
Printable Inorganic Semiconductor Method
Serial Row-Select Matrix-Addressed System
Distributed Pulse Width Modulation Control
Display with Fused Leds
Electrically Parallel Fused Leds
Electrically Parallel Fused Leds
Structures and Methods for Testing Printable Integrated Circuits
Structures and Methods for Testing Printable Integrated Circuits
Multi-Layer Tethers for Micro-Transfer Printing
Multi-Layer Tethers for Micro-Transfer Printing
Micro-Transfer Printed LED and Color Filter Structure
Flat-Panel Pixel Arrays with Signal Regeneration
Patent:
11,386,826 →
Application:
17/355,079 →
Pressure-Activated Electrical Interconnection with Additive Repair
Pressure-Activated Electrical Interconnection with Additive Repair
Pressure-Activated Electrical Interconnection with Additive Repair
Devices with a Single Metal Layer
Devices with a Single Metal Layer
Devices with a Single Metal Layer
Matrix-Addressed Systems with Row-Select Circuits Comprising a Serial Shift Register
Active-Matrix Displays with Common Pixel Control
Printable Inorganic Semiconductor Structures
Printable Device Wafers with Sacrificial Layers
Methods of Making Printable Device Wafers with Sacrificial Layers
Wafers with Etchable Sacrificial Patterns, Anchors, Tethers, and Printable Devices
Printable Device Wafers with Sacrificial Layers
Methods for Surface Attachment of Flipped Active Components
Methods for Surface Attachment of Flipped Active Components
Methods for Surface Attachment of Flipped Active Components
Methods for Surface Attachment of Flipped Active Components
Distributed Charge-Pump Power-Supply System
Printing Components Over Substrate Post Edges
Methods of Making Printed Structures
Displays with Embedded Light Emitters
Pressure-Activated Electrical Interconnection by Micro-Transfer Printing
Apparatus and Methods for Micro-Transfer-Printing
Printed Structures with Electrical Contact Having Reflowable Polymer Core
Systems and Methods for Controlling Release of Transferable Semiconductor Structures
Printable Inorganic Semiconductor Structures
Printable Inorganic Semiconductor Structures
Systems and Methods for Preparing Gan and Related Materials for Micro Assembly
SYSTEMS AND METHODS FOR PREPARING GaN AND RELATED MATERIALS FOR MICRO ASSEMBLY
SYSTEMS AND METHODS FOR PREPARING GaN AND RELATED MATERIALS FOR MICRO ASSEMBLY
Micro-Transfer Printing with Selective Component Removal
Patent:
10,573,544 →
Application:
16/163,559 →
Micro-Transfer Printing with Selective Component Removal
Small-Aperture-Ratio Display with Electrical Component
Self-Compensating Circuit for Faulty Display Pixels
Self-Compensating Circuit for Faulty Display Pixels
Multi-Layer Stamp
Multi-Layer Stamp
Micro-Transfer-Printed Light-Emitting Diode Device
Multi-Led Components
Wirelessly Powered Display and System
Reinforced Composite Stamp for Dry Transfer Printing of Semiconductor Elements
Micro Assembled Led Displays and Lighting Elements
Chiplets with Connection Posts
Particle Capture Using Transfer Stamp
Particle Capture Using Transfer Stamp
Modules with Integrated Circuits and Devices
Modules with Integrated Circuits and Devices
Modules with Integrated Circuits and Devices
Color-Agnostic Pixel Repair Sites
Application:
19/176,877 →
Publication:
US US20260080815A1
Memory Architectures for Hybrid Cluster Displays
Application:
19/407,214 →
Publication:
US US20260148688A1
Compound Micro-Assembly Strategies and Devices
Application:
18/432,677 →
Publication:
US US20240213238A1
Optical Communication Systems with Displays
Application:
18/751,538 →
Publication:
US US20250080823A1
Pixel Modules with Controllers and Light Emitters
Application:
17/163,306 →
Publication:
US US20210151630A1
Display Amplifiers
Application:
18/746,948 →
Publication:
US US20250384850A1
Oleds for Micro Transfer Printing
Application:
17/671,752 →
Publication:
US US20220216413A1
Transfer Printing High-Precision Devices
Application:
18/660,812 →
Publication:
US US20240292543A1
Chiplets with Connection Posts
Application:
18/515,364 →
Publication:
US US20240170430A1
Hybrid Control for Leds, Pixels, and Displays
Application:
17/848,311 →
Publication:
US US20230290763A1
Displays with Integrated Touch Screens
Application:
18/415,981 →
Publication:
US US20240152230A1
Binary-Pixel Optical Communication Systems
Application:
18/888,465 →
Publication:
US US20250330241A1
Controlling Adhesive Reflow for Transfer Printing
Displays with Variable Pixel Spatial Resolution
Application:
18/783,718 →
Publication:
US US20250166554A1
Transfer Printing Micro-Components from Carrier Substrates
Application:
18/640,131 →
Publication:
US US20240363800A1
Display Dimming for Pulse-Width-Modulation Pixel Control
Application:
19/262,860 →
Publication:
US US20250336347A1
Hybrid Electro-Optically Controlled Matrix-Addressed Systems
Application:
18/678,199 →
Publication:
US US20240322063A1
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 2, 2015
From: PREVATTE, CARL; BOWER, CHRISTOPHER; COK, RONALD S.; MEITL, MATTHEW
To: X-CELEPRINT LIMITED
Reel/Frame 036479/0576 →
Assignment of Assignor's Interest
Dec 14, 2015
From: BOWER, CHRISTOPHER; MEITL, MATTHEW; COK, RONALD S.
To: X-CELEPRINT LIMITED
Reel/Frame 037283/0887 →
Assignment of Assignor's Interest
Nov 17, 2017
From: NEVIN, WILLIAM ANDREW; KITTLER, GABRIEL
To: X-FAB SEMICONDUCTOR FOUNDRIES AG
Reel/Frame 044163/0462 →
Assignment of Assignor's Interest
Nov 17, 2017
From: BOWER, CHRISTOPHER ANDREW; COK, RONALD S.
To: X-CELEPRINT LIMITED
Reel/Frame 044163/0392 →
Assignment of Assignor's Interest
Feb 15, 2019
From: GOMEZ, DAVID; BOWER, CHRISTOPHER ANDREW; GUL, RAJA FAZAN; TRINDADE, ANTÓNIO JOSÉ MARQUES
To: X-CELEPRINT LIMITED
Reel/Frame 048346/0967 →
Assignment of Assignor's Interest
Mar 25, 2019
From: BOWER, CHRISTOPHER; MEITL, MATTHEW; COK, RONALD S.
To: X-CELEPRINT LIMITED
Reel/Frame 048687/0015 →
Assignment of Assignor's Interest
Jun 25, 2019
From: BOWER, CHRISTOPHER ANDREW; MEITL, MATTHEW ALEXANDER; COK, RONALD S.; BONAFEDE, SALVATORE
To: X-CELEPRINT LIMITED
Reel/Frame 049575/0929 →
Change of Name
May 11, 2020
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 052631/0800 →
Assignment of Assignor's Interest
Jan 22, 2021
From: BOWER, CHRISTOPHER ANDREW; MEITL, MATTHEW ALEXANDER
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 055002/0321 →
Assignment of Assignor's Interest
Feb 5, 2021
From: MEITL, MATTHEW ALEXANDER; COK, RONALD S.
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 055162/0289 →
Change of Name
May 4, 2021
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 056131/0138 →
Assignment of Assignor's Interest
May 4, 2021
From: GOMEZ, DAVID; BOWER, CHRISTOPHER ANDREW; GUL, RAJA FAZAN; TRINDADE, ANTÓNIO JOSÉ MARQUES
To: X-CELEPRINT LIMITED
Reel/Frame 056131/0101 →
Change of Name
Aug 23, 2021
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 057251/0954 →
Assignment of Assignor's Interest
Aug 23, 2021
From: MOORE, TANYA YVETTE; COK, RONALD S.; GOMEZ, DAVID
To: X-CELEPRINT LIMITED
Reel/Frame 057251/0945 →
Change of Name
Sep 15, 2021
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 057490/0707 →
Change of Name
Sep 15, 2021
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 057494/0631 →
Change of Name
Sep 16, 2021
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 057501/0765 →
Change of Name
Sep 16, 2021
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 057500/0658 →
Change of Name
Sep 16, 2021
From: X-CELEPRINT LIMITED
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 057499/0314 →
Assignment of Assignor's Interest
May 11, 2022
From: MEITL, MATTHEW ALEXANDER; COK, RONALD S.; BOWER, CHRISTOPHER ANDREW
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 059893/0675 →
Assignment of Assignor's Interest
May 11, 2022
From: JAIN, NIKHIL; COK, RONALD S.; BOWER, CHRISTOPHER ALEXANDER
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 059893/0393 →
Assignment of Assignor's Interest
Oct 7, 2022
From: BOWER, CHRISTOPHER ANDREW; MEITL, MATTHEW ALEXANDER
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 061344/0834 →
Assignment of Assignor's Interest
Nov 1, 2022
From: BOWER, CHRISTOPHER ANDREW; MEITL, MATTHEW ALEXANDER; JAIN, NIKHIL; COK, RONALD S.
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 061618/0441 →
Assignment of Assignor's Interest
Apr 19, 2023
From: COK, RONALD S.; BOWER, CHRISTOPHER ANDREW; MEITL, MATTHEW ALEXANDER
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 063379/0118 →
Assignment of Assignor's Interest
Nov 12, 2024
From: KNAUSZ, IMRE; COK, RONALD S.
To: X DISPLAY COMPANY TECHNOLOGY LIMITED
Reel/Frame 069234/0375 →